WO2013161996A3 - 透明導電性インク及び透明導電パターン形成方法 - Google Patents
透明導電性インク及び透明導電パターン形成方法 Download PDFInfo
- Publication number
- WO2013161996A3 WO2013161996A3 PCT/JP2013/062387 JP2013062387W WO2013161996A3 WO 2013161996 A3 WO2013161996 A3 WO 2013161996A3 JP 2013062387 W JP2013062387 W JP 2013062387W WO 2013161996 A3 WO2013161996 A3 WO 2013161996A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transparent conductive
- pattern
- conductive ink
- conductive pattern
- ink
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 239000002071 nanotube Substances 0.000 abstract 2
- 239000002070 nanowire Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002612 dispersion medium Substances 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nanotechnology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13782608.7A EP2843667B1 (en) | 2012-04-26 | 2013-04-26 | Transparent conductive ink, and method for producing transparent conductive pattern |
US14/396,853 US9236162B2 (en) | 2012-04-26 | 2013-04-26 | Transparent conductive ink and transparent conductive pattern forming method |
KR1020147029936A KR101570398B1 (ko) | 2012-04-26 | 2013-04-26 | 투명 도전성 잉크 및 투명 도전 패턴형성방법 |
CN201380021843.3A CN104303238B (zh) | 2012-04-26 | 2013-04-26 | 透明导电性墨以及透明导电图案形成方法 |
JP2014512709A JP5706998B2 (ja) | 2012-04-26 | 2013-04-26 | 透明導電性インク及び透明導電パターン形成方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012101049 | 2012-04-26 | ||
JP2012-101049 | 2012-04-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013161996A2 WO2013161996A2 (ja) | 2013-10-31 |
WO2013161996A3 true WO2013161996A3 (ja) | 2013-12-19 |
Family
ID=49483993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/062387 WO2013161996A2 (ja) | 2012-04-26 | 2013-04-26 | 透明導電性インク及び透明導電パターン形成方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9236162B2 (ja) |
EP (1) | EP2843667B1 (ja) |
JP (1) | JP5706998B2 (ja) |
KR (1) | KR101570398B1 (ja) |
CN (1) | CN104303238B (ja) |
TW (1) | TWI499647B (ja) |
WO (1) | WO2013161996A2 (ja) |
Families Citing this family (35)
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US10470301B2 (en) * | 2013-04-26 | 2019-11-05 | Showa Denko K.K. | Method for manufacturing conductive pattern and conductive pattern formed substrate |
DE102013104577B3 (de) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat |
CN105658745B (zh) * | 2013-10-31 | 2019-06-04 | 昭和电工株式会社 | 薄膜印刷用导电性组合物及薄膜导电图案形成方法 |
WO2015109464A1 (en) * | 2014-01-22 | 2015-07-30 | Nuovo Film Inc. | Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures |
JP6581756B2 (ja) * | 2014-02-18 | 2019-09-25 | 大倉工業株式会社 | 透明導電フィルムの製造方法 |
KR20160138156A (ko) | 2014-03-25 | 2016-12-02 | 스트라타시스 엘티디. | 교차 계층 패턴의 제조 방법 및 시스템 |
KR101595895B1 (ko) * | 2014-08-11 | 2016-02-19 | 주식회사 엔앤비 | 광소결로 접합된 은 나노와이어를 포함하는 투명전극용 필름, 광소결을 이용한 은 나노와이어 접합용 분산액 및 은 나노와이어의 접합 방법 |
CN107077910B (zh) * | 2014-10-28 | 2020-03-31 | 奈越股份有限公司 | 透明导体及其制造方法 |
JP6514487B2 (ja) * | 2014-10-31 | 2019-05-15 | 国立大学法人大阪大学 | シートの製造方法 |
US20160164171A1 (en) * | 2014-12-04 | 2016-06-09 | Chung-Ping Lai | Wireless antenna made from binder-free conductive carbon inks |
US20180254549A1 (en) * | 2014-12-04 | 2018-09-06 | Chung-Ping Lai | Wireless antenna made from binder-free conductive carbon-based inks |
JP6407014B2 (ja) * | 2014-12-24 | 2018-10-17 | 昭和電工株式会社 | 薄膜印刷用導電性組成物及び薄膜導電パターン形成方法 |
EP3274172B1 (en) * | 2015-03-25 | 2023-04-26 | Stratasys Ltd. | Method and system for in situ sintering of conductive ink |
KR102555869B1 (ko) * | 2015-08-06 | 2023-07-13 | 삼성전자주식회사 | 도전체 및 그 제조 방법 |
KR20170108612A (ko) * | 2016-03-18 | 2017-09-27 | 한국과학기술원 | 빛을 이용한 박막 제조방법 |
WO2017191776A1 (ja) * | 2016-05-02 | 2017-11-09 | デクセリアルズ株式会社 | 異方性導電フィルムの製造方法、及び異方性導電フィルム |
JP6889020B2 (ja) * | 2016-05-02 | 2021-06-18 | デクセリアルズ株式会社 | 異方性導電フィルムの製造方法、及び異方性導電フィルム |
US10862062B2 (en) | 2016-05-23 | 2020-12-08 | Konica Minolta Laboratory U.S.A., Inc. | Method of forming transparent correlated metal electrode |
KR102188996B1 (ko) * | 2016-05-31 | 2020-12-09 | 쇼와 덴코 가부시키가이샤 | 투명 도전 패턴의 형성 방법 |
CN109074919B (zh) * | 2016-05-31 | 2021-04-30 | 昭和电工株式会社 | 透明导电图案的形成方法 |
CN109923622B (zh) * | 2016-12-01 | 2020-06-19 | 昭和电工株式会社 | 透明导电基板和其制造方法 |
KR102486614B1 (ko) * | 2016-12-13 | 2023-01-09 | 메르크 파텐트 게엠베하 | 유기 기능성 재료의 제형 |
CN109564803B (zh) * | 2017-01-16 | 2020-03-06 | 昭和电工株式会社 | 透明导电成膜及透明导电图案的制造方法 |
US20200039007A1 (en) * | 2017-02-23 | 2020-02-06 | Osaka University | Bonding member, method for producing bonding member and method for producing bonding structure |
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US10954396B2 (en) | 2017-10-13 | 2021-03-23 | Unitika Ltd. | Paste containing nickel nanowires |
TW202022063A (zh) * | 2018-09-13 | 2020-06-16 | 日商昭和電工股份有限公司 | 導電性墨及碳配線基板 |
EP3912439B1 (en) * | 2019-02-14 | 2024-04-03 | Orbotech Ltd. | A method and apparatus for preparing a pcb product having highly dense conductors |
CN110204963A (zh) * | 2019-06-24 | 2019-09-06 | 南昌和创优材电子科技有限公司 | 透明导电油墨、其制备方法及应用 |
CN110272663A (zh) * | 2019-06-24 | 2019-09-24 | 南昌和创优材电子科技有限公司 | 透明导电薄膜及其制备方法 |
CN111249765B (zh) * | 2020-02-25 | 2021-04-06 | 中国科学院化学研究所 | 一种去除碳材料中金属离子的加压流体提取系统和方法 |
CN111416058B (zh) * | 2020-04-03 | 2024-04-19 | 苏州星烁纳米科技有限公司 | 一种导电薄膜、显示装置和显示装置的制作方法 |
CN111446382B (zh) * | 2020-04-03 | 2023-05-09 | 苏州星烁纳米科技有限公司 | 一种电致发光器件及其制备方法、显示装置 |
KR102461794B1 (ko) * | 2020-08-13 | 2022-11-02 | 한국과학기술연구원 | 은 나노와이어 메쉬 전극 및 이의 제조방법 |
CN111883286A (zh) * | 2020-08-25 | 2020-11-03 | 深圳先进电子材料国际创新研究院 | 一种透明导电膜的制备方法及透明导电膜 |
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2013
- 2013-04-26 CN CN201380021843.3A patent/CN104303238B/zh active Active
- 2013-04-26 JP JP2014512709A patent/JP5706998B2/ja active Active
- 2013-04-26 WO PCT/JP2013/062387 patent/WO2013161996A2/ja active Application Filing
- 2013-04-26 EP EP13782608.7A patent/EP2843667B1/en active Active
- 2013-04-26 KR KR1020147029936A patent/KR101570398B1/ko active IP Right Grant
- 2013-04-26 US US14/396,853 patent/US9236162B2/en active Active
- 2013-04-26 TW TW102115035A patent/TWI499647B/zh active
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Also Published As
Publication number | Publication date |
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CN104303238B (zh) | 2016-11-09 |
WO2013161996A2 (ja) | 2013-10-31 |
EP2843667B1 (en) | 2017-09-06 |
KR20150004355A (ko) | 2015-01-12 |
JP5706998B2 (ja) | 2015-04-22 |
TW201410801A (zh) | 2014-03-16 |
CN104303238A (zh) | 2015-01-21 |
JPWO2013161996A1 (ja) | 2015-12-24 |
KR101570398B1 (ko) | 2015-11-19 |
EP2843667A2 (en) | 2015-03-04 |
EP2843667A4 (en) | 2015-10-21 |
US20150056382A1 (en) | 2015-02-26 |
TWI499647B (zh) | 2015-09-11 |
US9236162B2 (en) | 2016-01-12 |
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