JP6772498B2 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JP6772498B2 JP6772498B2 JP2016054768A JP2016054768A JP6772498B2 JP 6772498 B2 JP6772498 B2 JP 6772498B2 JP 2016054768 A JP2016054768 A JP 2016054768A JP 2016054768 A JP2016054768 A JP 2016054768A JP 6772498 B2 JP6772498 B2 JP 6772498B2
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- Prior art keywords
- storage container
- contact portion
- contact
- hand
- convex portions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Description
前記容器の開口部を正面とした場合の左右の側面のそれぞれに、縦横に規則的に配列された複数の凸部が形成され、前記凸部は、作業者の手又は作業ロボットのハンドに対して接触する接触部分を構成するとともに、前記凸部の間は前記作業者の手又は作業ロボットのハンドに対して接触しない非接触部分を構成し、
一つの側面に形成された前記凸部の表面の面積の総和が、前記一つの側面の面積に対して40%以下とされている基板収納容器、又は、
内部に基板が収納される絶縁性及び箱形状の容器であって、
前記容器の開口部を正面とした場合の左右の側面のそれぞれに、当該側面から突出する把持部が形成され、
前記把持部の表面に、縦横に規則的に配列された複数の凸部が形成され、前記凸部は、作業者の手又は作業ロボットのハンドに対して接触する接触部分を構成するとともに、前記凸部の間は前記作業者の手又は作業ロボットのハンドに対して接触しない非接触部分を構成し、
一つの把持部の表面に形成された前記凸部の表面の面積の総和が、前記一つの把持部の表面の面積に対して40%以下とされている基板収納容器によって、上記課題を解決する。
図1は、本発明に係る基板収納容器の一実施の形態であるウェーハ収納容器1を示す斜視図である。本実施形態のウェーハ収納容器1は、半導体ウェーハの製造プロセスやその後の半導体デバイスの製造プロセスなど、たとえばウェーハの洗浄・乾燥・検査といった半導体ウェーハを取り扱う工程において、複数のウェーハを収納して搬送するための、いわゆるカセットケースである。本実施形態のウェーハ収納容器1は、図1に示すように、複数枚のウェーハWの収納が可能な容器本体11と、容器本体11内に設けられたウェーハを保持するためのラック12と、容器本体11の開口部11aに着脱自在に装着可能で、この開口部11aを開閉する蓋体(不図示)とを備える。
11…容器本体
11A…上面
11B…底面
11C…前面
11D…背面
11E,11F…側面
12…ラック
12a,12b…ウェーハ保持体
11a…開口部
13…接触部分
14…非接触部分
15…把持部
Claims (7)
- 内部に基板が収納される絶縁性及び箱形状の容器であって、
前記容器の開口部を正面とした場合の左右の側面のそれぞれに、縦横に規則的に配列された複数の凸部が形成され、前記凸部は、作業者の手又は作業ロボットのハンドに対して接触する接触部分を構成するとともに、前記凸部の間は前記作業者の手又は作業ロボットのハンドに対して接触しない非接触部分を構成し、
一つの側面に形成された前記凸部の表面の面積の総和が、前記一つの側面の面積に対して40%以下とされている基板収納容器。 - 前記凸部が前記一つの側面の全面にわたって形成されている請求項1に記載の基板収納容器。
- 内部に基板が収納される絶縁性及び箱形状の容器であって、
前記容器の開口部を正面とした場合の左右の側面のそれぞれに、当該側面から突出する把持部が形成され、
前記把持部の表面に、縦横に規則的に配列された複数の凸部が形成され、前記凸部は、作業者の手又は作業ロボットのハンドに対して接触する接触部分を構成するとともに、前記凸部の間は前記作業者の手又は作業ロボットのハンドに対して接触しない非接触部分を構成し、
一つの把持部の表面に形成された前記凸部の表面の面積の総和が、前記一つの把持部の表面の面積に対して40%以下とされている基板収納容器。 - 前記凸部が前記一つの把持部の表面の全面にわたって形成されている請求項3に記載の基板収納容器。
- 前記凸部の高さが揃っている請求項1〜4のいずれか一項に記載の基板収納容器。
- 前記左右の側面のそれぞれの表面抵抗値が、1×1011Ω以上である請求項1〜5のいずれか一項に記載の基板収納容器。
- 前記基板は、半導体ウェーハ、フォトマスク、ガラス基板及びハードディスクを含む請求項1〜6のいずれか一項に記載の基板収納容器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016054768A JP6772498B2 (ja) | 2016-03-18 | 2016-03-18 | 基板収納容器 |
CN201680083743.7A CN108886009B (zh) | 2016-03-18 | 2016-12-14 | 基板收纳容器 |
KR1020187018924A KR102235404B1 (ko) | 2016-03-18 | 2016-12-14 | 기판 수납 용기 |
PCT/JP2016/087177 WO2017158972A1 (ja) | 2016-03-18 | 2016-12-14 | 基板収納容器 |
US16/084,369 US11011400B2 (en) | 2016-03-18 | 2016-12-14 | Substrate-storing container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016054768A JP6772498B2 (ja) | 2016-03-18 | 2016-03-18 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017168765A JP2017168765A (ja) | 2017-09-21 |
JP6772498B2 true JP6772498B2 (ja) | 2020-10-21 |
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JP2016054768A Active JP6772498B2 (ja) | 2016-03-18 | 2016-03-18 | 基板収納容器 |
Country Status (5)
Country | Link |
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US (1) | US11011400B2 (ja) |
JP (1) | JP6772498B2 (ja) |
KR (1) | KR102235404B1 (ja) |
CN (1) | CN108886009B (ja) |
WO (1) | WO2017158972A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020027530A1 (ko) | 2018-08-02 | 2020-02-06 | 주식회사 정석케미칼 | 자기장 발생 방법과 자기장을 이용한 차선 감지 방법, 이를 이용한 자동차 |
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-
2016
- 2016-03-18 JP JP2016054768A patent/JP6772498B2/ja active Active
- 2016-12-14 KR KR1020187018924A patent/KR102235404B1/ko active IP Right Grant
- 2016-12-14 CN CN201680083743.7A patent/CN108886009B/zh active Active
- 2016-12-14 WO PCT/JP2016/087177 patent/WO2017158972A1/ja active Application Filing
- 2016-12-14 US US16/084,369 patent/US11011400B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017168765A (ja) | 2017-09-21 |
WO2017158972A1 (ja) | 2017-09-21 |
KR20180090329A (ko) | 2018-08-10 |
US11011400B2 (en) | 2021-05-18 |
KR102235404B1 (ko) | 2021-04-01 |
CN108886009B (zh) | 2023-07-07 |
US20190080946A1 (en) | 2019-03-14 |
CN108886009A (zh) | 2018-11-23 |
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