CA2588343C - Electrical, plating and catalytic uses of metal nanomaterial compositions - Google Patents

Electrical, plating and catalytic uses of metal nanomaterial compositions Download PDF

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Publication number
CA2588343C
CA2588343C CA2588343A CA2588343A CA2588343C CA 2588343 C CA2588343 C CA 2588343C CA 2588343 A CA2588343 A CA 2588343A CA 2588343 A CA2588343 A CA 2588343A CA 2588343 C CA2588343 C CA 2588343C
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CA
Canada
Prior art keywords
substrate
film
silver
pulsed
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA2588343A
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English (en)
French (fr)
Other versions
CA2588343A1 (en
Inventor
Kurt A. Schroder
Steve Mccool
Dennis W. Hamill
Dennis Eugene Wilson
Wayne Furlan
Kevin C. Walter
Darrin L. Willauer
Karl Matthew Martin
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NCC Nano LLC
Original Assignee
NCC Nano LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCC Nano LLC filed Critical NCC Nano LLC
Publication of CA2588343A1 publication Critical patent/CA2588343A1/en
Application granted granted Critical
Publication of CA2588343C publication Critical patent/CA2588343C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL-COMBUSTION ENGINES
    • F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
    • F01N3/08—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
    • F01N3/10—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
    • F01N3/18—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control
    • F01N3/20—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by methods of operation; Control specially adapted for catalytic conversion
    • F01N3/2006—Periodically heating or cooling catalytic reactors, e.g. at cold starting or overheating
    • F01N3/2013—Periodically heating or cooling catalytic reactors, e.g. at cold starting or overheating using electric or magnetic heating means
    • F01N3/202—Periodically heating or cooling catalytic reactors, e.g. at cold starting or overheating using electric or magnetic heating means using microwaves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/20—Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J35/00—Catalysts, in general, characterised by their form or physical properties
    • B01J35/40—Catalysts, in general, characterised by their form or physical properties characterised by dimensions, e.g. grain size
    • B01J35/45—Nanoparticles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23C—METHODS OR APPARATUS FOR COMBUSTION USING FLUID FUEL OR SOLID FUEL SUSPENDED IN  A CARRIER GAS OR AIR 
    • F23C13/00—Apparatus in which combustion takes place in the presence of catalytic material
    • F23C13/08—Apparatus in which combustion takes place in the presence of catalytic material characterised by the catalytic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2208/00—Processes carried out in the presence of solid particles; Reactors therefor
    • B01J2208/02—Processes carried out in the presence of solid particles; Reactors therefor with stationary particles
    • B01J2208/023—Details
    • B01J2208/024—Particulate material
    • B01J2208/026—Particulate material comprising nanocatalysts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J35/00—Catalysts, in general, characterised by their form or physical properties
    • B01J35/30—Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
    • B01J35/39—Photocatalytic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
    • B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
    • B01J37/341—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of electric or magnetic fields, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J38/00—Regeneration or reactivation of catalysts, in general
    • B01J38/02—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL-COMBUSTION ENGINES
    • F01N2510/00—Surface coverings
    • F01N2510/06—Surface coverings for exhaust purification, e.g. catalytic reaction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23C—METHODS OR APPARATUS FOR COMBUSTION USING FLUID FUEL OR SOLID FUEL SUSPENDED IN  A CARRIER GAS OR AIR 
    • F23C2900/00—Special features of, or arrangements for combustion apparatus using fluid fuels or solid fuels suspended in air; Combustion processes therefor
    • F23C2900/03001—Miniaturized combustion devices using fluid fuels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/12—Improving ICE efficiencies

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Catalysts (AREA)
  • Exhaust Gas Treatment By Means Of Catalyst (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Carbon And Carbon Compounds (AREA)
CA2588343A 2004-11-24 2005-11-23 Electrical, plating and catalytic uses of metal nanomaterial compositions Expired - Lifetime CA2588343C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US63098804P 2004-11-24 2004-11-24
US60/630,988 2004-11-24
US66824005P 2005-04-04 2005-04-04
US60/668,240 2005-04-04
PCT/US2005/042895 WO2006071419A2 (en) 2004-11-24 2005-11-23 Electrical, plating and catalytic uses of metal nanomaterial compositions

Publications (2)

Publication Number Publication Date
CA2588343A1 CA2588343A1 (en) 2006-07-06
CA2588343C true CA2588343C (en) 2011-11-08

Family

ID=36615366

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2588343A Expired - Lifetime CA2588343C (en) 2004-11-24 2005-11-23 Electrical, plating and catalytic uses of metal nanomaterial compositions

Country Status (8)

Country Link
US (2) US7820097B2 (enExample)
EP (2) EP2913722A1 (enExample)
JP (8) JP5408878B2 (enExample)
KR (2) KR101500929B1 (enExample)
CN (2) CN101443483B (enExample)
AU (1) AU2005322477A1 (enExample)
CA (1) CA2588343C (enExample)
WO (1) WO2006071419A2 (enExample)

Families Citing this family (124)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5408878B2 (ja) * 2004-11-24 2014-02-05 エヌシーシー ナノ， エルエルシー ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
US8945686B2 (en) * 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
ATE388826T1 (de) * 2005-12-22 2008-03-15 Tapematic Spa Ein gerät zum trocknen durch strahlung
US7812726B2 (en) 2006-08-07 2010-10-12 Pliant Corporation Tamper event detection films, systems and methods
US20090014423A1 (en) * 2007-07-10 2009-01-15 Xuegeng Li Concentric flow-through plasma reactor and methods therefor
DE102007014501A1 (de) * 2007-03-27 2008-10-02 Robert Bosch Gmbh Verfahren zur Herstellung einer elektrisch leitfähigen Bahn auf einem Kunststoffbauteil
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US10537029B2 (en) * 2007-05-24 2020-01-14 Ncc Nano, Llc Method for reducing thin films on low temperature substrates
US8968438B2 (en) * 2007-07-10 2015-03-03 Innovalight, Inc. Methods and apparatus for the in situ collection of nucleated particles
US8471170B2 (en) 2007-07-10 2013-06-25 Innovalight, Inc. Methods and apparatus for the production of group IV nanoparticles in a flow-through plasma reactor
US20090053878A1 (en) * 2007-08-21 2009-02-26 Maxim Kelman Method for fabrication of semiconductor thin films using flash lamp processing
US8530000B2 (en) 2007-09-19 2013-09-10 Micron Technology, Inc. Methods of forming charge-trapping regions
US7780345B2 (en) 2007-12-19 2010-08-24 Motorola, Inc. Method and apparatus for a temperature sensor for measuring peak temperatures
US7888169B2 (en) * 2007-12-26 2011-02-15 Organicid, Inc. Organic semiconductor device and method of manufacturing the same
US8988756B2 (en) * 2008-01-31 2015-03-24 Ajjer, Llc Conductive busbars and sealants for chromogenic devices
TWI401205B (zh) * 2008-01-31 2013-07-11 Ind Tech Res Inst 利用光熱效應製作應用基板的方法
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) * 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US20090286383A1 (en) * 2008-05-15 2009-11-19 Applied Nanotech Holdings, Inc. Treatment of whiskers
US20100000762A1 (en) * 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
US8410712B2 (en) * 2008-07-09 2013-04-02 Ncc Nano, Llc Method and apparatus for curing thin films on low-temperature substrates at high speeds
EP2168775A1 (en) 2008-09-29 2010-03-31 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A device and a method for curing patterns of a substance at a surface of a foil
JP5922929B2 (ja) * 2008-10-17 2016-05-24 エヌシーシー ナノ， エルエルシー 低温基板上の薄膜を還元する方法
WO2010053923A1 (en) * 2008-11-07 2010-05-14 The Regents Of The University Of California Core-shell nanocatalyst for high temperature reactions
US7843303B2 (en) * 2008-12-08 2010-11-30 Alpha And Omega Semiconductor Incorporated Multilayer inductor
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
CN101634321B (zh) * 2009-07-31 2012-02-01 湖南大学 一种继电器在液压气动装置中的组合控制方法
CN101625939B (zh) * 2009-07-31 2012-05-23 湖南大学 一种继电器的控制方法
EP2317831A1 (en) 2009-10-30 2011-05-04 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for curing a substance comprising a metal complex
EP2346308A1 (en) 2010-01-14 2011-07-20 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Apparatus and method for treating a substance at a substrate
US10000411B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductivity and low emissivity coating technology
US10000965B2 (en) 2010-01-16 2018-06-19 Cardinal Cg Company Insulating glass unit transparent conductive coating technology
US10060180B2 (en) 2010-01-16 2018-08-28 Cardinal Cg Company Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology
US20110256383A1 (en) * 2010-04-01 2011-10-20 Bayer Materialscience Ag Polymer material comprising a polymer and silver nanoparticles dispersed herein
US8907258B2 (en) * 2010-04-08 2014-12-09 Ncc Nano, Llc Apparatus for providing transient thermal profile processing on a moving substrate
ES2819216T3 (es) * 2010-04-08 2021-04-15 Ncc Nano Llc Aparato para curar películas finas sobre un sustrato en movimiento
US8911823B2 (en) * 2010-05-03 2014-12-16 Pen Inc. Mechanical sintering of nanoparticle inks and powders
JP2013544951A (ja) * 2010-07-21 2013-12-19 ゼノン・コーポレーション 焼結の間の迷光の低減
DE102011106799A1 (de) * 2010-08-04 2012-02-09 Heidelberger Druckmaschinen Aktiengesellschaft Verfahren zum Wiederbebildern einer abgedruckten Druckform
US8468680B2 (en) 2010-08-24 2013-06-25 Roche Diagnostics Operations, Inc. Biosensor test member and method for making the same
US20120094035A1 (en) * 2010-10-18 2012-04-19 Chung Shan Institute Of Science And Technology, Armaments Bureau, M.N.D. Method for preparing plastic particles coated with metal
KR101297084B1 (ko) * 2011-02-23 2013-08-19 한국전기연구원 투명 전도성 필름，투명 전도성 필름의 제조 장치，및 투명 전도성 필름의 제조 방법
WO2012124647A1 (ja) * 2011-03-14 2012-09-20 コニカミノルタホールディングス株式会社 有機電子デバイス用面状電極の製造方法
CN103597547B (zh) 2011-03-29 2016-12-21 太阳化学公司 含有蜡触变胶的可高纵横比丝网印刷的厚膜糊剂组合物
US10150230B2 (en) * 2011-04-08 2018-12-11 Ncc Nano, Llc Method for drying thin films in an energy efficient manner
US9779874B2 (en) * 2011-07-08 2017-10-03 Kemet Electronics Corporation Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials
US9256773B2 (en) 2011-07-27 2016-02-09 Féinics Amatech Teoranta Capacitive coupling of an RFID tag with a touch screen device acting as a reader
GB201113919D0 (en) * 2011-08-12 2011-09-28 Intrinsiq Materials Ltd High resolution printing
US20130043221A1 (en) * 2011-08-16 2013-02-21 Xenon Corporation Sintering Process and Apparatus
CN104024351B (zh) * 2011-09-06 2016-11-16 汉高知识产权控股有限责任公司 导电金属和方法
TWI481326B (zh) 2011-11-24 2015-04-11 Showa Denko Kk A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating
TW201339279A (zh) 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
ES2485308T3 (es) * 2011-12-21 2014-08-13 Agfa-Gevaert Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un aditivo de sinterización
JP2013135089A (ja) * 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP5880100B2 (ja) * 2012-02-10 2016-03-08 コニカミノルタ株式会社 透明電極の製造方法
US8716053B2 (en) 2012-02-16 2014-05-06 E I Du Pont De Nemours And Company Moisture barrier for photovoltaic cells
US20130218241A1 (en) 2012-02-16 2013-08-22 Nanohmics, Inc. Membrane-Supported, Thermoelectric Compositions
DE102012203166A1 (de) 2012-02-29 2013-08-29 Von Ardenne Anlagentechnik Gmbh Verfahren zum Herstellen elektrisch leitfähiger Strukturen
DE102012101729A1 (de) * 2012-03-01 2013-09-05 Institut für Energie- und Umwelttechnik e.V. "Chemical Looping" - Verbrennungsverfahren
JP5179677B1 (ja) * 2012-03-14 2013-04-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 太陽電池セルの製造方法
WO2013142552A1 (en) 2012-03-21 2013-09-26 Bayer Materialscience Ag Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
JP5849834B2 (ja) * 2012-04-09 2016-02-03 コニカミノルタ株式会社 透明電極、透明電極の製造方法、及び該透明電極を用いた有機電子素子
KR20150002811A (ko) 2012-04-12 2015-01-07 바이엘 머티리얼사이언스 아게 개선된 성능의 eap 트랜스듀서
FR2990055B1 (fr) * 2012-04-30 2014-12-26 Total Sa Matrice de depot d'au moins un fluide conducteur sur un substrat, ainsi que dispositif comprenant cette matrice et procede de depot
GB2516570A (en) * 2012-05-18 2015-01-28 Unipixel Displays Inc Forming conductive patterns using ink comprising metal nanoparticles and nanowires
WO2013182896A1 (en) * 2012-06-05 2013-12-12 Showa Denko K.K. Substrate film and sintering method
WO2013192143A1 (en) 2012-06-18 2013-12-27 Bayer Intellectual Property Gmbh Stretch frame for stretching process
DE102012105765A1 (de) 2012-06-19 2013-12-19 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer dreidimensionalen Leiterbahnstruktur sowie eine nach diesem Verfahren hergestellte Leiterbahnstruktur
JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
TW201419315A (zh) 2012-07-09 2014-05-16 Applied Nanotech Holdings Inc 微米尺寸銅粒子的光燒結法
US20150228371A1 (en) * 2012-07-30 2015-08-13 National Institute Of Advanced Industrial Science And Techmology Method for producing electrically conductive thin film, and electrically conductive thin film produced by said method
JP5983173B2 (ja) * 2012-08-14 2016-08-31 コニカミノルタ株式会社 透明電極の製造方法および有機電子素子の製造方法
US9954159B2 (en) 2012-08-16 2018-04-24 Parker-Hannifin Corporation Electrical interconnect terminals for rolled dielectric elastomer transducers
US9034417B2 (en) * 2012-08-20 2015-05-19 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film conductor compositions
US20140054065A1 (en) 2012-08-21 2014-02-27 Abner D. Joseph Electrical circuit trace manufacturing for electro-chemical sensors
JP2014067617A (ja) * 2012-09-26 2014-04-17 Fujifilm Corp 導電膜の製造方法および導電膜形成用組成物
JP6093136B2 (ja) * 2012-09-26 2017-03-08 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
US9050775B2 (en) * 2012-10-12 2015-06-09 Nano And Advanced Materials Institute Limited Methods of fabricating transparent and nanomaterial-based conductive film
CN104823248B (zh) * 2012-12-07 2017-05-17 富士胶片株式会社 导电膜的制造方法
JP6295025B2 (ja) * 2012-12-25 2018-03-14 昭和電工株式会社 導電パターン形成方法及び光焼成用インク
KR102292668B1 (ko) 2013-03-29 2021-08-24 다이요 홀딩스 가부시키가이샤 광 소성용 열가소성 수지 필름 기재, 이를 사용한 도전 회로 기판 및 그의 제조 방법
EP2991083B1 (en) * 2013-04-26 2021-06-09 Showa Denko K.K. Method for manufacturing electroconductive pattern and electroconductive pattern-formed substrate
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
CN103350228B (zh) * 2013-07-05 2015-01-07 北京科技大学 一种辐照凝胶注模成形方法
KR101535118B1 (ko) * 2013-10-31 2015-07-09 에이피시스템 주식회사 플렉서블 소자의 제조장치 및 방법
US20150189761A1 (en) * 2013-12-20 2015-07-02 Intrinsiq Materials, Inc. Method for depositing and curing nanoparticle-based ink
US20150201504A1 (en) * 2014-01-15 2015-07-16 Applied Nanotech, Inc. Copper particle composition
CN103745760B (zh) * 2014-01-16 2018-03-23 上海交通大学 基于全光激光等离子体加速器的γ射线源
WO2015136900A1 (ja) 2014-03-11 2015-09-17 国立大学法人山形大学 配線形成方法
US20150343564A1 (en) * 2014-06-03 2015-12-03 Siemens Energy, Inc. Method for selective laser processing using electrostatic powder deposition
CN105472887B (zh) * 2014-07-31 2018-12-21 比亚迪股份有限公司 一种3d导电线路的制作方法
KR101595895B1 (ko) * 2014-08-11 2016-02-19 주식회사 엔앤비 광소결로 접합된 은 나노와이어를 포함하는 투명전극용 필름, 광소결을 이용한 은 나노와이어 접합용 분산액 및 은 나노와이어의 접합 방법
FR3025936B1 (fr) * 2014-09-11 2016-12-02 Saint Gobain Procede de recuit par lampes flash
CN107210083A (zh) 2015-03-24 2017-09-26 昭和电工株式会社 导电图案形成用组合物和导电图案形成方法
KR20170014734A (ko) * 2015-07-31 2017-02-08 엘지전자 주식회사 태양 전지 및 이의 제조 방법
US9637648B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
US9637647B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
KR102683995B1 (ko) 2016-01-21 2024-07-12 브룩해븐 테크놀로지 그룹, 인크. 제2세대 초전도성 필라멘트와 케이블
US10294552B2 (en) * 2016-01-27 2019-05-21 GM Global Technology Operations LLC Rapidly solidified high-temperature aluminum iron silicon alloys
CN107175929B (zh) * 2016-03-10 2020-02-14 塞米西斯科株式会社 光烧结装置及利用其的导电膜形成方法
WO2017162020A1 (en) * 2016-03-22 2017-09-28 Jun Yang Method for solvent-free printing conductors on substrate
JP6994455B2 (ja) 2016-03-23 2022-01-14 昭和電工株式会社 導電性組成物用バインダー樹脂、これを含む導電パターン形成用組成物及びポリウレタン
EP3287499B1 (en) * 2016-08-26 2021-04-07 Agfa-Gevaert Nv A metallic nanoparticle dispersion
WO2018048979A1 (en) * 2016-09-07 2018-03-15 Brookhaven Technology Group, Inc. Reel-to-reel exfoliation and processing of second generation superconductors
EP3532223B1 (en) 2016-10-31 2024-05-08 Hewlett-Packard Development Company, L.P. Fusing of metallic particles
CN110382665A (zh) * 2017-05-15 2019-10-25 纳米及先进材料研发院有限公司 透明导电膜及其制备方法
EP3635754B1 (en) 2017-06-09 2024-11-27 Brookhaven Technology Group, Inc. Flexible multi-filament high temperature superconducting cable
US11152556B2 (en) 2017-07-29 2021-10-19 Nanohmics, Inc. Flexible and conformable thermoelectric compositions
WO2019212481A1 (en) 2018-04-30 2019-11-07 Hewlett-Packard Development Company, L.P. Additive manufacturing of metals
CN112351841B (zh) * 2018-05-04 2023-08-15 泽农公司 提供均匀光能的反射器
WO2019236100A1 (en) 2018-06-08 2019-12-12 Hewlett-Packard Development Company, L.P. Powder bed materials
US10493571B1 (en) * 2018-09-17 2019-12-03 Andrew Kostecki Fused overlay plate and method
CA3112050A1 (en) * 2018-09-17 2020-03-26 Andrew Kostecki Fused overlay plate and method
US11028012B2 (en) 2018-10-31 2021-06-08 Cardinal Cg Company Low solar heat gain coatings, laminated glass assemblies, and methods of producing same
EP3663095A1 (en) 2018-12-07 2020-06-10 Nanogate SE Inkjet printing on polycarbonate substrates
DE102019114806A1 (de) * 2019-06-03 2020-12-03 Value & Intellectual Properties Management Gmbh Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger
US11712746B1 (en) 2019-07-16 2023-08-01 Andrew Kostecki Wire feeder assembly
WO2021009377A1 (en) 2019-07-17 2021-01-21 Oerlikon Surface Solutions Ag, Pfäffikon Method for producing coatings with adapted coating properties
JP2020039002A (ja) * 2019-12-03 2020-03-12 スタンレー電気株式会社 電子デバイス
CN110757977B (zh) * 2019-12-06 2021-04-16 东莞市图创智能制造有限公司 打印固化方法及打印固化系统
CN111070877B (zh) * 2020-01-14 2020-09-04 深圳市至臻精密股份有限公司 一种智能金属材料表面印刷机
KR102692892B1 (ko) * 2021-01-29 2024-08-07 주식회사 아모그린텍 인쇄용 자성체 페이스트, 이를 이용한 보안용지 제조방법 및 이를 통해 제조된 보안용지

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3239373A (en) 1962-04-24 1966-03-08 Louis S Hoodwin Printed circuit process
US4151008A (en) * 1974-11-15 1979-04-24 Spire Corporation Method involving pulsed light processing of semiconductor devices
JPS5470052A (en) * 1977-11-16 1979-06-05 Ricoh Co Ltd Fixing device for electrostatic copier
US4159414A (en) 1978-04-25 1979-06-26 Massachusetts Institute Of Technology Method for forming electrically conductive paths
US4536807A (en) * 1982-11-01 1985-08-20 Victor Company Of Japan, Ltd. Display device for a magnetic tape recording and/or reproducing apparatus
US4496607A (en) * 1984-01-27 1985-01-29 W. R. Grace & Co. Laser process for producing electrically conductive surfaces on insulators
US4592929A (en) 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
US4526807A (en) 1984-04-27 1985-07-02 General Electric Company Method for deposition of elemental metals and metalloids on substrates
US4692387A (en) 1984-10-02 1987-09-08 E. I. Du Pont De Nemours And Company Sintering of metal interlayers within organic polymeric films
EP0177012B1 (en) * 1984-10-02 1992-03-25 E.I. Du Pont De Nemours And Company Sintering of metal interlayers within organic polymeric films
US4668533A (en) 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
JPS62124976A (ja) 1985-11-26 1987-06-06 Canon Inc 被記録材
JPH0730362B2 (ja) * 1987-03-20 1995-04-05 株式会社日立製作所 電子部品及びその製造方法
JPS63274590A (ja) * 1987-05-06 1988-11-11 Horizon Internatl Kk 浮出し印刷方法
JPH02257696A (ja) * 1989-03-29 1990-10-18 Nec Corp 配線基板の製造方法
US5014420A (en) 1989-07-11 1991-05-14 Xpc, Incorporated Fusing together metal particles using a high-frequency electromagnetic field
US5431967A (en) * 1989-09-05 1995-07-11 Board Of Regents, The University Of Texas System Selective laser sintering using nanocomposite materials
JPH03183760A (ja) * 1989-12-13 1991-08-09 Toyobo Co Ltd 酸化物透明導電膜の製造方法
US5782253A (en) 1991-12-24 1998-07-21 Mcdonnell Douglas Corporation System for removing a coating from a substrate
EP0696515B1 (en) 1994-07-11 1998-12-02 Agfa-Gevaert N.V. Ink jet printing process
DE4446439A1 (de) 1994-12-23 1996-06-27 Hoechst Ag Polymer-Dispersionen auf Basis eines kationischen Polyurethans
BR9611189A (pt) 1995-10-26 1999-12-28 Purepulse Technologies Inc Processos para desativar um vìrus e protozoários, descontaminar ar contendo microorganimos e água contendo protozoários formadores de cisto, e, sistema para desativar microorganismos em água .
US6652967B2 (en) * 2001-08-08 2003-11-25 Nanoproducts Corporation Nano-dispersed powders and methods for their manufacture
US5904961A (en) * 1997-01-24 1999-05-18 Eastman Kodak Company Method of depositing organic layers in organic light emitting devices
US5788754A (en) 1997-03-03 1998-08-04 Hewlett-Packard Company Ink-jet inks for improved image quality
JPH11288625A (ja) * 1998-03-31 1999-10-19 Kansai Shingijutsu Kenkyusho:Kk 導電性フィルムおよびその製造方法
JPH11340607A (ja) * 1998-05-21 1999-12-10 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
JP2001234356A (ja) 2000-02-24 2001-08-31 Seiko Epson Corp 膜の製造方法及びこれにより得られる膜
JP2001279533A (ja) * 2000-03-27 2001-10-10 Kuraray Co Ltd ゴム補強用繊維
EP1223615A1 (en) * 2001-01-10 2002-07-17 Eidgenössische Technische Hochschule Zürich A method for producing a structure using nanoparticles
US6610169B2 (en) * 2001-04-21 2003-08-26 Simplus Systems Corporation Semiconductor processing system and method
CN1193849C (zh) * 2001-07-05 2005-03-23 北京北方恒利科技发展有限公司 一种覆膜金属粉末材料的制备方法
AUPR725701A0 (en) * 2001-08-24 2001-09-20 Commonwealth Scientific And Industrial Research Organisation Functionalised nanoparticle concentrates
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
WO2003032084A2 (en) * 2001-10-05 2003-04-17 Superior Micropowders Llc Low viscosity precursor compositions and methods for the deposition of conductive electronic features
JP2004143571A (ja) * 2001-11-22 2004-05-20 Fuji Photo Film Co Ltd 導電パターン描画用基板およびインク、ならびに導電パターンの形成方法
US7507447B2 (en) 2002-02-26 2009-03-24 Fujifilm Corporation Transparent conductive film, method for producing same and method for forming pattern
JP4156254B2 (ja) * 2002-03-13 2008-09-24 大日本印刷株式会社 導電性シートの製造方法
WO2003096383A2 (en) * 2002-05-08 2003-11-20 Dana Corporation Cavity shapes for plasma-assisted processing
US6777639B2 (en) * 2002-06-12 2004-08-17 Nanotechnologies, Inc. Radial pulsed arc discharge gun for synthesizing nanopowders
JP4487471B2 (ja) * 2002-07-03 2010-06-23 コニカミノルタホールディングス株式会社 導電路又は電極の形成方法
JP2004172331A (ja) * 2002-11-20 2004-06-17 Ushio Inc 電気伝導性制御方法
US20040178391A1 (en) * 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
JP2004241294A (ja) * 2003-02-07 2004-08-26 Toppan Forms Co Ltd 金属ナノ微粒子を含む導電性塗工液、導電性金属箔
JP2004277832A (ja) * 2003-03-17 2004-10-07 Seiko Epson Corp 成膜方法および成膜装置
CN1202043C (zh) * 2003-05-29 2005-05-18 上海交通大学 大颗粒球形亚微米/纳米/纤维陶瓷复合粉体的制备方法
US7062848B2 (en) * 2003-09-18 2006-06-20 Hewlett-Packard Development Company, L.P. Printable compositions having anisometric nanostructures for use in printed electronics
JP2005142344A (ja) * 2003-11-06 2005-06-02 Toshiba Corp 半導体装置の製造方法および半導体製造装置
US7220936B2 (en) * 2004-07-30 2007-05-22 Ut-Battelle, Llc Pulse thermal processing of functional materials using directed plasma arc
US20080020133A1 (en) 2004-11-10 2008-01-24 Hiroyuki Kobori Method of Producing Metal Oxide Film
JP5408878B2 (ja) 2004-11-24 2014-02-05 エヌシーシー ナノ， エルエルシー ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
US8945686B2 (en) 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
US8410712B2 (en) * 2008-07-09 2013-04-02 Ncc Nano, Llc Method and apparatus for curing thin films on low-temperature substrates at high speeds

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