JP2011001106A - Semiconductor wafer storage container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a storage container for semiconductor wafers and a method for storing the wafers for preventing the breakage of the wafers, for handling the wafers with a plurality of thicknesses or with a curve using a storage method having the same specifications and for pressing evenly the whole face of the wafers.SOLUTION: This storage container for semiconductor wafers is provided with a plurality of stackable trays 2 and a laminated bag 10 sealing and covering the plurality of stacked trays. The bag is vacuum deaired to be used. The tray is provided with a tubular body whose top and bottom are open, a wall 14 dividing the inside of the body into top and bottom spaces and a ventilation hole 5 running through the body above the wall. A wafer placement part is formed by the wall and an air chamber 7 is formed by the space underneath the wall. The opening of the air chamber is sealed by an elastic sealing film 8 which seals the air chamber imperviously.

Description

  The present invention relates to a semiconductor wafer storage container used for transporting and storing semiconductor wafers.

  Conventionally, there has been proposed a semiconductor wafer storage container capable of storing a wafer that is more fragile and more easily broken than a silicon wafer such as a gallium arsenide wafer (see, for example, Patent Document 1).

  FIG. 17 is a cross-sectional view showing a state in which a semiconductor wafer 109 is stored in a conventional semiconductor wafer storage container 101. FIG. 18 is a cross-sectional view showing the positional relationship between the tray 102 and the semiconductor wafer 109 placed on the tray 102.

  The tray 102 includes a protruding portion 114 in which a certain range of the peripheral portion of the circular synthetic resin sheet is raised in a ring concentric with the sheet, and a wafer mounting portion 103 formed flat inside the protruding portion 114. The protrusion 114 has a trapezoidal shape with a hollow cross section, and the rising angle between the inner peripheral wall surface and the outer peripheral wall surface is expanded in a divergent shape. A semiconductor wafer 109 having upper and lower surfaces sandwiched between wafer protection sheets 115 is placed on the wafer placement unit 103.

  Two or more trays 102 on which the semiconductor wafers 109 are placed are stacked, and the stacked body is stored in the transport container 121 (see FIG. 17) via cushions 129 and 130. The transport container 121 includes a container main body 122, a lid 123 that covers the container main body 122, and a holder 124 that fixes the lid 123 to the container main body 122. The holder 124 has a U-shape in a side view, and is provided at a plurality of locations (for example, 2 to 4 locations) around the container body 122 and the lid body 123, and the container body 122 and the lid body. 123 is gripped integrally from above and below.

  The container main body 122 includes a circular bottom plate 125 and a holding member 126 having an arc shape in a top view standing on the left and right sides of the upper surface of the bottom plate 125 with a predetermined height. A plurality of trays 102 are stacked and stored inside both holding members 126.

  The lid 123 is provided with a circular lid plate 127 and a cylindrical side wall member 128 that is provided on the lower surface of the lid plate 127 so as to surround the left and right holding members 126 from outside and over the entire circumference. And have. The side wall member 128 is formed at substantially the same height as the holding member 126 of the container body 122.

  Next, a method for storing the semiconductor wafer 109 in the semiconductor wafer storage container 101 will be described with reference to FIGS. 19A to 19H. 19B and 19D are cross-sectional views taken along line HH in FIGS. 19A and 19C, respectively.

  First, as shown in FIGS. 19A and 19B, an empty container body 122 is prepared. Next, as shown in FIGS. 19C and 19D, a circular lower cushion material 129 is disposed on the upper surface of the bottom plate 125 as a buffer. To do. Thereafter, the tray 102 is accommodated between the holding members 126. Next, the semiconductor wafer 109 with the upper and lower surfaces sandwiched between the wafer protection sheets 115 is placed on the wafer placement portion 103 of the tray 102. Next, another tray 102 is placed on the tray 102 and the semiconductor wafer 109 is placed on the tray 102.

  This is repeated and a predetermined number of trays 102 are stacked as shown in FIG. 19E. Then, an empty tray 102 is disposed as a lid on the uppermost stage of the tray 102 in which the semiconductor wafers 109 are stored. Next, a circular upper cushion material 130 is disposed on the upper surface of the stacked uppermost empty tray 102, and then the entire tray 102 is covered with a lid 123. By covering the entire tray 102 with the lid 123, the cushion materials 129 and 130 are compressed. By applying the compressive force to the tray 102 at each stage, the tray 102 can be fixed and a semiconductor is externally provided. Vibration transmitted to the wafer 109 can be reduced. Further, since the protruding portion 114 of the tray 102 is fixed by being fitted on the back side of the protruding portion 114 of the upper tray 102, a space is generated in the wafer mounting portion 103, and the semiconductor wafer 109 is damaged due to weight or tightening force. Can be prevented.

  Next, as shown in FIG. 19F, the lid 123 is fixed to the container main body 122 by a plurality of fixtures 124. Next, as shown in FIG. 19G, the entire transport container 121 is covered with a laminate bag 110. Laminate bag 110 has an antistatic coating on the surface, and may be composed only of a resin or an aluminum foil sandwiched between resin layers. And the air in the lamination bag 110 is discharged | emitted with a pump. Then, while maintaining the state in which the air is discharged, as shown in FIG. 17, heat and pressure are applied to the opening of the laminate bag 110 to weld it (bag thermocompression bonding part 111). The lid 123 and the container main body 122 may be provided with vent holes to facilitate air discharge.

  According to this storage structure, the protrusion 114 of the lower tray 102 fits behind the protrusion 114 of the upper tray 102, and a predetermined space is created in the wafer mounting portion 103. The semiconductor wafer 109 is not burdened with weight. Therefore, damage to the semiconductor wafers 109 in each tray 102 can be prevented even when stacked in multiple stages.

JP 2005-191419 A

  Since the semiconductor wafer storage container 101 has a structure in which the protrusion 114 of the lower tray 102 is fitted on the back side of the protrusion 114 of the upper tray 102, the semiconductor wafer storage container 101 is attached to the wafer mounting portion 103 according to the thickness of the semiconductor wafer 109. The height of the resulting space cannot be adjusted. Therefore, it is necessary to increase or decrease the number of wafer protection sheets 115 filling the gap, and fix the semiconductor wafer 109 to the tray 102. If the number of wafer protection sheets 115 is too small, the semiconductor wafer 109 rotates and scratches the surface of the semiconductor wafer. Further, when the amount is too large, it contacts the upper tray 102 and excessively presses the semiconductor wafer 109, and the semiconductor wafer 109 may be broken. Further, the semiconductor wafer 109 that has been thinly shaved easily warps, and as shown in the region surrounded by the broken line in FIG. 20, a part of the outer peripheral portion of the semiconductor wafer 109 comes into contact with the upper tray 102, so that the warped portion is There is a problem that a force is applied from the upper tray 102 and the semiconductor wafer 109 is broken.

  The present invention has been made in view of the above problems, and can uniformly hold the entire surface of a semiconductor wafer. A plurality of thickness semiconductor wafers and warped semiconductor wafers can be accommodated by the same specification storage method, An object of the present invention is to provide a semiconductor wafer storage container and a storage method capable of preventing cracking of a semiconductor wafer.

  The first semiconductor wafer storage container of the present invention includes a plurality of stackable trays and a laminate bag that seals and covers the plurality of stacked trays, and the laminate bag is used after being evacuated. In order to solve the above-mentioned problem, the tray penetrates the main body portion above the partition wall, a cylindrical main body portion that is open at the top and bottom, a partition that divides the lumen of the main body portion into upper and lower spaces, and A wafer mounting portion is formed by the partition wall, a gas chamber is formed by a space below the partition wall, and the opening of the gas chamber is extendable to seal the gas chamber in a non-ventilated manner It is characterized by being sealed with a simple sealing film.

  The second semiconductor wafer storage container of the present invention includes a plurality of stackable trays and a laminate bag that seals and covers the plurality of stacked trays, and the laminate bag is used after being vacuum deaerated. It is done. In order to solve the above-mentioned problem, the tray penetrates the main body portion above the partition wall, a cylindrical main body portion that is open at the top and bottom, a partition that divides the lumen of the main body portion into upper and lower spaces, and A semiconductor having a vent hole, a wafer mounting portion is formed by the partition, a gas chamber is formed by a space below the partition, and the opening of the gas chamber seals the gas chamber in a non-ventilated manner The wafer is sealed by a dicing sheet on which the wafer is placed.

  The third semiconductor wafer storage container of the present invention includes a plurality of stackable trays and a laminate bag that seals and covers the plurality of stacked trays, and the laminate bag is used after being vacuum deaerated. It is done. In order to solve the above-mentioned problem, the tray penetrates the main body portion above the partition wall, a cylindrical main body portion that is open at the top and bottom, a partition that divides the lumen of the main body portion into upper and lower spaces, and A wafer mounting portion is formed by the partition, a gas chamber is formed by a space below the partition, and an opening of the gas chamber is a hermetically sealed film that seals the gas chamber in a non-ventilated manner And the sealing film seals the opening so as to bend.

  According to the first method for storing a semiconductor wafer of the present invention, the semiconductor wafer is mounted on each of the wafer mounting portions of the plurality of trays in the first semiconductor wafer storage container, and the semiconductor wafer is mounted. After stacking trays and covering the stacked trays with the laminate bag, the laminate bag is vacuum degassed.

  Further, in the second semiconductor wafer storage method of the present invention, the semiconductor wafer is placed on each of the plurality of dicing sheets, and the dicing sheet is attached to the opening of the tray in the second semiconductor wafer storage container. After laminating the trays and covering the laminated trays with the laminate bag, the laminate bag is vacuum degassed.

  In the third method for storing a semiconductor wafer according to the present invention, the semiconductor wafer is mounted on the wafer mounting portions of the plurality of trays in the third semiconductor wafer storage container, and the semiconductor wafer is mounted. After stacking trays and covering the stacked trays with the laminate bag, the laminate bag is vacuum degassed.

  According to the present invention, the semiconductor wafer is formed by the expandable sealing film using the tray having the gas chamber sealed at the bottom of the wafer mounting portion by the non-breathable stretchable sealing film. By holding the entire surface evenly, it is possible to cope with semiconductor wafers of multiple types and warped semiconductor wafers by the same specification storage method, and a semiconductor wafer storage container that can prevent cracking of the semiconductor wafer and A storage method can be provided.

Sectional drawing which shows the state which accommodated the semiconductor wafer in the semiconductor wafer storage container which concerns on Embodiment 1 of this invention. The bottom view which shows the structure of the tray of a semiconductor wafer storage container same as the above. Sectional drawing along the AA line of FIG. 2A Process sectional drawing which shows the process of accommodating a semiconductor wafer in the semiconductor wafer storage container which concerns on Embodiment 1. FIG. Sectional drawing which shows the next process of FIG. 3A Sectional drawing which shows the next process of FIG. 3B The bottom view which shows the bottom face of another tray of the semiconductor wafer storage container which concerns on Embodiment 1. FIG. Sectional drawing along the BB line of FIG. 4A Sectional drawing which shows the state which accommodated the semiconductor wafer in the semiconductor wafer storage container which concerns on Embodiment 2 of this invention. Process sectional drawing which shows the process of accommodating a semiconductor wafer in a semiconductor wafer storage container same as the above. Sectional drawing which shows the next process of FIG. 6A Sectional drawing which shows the next process of FIG. 6B The bottom view which shows the structure of the tray of the semiconductor wafer storage container which concerns on Embodiment 2. FIG. Sectional drawing along CC line of FIG. 7A The top view which shows the dicing sheet | seat with which the semiconductor wafer in Embodiment 2 is arrange | positioned Sectional drawing along the DD line of FIG. 8A The bottom view of the state which attached the dicing sheet to the tray in Embodiment 2. Sectional drawing along the EE line of FIG. 9A Sectional drawing which shows the state which accommodated the semiconductor wafer in the semiconductor wafer storage container which concerns on Embodiment 3 of this invention. The process top view which shows the process of accommodating a semiconductor wafer in a semiconductor wafer storage container same as the above. Sectional drawing along the FF line of FIG. 11A FIG. 11A is a top view showing the next process of FIG. 11A Sectional drawing along the FF line of FIG. 11C Sectional drawing which shows the next process of FIG. 11D Sectional drawing which shows the process following FIG. 11E. Sectional drawing which shows the next process of FIG. 11F Sectional drawing which shows the next process of FIG. 11G Sectional drawing which shows the state which accommodated the semiconductor wafer in the semiconductor wafer storage container which concerns on Embodiment 4 of this invention. Process sectional drawing which shows the process of accommodating a semiconductor wafer in a semiconductor wafer storage container same as the above. Sectional drawing which shows the next process of FIG. 13A Sectional drawing which shows the next process of FIG. 13B Sectional drawing which shows the next process of FIG. 13C Sectional drawing which shows the next process of FIG. 13D Sectional drawing which shows the process following FIG. 13E. Sectional drawing which shows the state which accommodated the semiconductor wafer in the semiconductor wafer storage container which concerns on Embodiment 5 of this invention. The bottom view which shows the structure of the tray of the semiconductor wafer storage container which concerns on Embodiment 5. FIG. Sectional drawing along the GG line of FIG. 15A Process sectional drawing which shows the process of accommodating a semiconductor wafer in a semiconductor wafer storage container same as the above. Sectional drawing which shows the next process of FIG. 16A Sectional drawing which shows the next process of FIG. 16B Sectional drawing which shows the state which accommodated the semiconductor wafer in the conventional semiconductor wafer storage container Sectional drawing which shows the arrangement | positioning relationship of the semiconductor wafer mounted in the tray of a semiconductor wafer storage container same as the above The process top view which shows the process of accommodating a semiconductor wafer in a semiconductor wafer storage container same as the above. Sectional drawing along the HH line of FIG. 19A FIG. 19A is a top view showing the next process of FIG. Sectional drawing along the HH line of FIG. 19C Sectional drawing which shows the next process of FIG. 19D Sectional drawing which shows the next process of FIG. 19E. Sectional drawing which shows the process following FIG. 19F. The expanded sectional view which shows the semiconductor wafer mounted in the tray of a semiconductor wafer storage container same as the above.

  The semiconductor wafer storage container and the semiconductor wafer storage method of the present invention can take the following various forms based on the above configuration and method. The 1st-3rd semiconductor wafer storage container of this invention WHEREIN: The laminated | stacked tray can be set as the structure provided with the transport container which stores through a shock absorbing material.

  In the first to third semiconductor wafer storage methods of the present invention, the stacked trays may be stored in a transport container via a cushioning material before the stacked trays are covered with the laminate bag.

  Hereinafter, embodiments of the semiconductor wafer storage container of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing a state in which a semiconductor wafer 9 is stored in a semiconductor wafer storage container 1a according to Embodiment 1 of the present invention. The trays 2 containing the semiconductor wafers 9 are stacked in multiple stages, and the stacked trays 2 are covered with a laminate bag 10. The laminate bag 10 in FIG. 1 is deaerated and the laminate bag 10 and the tray 2 are in contact with each other, but is drawn with a gap between the laminate bag 10 for easy viewing.

  2A is a bottom view showing the configuration of the tray 2, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A. The tray 2 is integrally formed using conductive plastics to which a conductive filler is added or conductive plastics subjected to polymer alloy treatment as a material. As the conductive filler to be added, carbon black, graphite carbon, graphite, carbon fiber, metal powder, metal fiber, metal oxide powder, metal-coated inorganic fine powder, organic fine powder and fiber can be used. Further, as the conductive treatment of the tray 2, a conductive or antistatic substance may be applied to the surface.

  The tray 2 has a cylindrical shape that is open at the top and bottom. The wafer placement unit 3 is formed by the partition wall 14 of the tray 2 and can place the semiconductor wafer 9 thereon. The outer peripheral wall 4 is a cylindrical portion above the partition wall of the tray 2 and is formed so that the tray 2 can be stacked in multiple stages. A plurality of vent holes 5 are formed in the outer peripheral wall 4 so as to penetrate the wafer mounting portion 3 side and the outside.

  On the back surface of the surface of the tray 2 on which the wafer mounting portion 3 is formed, a concave-shaped gas chamber 7 is formed which is formed by the partition wall 14 of the tray 2 and has an opening facing downward in FIG. 2B. An opening of the gas chamber 7 is provided with an air-permeable and expandable sealing film 8 so that the gas chamber 7 is hermetically sealed. The sealing film 8 is made of, for example, rubber or a resin film having conductivity or antistatic performance on the surface.

  As shown in FIG. 1, the laminate bag 10 has an antistatic coating on the surface, and may be composed only of a resin or an aluminum foil sandwiched between resin layers. The laminate bag 10 can be sealed by welding the bag thermocompression bonding part 11 when the semiconductor wafer is stored.

  With the configuration as described above, when the semiconductor wafer storage container 1a according to the present embodiment lowers the air pressure in the laminate bag 10 and seals the laminate bag 10, the pressure in the gas chamber 7 is greater than the pressure in the laminate bag 10. As shown in FIG. 1, the sealing film 8 extends to press the semiconductor wafer 9. For this reason, the semiconductor wafer 9 is fixed to the wafer mounting portion 3.

  Next, the process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1a will be described with reference to the drawings. 3A to 3C are process cross-sectional views illustrating a process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1a.

  First, as shown in FIG. 3A, the semiconductor wafer 9 is mounted on the wafer mounting portion 3 of the tray 2. Then, another tray 2 is stacked on the tray 2. Further, the semiconductor wafer 9 is mounted on the wafer mounting portion 3 of another tray 2. This is repeated and a predetermined number of trays 2 are stacked. The uppermost tray 2 of the stacked trays 2 is used as a lid without placing the semiconductor wafer 9 on the wafer placement unit 3. In this state, the semiconductor wafer 9 placed on the wafer placement unit 3 is not in contact with the sealing film 8 of the upper tray 2, and the wafer placement unit 3, the outer peripheral wall 4, and the sealed state are sealed. A mounting space 6 is formed by the film 8.

  Next, as shown in FIG. 3B, the entire stacked tray 2 is covered with a laminate bag 10. Next, as shown in FIG. 3C, the air in the laminate bag 10 is discharged by a pump (not shown). By discharging the air in the laminate bag 10, the air in the placement space 6 is discharged from the vent hole 5 and the pressure in the placement space 6 is lowered. For this reason, the gas in the sealed gas chamber 7 expands, and the expandable / contractible sealing film 8 expands toward the semiconductor wafer 9. Further, when evacuation is performed, the sealing film 8 uniformly covers the entire surface of the semiconductor wafer 9, and the semiconductor wafer 9 is fixed to the wafer mounting portion 3 of the tray 2.

  Finally, as shown in FIG. 1, the opening of the laminate bag 10 is welded by applying heat and pressure while maintaining the state in which air other than the gas chamber 7 is discharged (bag thermocompression bonding part 11). The laminate bag 10 is sealed.

  Through the steps as described above, the semiconductor wafer 9 can be fixed to the wafer mounting portion 3 and stored in the semiconductor wafer storage container 1a.

  Although the opening of the gas chamber 7 is formed on the entire bottom surface of the tray 2 and the sealing film 8 covers the entire bottom surface of the tray 2 in the present embodiment, the sealing film 8 is only part of the bottom surface of the tray 2. It can also be configured to cover. 4A is a bottom view showing the bottom surface of the tray 2b, and FIG. 4B is a cross-sectional view taken along the line BB of FIG. 4A. A plurality of openings are provided on the bottom surface of the tray 2b, and a sealing film 8b is disposed for each opening. Also in this configuration, when the pressure in the mounting space 6 one step below the stacked tray 2b is lowered, the sealing film 8b is expanded and the semiconductor wafer 9 on the wafer mounting portion 3 can be fixed.

(Embodiment 2)
In the first embodiment, the expandable sealing film 8 is attached to the tray 2, but the dicing sheet can be used as the sealing film for a state in which the semiconductor wafer is attached to the dicing sheet. The semiconductor wafer storage container according to the second embodiment of the present invention stores the semiconductor wafer that is attached to the dicing sheet.

  FIG. 5 is a cross-sectional view showing a state in which the semiconductor wafer 9 is stored in the semiconductor wafer storage container 1b according to Embodiment 2 of the present invention. 5 is degassed so that the laminate bag 10 and the tray 2 are in contact with each other, but is drawn with a gap between the laminate bag 10 for easy viewing.

  The semiconductor wafer storage container 1b according to the present embodiment has a configuration in which the sealing film 8 of the semiconductor wafer storage container 1a in the first embodiment is replaced with a dicing sheet 12, and the position where the semiconductor wafer 9 is placed is different. is there. In the semiconductor wafer storage container 1b according to the present embodiment, the same components as those of the semiconductor wafer storage container 1a according to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The dicing sheet 12 is made of a stretchable material, and is attached so that the gas chamber 7 is sealed in the opening of the tray 2 by a dicing ring 13. In order to increase the degree of sealing, an O-ring may be installed on a portion of the tray 2 that contacts the dicing ring 13 or a flexible resin may be attached. The semiconductor wafer 9 is disposed on the dicing sheet 12 so as to be stored in the gas chamber 7. The semiconductor wafer 9 may be in a state before dicing or divided into chips after dicing.

  With the configuration as described above, when the semiconductor wafer storage container 1b according to the present embodiment is sealed by lowering the atmospheric pressure in the laminate bag 10, the pressure in the gas chamber 7 becomes larger than the pressure in the laminate bag 10, As shown in FIG. 5, the dicing sheet 12 extends and is fixed to the wafer placement unit 3. That is, the semiconductor wafer 9 is fixed to the wafer mounting unit 3.

  Next, the process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1b will be described with reference to the drawings. 6A to 6C are diagrams illustrating a process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1b. First, the tray 2 is prepared. 7A is a bottom view of the tray 2 according to the present embodiment, and FIG. 7B is a cross-sectional view taken along the line CC in FIG. 7A.

  Next, the semiconductor wafer 9 is placed on the dicing sheet 12. FIG. 8A is a top view showing the dicing sheet 12 on which the semiconductor wafer 9 is arranged, and FIG. 8B is a cross-sectional view taken along the line DD in FIG. 8A. A dicing ring 13 is also disposed on the dicing sheet 12.

  Next, as shown in FIG. 6A, the dicing sheet 12 with the semiconductor wafer 9 attached is placed on the tray 2. Next, another tray 2 is placed on the dicing sheet 12 so that the dicing sheet 12 covers the opening of the gas chamber 7. This is repeated and a predetermined number of trays 2 are stacked. And the dicing sheet 12 is not affixed to the lowermost tray 2, and only the portion of the placement portion 2 is used.

  By alternately stacking the tray 2 and the dicing sheet 12, the gas chamber 7 of the tray 2 is sealed with the dicing sheet 12. 9A is a bottom view of the tray 2 with the dicing sheet 12 mounted thereon, and FIG. 9B is a cross-sectional view taken along line EE of FIG. 9A.

  Next, as shown in FIG. 6B, the entire stacked tray 2 is covered with a laminate bag 10. Next, as shown in FIG. 6C, the air in the laminate bag 10 is discharged by a pump (not shown). By discharging the air in the laminate bag 10, the air in the space other than the gas chamber 7 is discharged, and the pressure in the laminate bag 10 is lowered. For this reason, the air in the sealed gas chamber 7 expands, and the dicing sheet 12 expands in the direction of the wafer mounting portion 3 of the tray 2. Further, when the air is discharged, the dicing sheet 12 is brought into close contact with the wafer placement unit 3, whereby the semiconductor wafer 9 is fixed to the wafer placement unit 3 of the tray 2.

  Finally, as shown in FIG. 5, heat and pressure are applied to the opening of the laminated bag 10 while maintaining the state in which air other than the gas chamber 7 is discharged (bag thermocompression bonding part 11), The laminate bag 10 is sealed.

  As described above, the semiconductor wafer storage container 1b according to the present embodiment can fix the semiconductor wafer 9 to the wafer mounting portion 3 in a state where the semiconductor wafer 9 is attached to the dicing sheet 12.

(Embodiment 3)
FIG. 10 is a cross-sectional view showing a state in which the semiconductor wafer 9 is stored in the semiconductor wafer storage container 1c according to Embodiment 3 of the present invention. The laminate bag 10 in FIG. 10 is evacuated and the laminate bag 10 and the tray 2 are in contact with each other, but is drawn with a gap between the laminate bag 10 for easy viewing.

  The semiconductor wafer storage container 1 c according to the present embodiment has a configuration in which the stacked trays 2 in the semiconductor wafer storage container 1 a according to the first embodiment are fixed by a transport container 21. In the semiconductor wafer storage container 1c according to the present embodiment, the same components as those of the semiconductor wafer storage container 1a according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The transport container 21 includes a container body 22, a lid body 23, and a holder 24 for fixing the lid body 23 to the container body 22 while covering the stacked trays 2. 11A is a top view showing the configuration of the container body 22, and FIG. 11B is a cross-sectional view taken along the line FF in FIG. 11A. The container body 22 includes a circular bottom plate 25 and a holding member 26 having an arc shape in a top view, which is provided upright on the left and right sides of the upper surface of the bottom plate 25 with a predetermined height. The holding member 26 holds the tray 2 and positions the tray 2. The container body 22 is configured such that a plurality of trays 2 are stacked and housed inside these holding members 26.

  As shown in FIG. 10, the lid body 23 is provided with a circular lid plate 27 and a cylindrical shape provided on the lower surface of the lid plate 27 so as to surround the left and right holding members 26 from the outside over the entire circumference. Side wall member 28. The side wall member 28 is formed at substantially the same height as the holding member 26 of the container body 22.

  The container main body 22 and the lid body 23 are integrally molded using conductive plastics to which conductive fillers are added or conductive plastics subjected to polymer alloy treatment, respectively. As the conductive filler added, carbon black, graphite carbon, graphite, carbon fiber, metal powder, metal fiber, metal oxide powder, metal-coated inorganic fine powder, organic fine powder and fiber can be used.

  The lower cushion material 29 is made of polyethylene foam or the like, and is disposed between the bottom plate 25 and the tray 2 for buffering. The upper cushion material 30 is made of polyethylene foam or the like, and is disposed between the lid plate 27 and the tray 2 for buffering.

  The holder 24 is formed in a U-shape when viewed from the side, and is provided at a plurality of locations (for example, 2 to 4 locations) around the container body 22 and the lid body 23, and covers the container body 22. The body 23 is fixed.

  The container body 22, the lid body 23, the lower cushion material 29, and the upper cushion material 30 are all subjected to a conductive treatment as a countermeasure against static electricity.

  Next, a process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1c according to the embodiment of the present invention will be described with reference to the drawings. 11A to 11H are process diagrams showing a process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1c, FIG. 11C is a top view, and FIGS. 11D to 11H are taken along line FF in FIG. 11C. FIG.

  First, as shown in FIGS. 11A and 11B, an empty container body 22 is prepared. Next, as shown in FIG. 11C and FIG. 11D, a circular lower cushion material 29 is disposed for buffering in a region surrounded by the holding member 26 on the upper surface of the bottom plate 25. Next, the tray 2 is placed on the lower cushion material 29.

  Next, the semiconductor wafer 9 is mounted on the wafer mounting portion 3 of the tray 2. Further, as shown in FIG. 11E, another tray 2 is stacked on the tray 2. By repeating this, a predetermined number of trays 2 are stacked. Then, an empty tray 2 is arranged as a lid on the uppermost stage of the tray 2 in which the semiconductor wafers 9 are stored.

  Next, after the circular upper cushion material 30 is disposed on the upper surface of the stacked uppermost empty tray 2, the entire tray 2 is covered with the lid 23. The lid body 23 is disposed so that the side wall member 28 covers the outer circumferences of the holding members 26.

  Next, as shown in FIG. 11F, the lid body 23 is fixed to the container body 22 with a plurality of fixtures 24. Next, as shown in FIG. 11G, the entire transport container 21 is covered with a laminate bag 10.

  Then, as shown in FIG. 11H, the air in the laminate bag 10 is discharged by a pump. At this time, the air in the space other than the gas chamber 7 including the mounting space 6 is discharged, and the atmospheric pressure in the laminate bag 10 decreases. Therefore, the gas in the sealed gas chamber 7 expands, and the expandable / contractible sealing film 8 extends toward the semiconductor wafer 9. Further, when the air is discharged, the sealing film 8 covers the entire surface of the semiconductor wafer 9 evenly, and the semiconductor wafer 9 can be fixed to the wafer mounting portion 3 of the tray 2.

  Finally, as shown in FIG. 10, heat and pressure are applied to the opening of the laminate bag 10 while maintaining the state in which air other than the gas chamber 7 is discharged (bag thermocompression bonding portion 11). The lid body 23 and the container body 22 may be provided with vent holes to facilitate air discharge.

  As described above, the semiconductor wafer storage container 1 c according to the present embodiment can fix the semiconductor wafer 9 to the wafer mounting unit 3.

  Furthermore, by putting a tray in the transport container via a cushioning material, the impact from the outside of the semiconductor wafer storage container can be reduced, and the crack of the semiconductor wafer is stored in the semiconductor wafer storage container in the first embodiment. This can be further reduced than the case.

(Embodiment 4)
FIG. 12 is a sectional view showing a state in which the semiconductor wafer 9 is stored in the semiconductor wafer storage container 1d according to the fourth embodiment of the present invention. The laminate bag 10 in FIG. 12 is evacuated and the laminate bag 10 and the tray 2 are in contact with each other, but is drawn with a gap between the laminate bag 10 in consideration of legibility.

  The semiconductor wafer storage container 1 d according to the present embodiment has a configuration in which the stacked trays 2 in the semiconductor wafer storage container 1 b according to the second embodiment are fixed to the transport container 21. In the semiconductor wafer storage container 1d according to the present embodiment, the same components as those of the semiconductor wafer storage container 1b according to the second embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The transport container 21 is the same as the transport container in the third embodiment, and is used for fixing the lid body 23 to the container body 22 while covering the container body 22, the lid body 23, and the stacked trays 2. Holding tool 24. The lower cushion material 29 and the upper cushion material 30 are the same as the lower cushion material and the upper cushion material in the third embodiment, and are used for cushioning.

  Next, the process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1d will be described with reference to the drawings. 13A to 13F are cross-sectional views showing a process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1d. First, as shown in FIG. 13A, an empty container body 22 is prepared. Next, as shown in FIG. 13B, a circular lower cushion material 29 is disposed for buffering in a region surrounded by the holding member 26 on the upper surface of the bottom plate 25. Next, the tray 2 is placed on the lower cushion material 29.

  Next, a dicing sheet 12 having a semiconductor wafer 9 disposed thereon is placed on the outer peripheral wall 4 of the tray 2. A dicing ring 13 is also disposed on the dicing sheet 12. Next, as illustrated in FIG. 13C, another tray 2 is placed on the dicing sheet 12 so that the dicing sheet 12 covers the opening of the gas chamber 7. This is repeated and a predetermined number of trays 2 are stacked. By alternately stacking the tray 2 and the dicing sheet 12, the gas chamber 7 of the tray 2 is sealed with the dicing sheet 12. Note that the dicing sheet 12 is not attached to the lowermost tray 2 of the stacked trays 2, and only the portion of the wafer mounting portion 3 is used.

  Next, as shown in FIG. 13D, the lid body 23 is fixed to the container main body 22 with a plurality of fixtures 24. Next, as shown in FIG. 13E, the entire transport container 21 is covered with the laminate bag 10.

  And as shown to FIG. 13F, the air in the laminate bag 10 is discharged | emitted with a pump. At this time, the air in the space other than the gas chamber 7 is discharged, and the atmospheric pressure in the laminate bag 10 decreases. Therefore, the gas in the sealed gas chamber 7 expands, and the dicing sheet 12 extends toward the wafer placement unit 3. Further, when the air is discharged, the dicing sheet 12 comes into close contact with the wafer placement unit 3 and the semiconductor wafer 9 is fixed to the wafer placement unit 3 of the tray 2.

  Finally, as shown in FIG. 12, heat and pressure are applied to the opening of the laminate bag 10 while the air other than the gas chamber 7 is exhausted (bag thermocompression bonding part 11). .

  As described above, the semiconductor wafer storage container 1 d according to the present embodiment can fix the semiconductor wafer 9 to the wafer mounting unit 3.

  Furthermore, by putting a tray in the transport container via a cushioning material, the impact from the outside of the semiconductor wafer storage container can be mitigated, and the crack of the semiconductor wafer is stored in the semiconductor wafer storage container in the second embodiment. This can be further reduced than the case.

(Embodiment 5)
In Embodiment 1 of the present invention, the configuration in which the expandable sealing film 8 is attached to the tray 2 is shown. However, if the non-breathable sealing film is attached with slack, even the expandable sealing film can be expanded and contracted. Even with an impossible sealing film, the effect of fixing the semiconductor wafer can be obtained.

  Hereinafter, a storage form of the semiconductor wafer in the fifth embodiment of the present invention will be described with reference to the drawings. FIG. 14 is a cross-sectional view showing a state in which the semiconductor wafer 9 is stored in the semiconductor wafer storage container 1e according to the fifth embodiment of the present invention. 14 is deaerated so that the laminate bag 10 and the tray 2 are in contact with each other, but is drawn with a gap between the laminate bag 10 for easy viewing.

  The semiconductor wafer storage container 1e according to the present embodiment has a configuration in which the sealing film 8 of the semiconductor wafer storage container 1a according to the first embodiment is replaced with a sealing film 8c attached with a slack. Among the constituent elements of the semiconductor wafer storage container 1e according to the present embodiment, the same constituent elements as those of the semiconductor wafer storage container 1a according to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  FIG. 15A is a bottom view showing the tray 2 to which the sealing film 8c according to the fifth embodiment is attached. FIG. 15B is a cross-sectional view taken along line GG in FIG. 15A.

  The gas chamber 7 of the tray 2 is attached with an air-permeable sealing film 8c with a slack, and the gas chamber 7 is sealed. The sealing film 8c may be either a non-breathable stretchable sealing film or a non-stretchable sealing film, and they are made of, for example, conductive or rubber having an antistatic surface, or a resin film. Is done.

  Next, the process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1e will be described with reference to the drawings. 16A to 16C are process cross-sectional views illustrating a process of storing the semiconductor wafer 9 in the semiconductor wafer storage container 1e.

  First, as shown in FIG. 16A, the semiconductor wafer 9 is mounted on the wafer mounting portion 3 of the tray 2. Then, another tray 2 is stacked on the tray 2. Further, the semiconductor wafer 9 is placed on the wafer placing portion 3 of the tray 2. This is repeated and a predetermined number of trays 2 are stacked. The uppermost tray 2 of the stacked trays 2 is used as a lid without placing the semiconductor wafer 9 on the wafer placing portion 3.

  Next, as shown in FIG. 16B, the entire stacked tray 2 is covered with a laminate bag 10. Next, as shown in FIG. 16C, the air in the laminate bag 10 is discharged by a pump (not shown). By discharging the air in the laminate bag 10, the air in the mounting space 6 is discharged from the vent hole 5 and the atmospheric pressure is lowered. For this reason, the gas in the sealed gas chamber 7 expands, and the loose sealing film 8 c projects toward the semiconductor wafer 9. Further, when the air is discharged, the sealing film 8 c covers the entire surface of the semiconductor wafer 9 evenly, and the semiconductor wafer 9 is fixed to the wafer mounting portion 3 of the tray 2.

  Finally, as shown in FIG. 14, the opening of the laminate bag 10 is welded by applying heat and pressure while maintaining the state in which air other than the gas chamber 7 is discharged (bag thermocompression bonding part 11). The laminate bag 10 is sealed.

  As described above, the semiconductor wafer storage container 1 e according to the present embodiment can fix the semiconductor wafer 9 to the wafer mounting unit 3.

  In addition, the transport container 21 shown in the third embodiment of the present invention can be attached to the tray 2 to which the sealing film 8c having the deflection is attached.

  In the semiconductor wafer storage container shown in the first to fifth embodiments, a wafer protective sheet 11 may be inserted above or below the semiconductor wafer 9 or for further protection of the surface, There is no need to increase or decrease the number of sheets for adjusting the thickness.

  The present invention is capable of safely storing a large number of easily fragile semiconductor wafers, particularly fragile gallium arsenide wafers, in each tray, and is effective from damage caused by vibration and impact during transportation. And can be used as a semiconductor wafer storage container or the like.

DESCRIPTION OF SYMBOLS 1a-1e Semiconductor wafer storage container 2, 2b Tray 3 Wafer mounting part 4 Outer peripheral wall 5 Vent hole 6 Mounting space 7 Gas chamber 8, 8b, 8c Sealing film 9 Semiconductor wafer 10 Laminate bag 11 Bag thermocompression bonding part 12 Dicing sheet DESCRIPTION OF SYMBOLS 13 Dicing ring 14 Partition 21 Transport container 22 Container main body 23 Cover body 24 Fixing tool 25 Bottom plate 26 Holding member 27 Cover plate 28 Side wall member 29 Lower cushion material 30 Upper cushion material

Claims (12)

A plurality of stackable trays;
In a semiconductor wafer storage container that includes a laminate bag that seals and covers the plurality of stacked trays, and the laminate bag is used after being vacuum deaerated,
The tray has a cylindrical main body portion that is open at the top and bottom, a partition that partitions the lumen of the main body into upper and lower spaces, and a vent hole that penetrates the main body portion above the partition, A wafer mounting portion is formed by the partition, and a gas chamber is formed by a space below the partition,
An opening of the gas chamber is sealed with a stretchable sealing film that seals the gas chamber in a non-ventilated manner.   The semiconductor wafer storage container according to claim 1, further comprising a transport container for storing the stacked trays via a cushioning material. A semiconductor wafer is placed on each of the wafer placement portions of the plurality of trays according to claim 1,
Laminating a tray on which the semiconductor wafer is placed,
A method for storing a semiconductor wafer, wherein the laminated bag is vacuum degassed after the laminated tray is covered with the laminate bag according to claim 1. Before covering the laminated tray with the laminate bag,
4. The semiconductor wafer storage method according to claim 3, wherein the stacked trays are stored in a transport container via a cushioning material. A plurality of stackable trays;
In a semiconductor wafer storage container that includes a laminate bag that seals and covers the plurality of stacked trays, and the laminate bag is used after being vacuum deaerated,
The tray has a cylindrical main body portion that is open at the top and bottom, a partition that partitions the lumen of the main body into upper and lower spaces, and a vent hole that penetrates the main body portion above the partition, A wafer mounting portion is formed by the partition, and a gas chamber is formed by a space below the partition,
The opening of the gas chamber is sealed with a dicing sheet on which a semiconductor wafer is placed, which seals the gas chamber in a non-ventilated manner.   The semiconductor wafer storage container according to claim 5, further comprising a transport container for storing the stacked trays via a cushioning material. A semiconductor wafer is placed on each of the plurality of dicing sheets according to claim 5,
A dicing sheet is attached to the opening of the tray according to claim 5,
Laminating the trays,
A method for storing a semiconductor wafer, wherein the laminated bag is vacuum degassed after the laminated tray is covered with the laminate bag according to claim 5. Before covering the laminated tray with the laminate bag,
8. The method for storing semiconductor wafers according to claim 7, wherein the stacked trays are stored in a transport container via a cushioning material. A plurality of stackable trays;
In a semiconductor wafer storage container that includes a laminate bag that seals and covers the plurality of stacked trays, and the laminate bag is used after being vacuum deaerated,
The tray has a cylindrical main body portion that is open at the top and bottom, a partition that partitions the lumen of the main body into upper and lower spaces, and a vent hole that penetrates the main body portion above the partition, A wafer mounting portion is formed by the partition, and a gas chamber is formed by a space below the partition,
The opening of the gas chamber is sealed by a sealing film that hermetically seals the gas chamber,
The semiconductor wafer storage container, wherein the sealing film seals the opening so as to bend.   The semiconductor wafer storage container according to claim 9, further comprising a transport container for storing the stacked trays via a cushioning material. A semiconductor wafer is mounted on each of the wafer mounting portions of the plurality of trays according to claim 9,
Laminating a tray on which the semiconductor wafer is placed,
A method for housing a semiconductor wafer, wherein the laminated bag is vacuum degassed after the laminated tray is covered with the laminated bag according to claim 9. Before covering the laminated tray with the laminate bag,
The method for storing semiconductor wafers according to claim 11, wherein the stacked trays are stored in a transport container via a cushioning material.

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