SG11201505757VA - A tray for a wafer with tape frame - Google Patents
A tray for a wafer with tape frameInfo
- Publication number
- SG11201505757VA SG11201505757VA SG11201505757VA SG11201505757VA SG11201505757VA SG 11201505757V A SG11201505757V A SG 11201505757VA SG 11201505757V A SG11201505757V A SG 11201505757VA SG 11201505757V A SG11201505757V A SG 11201505757VA SG 11201505757V A SG11201505757V A SG 11201505757VA
- Authority
- SG
- Singapore
- Prior art keywords
- tray
- wafer
- tape frame
- tape
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013023926 | 2013-02-11 | ||
| PCT/JP2014/052878 WO2014123216A1 (en) | 2013-02-11 | 2014-02-07 | Tray for tape-frame-fitted wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201505757VA true SG11201505757VA (en) | 2015-09-29 |
Family
ID=51299806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201505757VA SG11201505757VA (en) | 2013-02-11 | 2014-02-07 | A tray for a wafer with tape frame |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9666468B2 (en) |
| JP (1) | JP6282603B2 (en) |
| CN (1) | CN104995728B (en) |
| HK (1) | HK1213090A1 (en) |
| SG (1) | SG11201505757VA (en) |
| TW (1) | TWI622117B (en) |
| WO (1) | WO2014123216A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6433206B2 (en) * | 2014-09-03 | 2018-12-05 | アキレス株式会社 | Wafer tray with tape frame |
| TWI664130B (en) * | 2016-01-29 | 2019-07-01 | 旺矽科技股份有限公司 | Wafer cassette |
| JP6772498B2 (en) * | 2016-03-18 | 2020-10-21 | 株式会社Sumco | Board storage container |
| JP6990873B2 (en) * | 2017-03-31 | 2022-02-03 | アキレス株式会社 | Semiconductor wafer container |
| JP7330081B2 (en) * | 2019-12-03 | 2023-08-21 | 三菱電機株式会社 | Carrier spacer and semiconductor device manufacturing method |
| TWI735115B (en) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | A wafer storage cassette and a wafer carrier plate |
| CN115472539A (en) * | 2022-09-07 | 2022-12-13 | 苏州东昊塑胶五金有限公司 | Tray structure and rubber coating process thereof |
| CN117174629B (en) * | 2023-11-02 | 2024-04-19 | 南昌中微半导体设备有限公司 | Tray carrier and SMIF pod loading apparatus |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158437U (en) * | 1982-04-16 | 1983-10-22 | 昭和電工株式会社 | wafer container |
| JP2910684B2 (en) * | 1996-07-31 | 1999-06-23 | 日本電気株式会社 | Wafer container |
| JP2000077512A (en) * | 1998-08-27 | 2000-03-14 | Super Silicon Kenkyusho:Kk | Wafer housing case |
| JP4562930B2 (en) | 2001-02-16 | 2010-10-13 | アキレス株式会社 | Dicing wafer storage container |
| JP2003168731A (en) | 2001-12-03 | 2003-06-13 | M B K Micro Tec:Kk | Substrate tray, sheet for laying substrate tray, and substrate housing method |
| US7578392B2 (en) * | 2003-06-06 | 2009-08-25 | Convey Incorporated | Integrated circuit wafer packaging system and method |
| US6915906B2 (en) * | 2003-07-14 | 2005-07-12 | Peak Plastic & Metal Products (International) Limited | Wafer storage container with wafer positioning posts |
| US7131248B2 (en) * | 2003-07-14 | 2006-11-07 | Peak Plastic & Metal Products (Int'l) Limited | Wafer shipper with orientation control |
| US20050011056A1 (en) * | 2003-07-14 | 2005-01-20 | Pylant James D. | Bare die tray clip |
| JP4391479B2 (en) | 2003-11-06 | 2009-12-24 | シャープ株式会社 | Substrate transport tray |
| JP2005150177A (en) * | 2003-11-12 | 2005-06-09 | Nitto Denko Corp | Method and device for sticking adhesive tape on rear of semiconductor wafer |
| JP2005332868A (en) * | 2004-05-18 | 2005-12-02 | Tokyo Seimitsu Co Ltd | Work storing cassette |
| US7431162B2 (en) * | 2005-07-15 | 2008-10-07 | Illinois Tool Works Inc. | Shock absorbing horizontal transport wafer box |
| JP4903429B2 (en) * | 2005-12-05 | 2012-03-28 | ミライアル株式会社 | Loading tray and thin plate holding container |
| US20070187286A1 (en) * | 2006-02-16 | 2007-08-16 | Pylant James D | Wafer storage container and apparatus |
| JP4728840B2 (en) * | 2006-03-02 | 2011-07-20 | ミライアル株式会社 | Thin plate container |
| JP4947631B2 (en) * | 2006-07-19 | 2012-06-06 | ミライアル株式会社 | Wafer storage container with cushion sheet |
| WO2008013153A1 (en) * | 2006-07-25 | 2008-01-31 | Miraial Co., Ltd. | Wafer container provided with cushion sheet |
| JP4883627B2 (en) * | 2007-01-24 | 2012-02-22 | ミライアル株式会社 | Wafer storage container with cushion sheet |
| JP2011001106A (en) * | 2009-06-19 | 2011-01-06 | Panasonic Corp | Semiconductor wafer storage container |
-
2014
- 2014-02-07 SG SG11201505757VA patent/SG11201505757VA/en unknown
- 2014-02-07 CN CN201480008285.1A patent/CN104995728B/en active Active
- 2014-02-07 JP JP2014560815A patent/JP6282603B2/en active Active
- 2014-02-07 US US14/761,837 patent/US9666468B2/en active Active
- 2014-02-07 WO PCT/JP2014/052878 patent/WO2014123216A1/en active Application Filing
- 2014-02-10 TW TW103104191A patent/TWI622117B/en active
-
2016
- 2016-01-29 HK HK16101041.9A patent/HK1213090A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI622117B (en) | 2018-04-21 |
| JPWO2014123216A1 (en) | 2017-02-02 |
| US9666468B2 (en) | 2017-05-30 |
| JP6282603B2 (en) | 2018-02-21 |
| CN104995728B (en) | 2018-09-14 |
| HK1213090A1 (en) | 2016-06-24 |
| TW201440167A (en) | 2014-10-16 |
| CN104995728A (en) | 2015-10-21 |
| WO2014123216A1 (en) | 2014-08-14 |
| US20150380293A1 (en) | 2015-12-31 |
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