JP6719437B2 - 無電解ニッケルめっき浴 - Google Patents

無電解ニッケルめっき浴 Download PDF

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Publication number
JP6719437B2
JP6719437B2 JP2017198416A JP2017198416A JP6719437B2 JP 6719437 B2 JP6719437 B2 JP 6719437B2 JP 2017198416 A JP2017198416 A JP 2017198416A JP 2017198416 A JP2017198416 A JP 2017198416A JP 6719437 B2 JP6719437 B2 JP 6719437B2
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JP
Japan
Prior art keywords
nickel plating
electroless nickel
group
plating bath
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017198416A
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English (en)
Japanese (ja)
Other versions
JP2018066060A (ja
Inventor
大督 橋本
大督 橋本
田邉　克久
克久 田邉
直志 西村
直志 西村
洋一 丸尾
洋一 丸尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C.UYEMURA&CO.,LTD.
Original Assignee
C.UYEMURA&CO.,LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JP2018066060A publication Critical patent/JP2018066060A/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
JP2017198416A 2016-10-14 2017-10-12 無電解ニッケルめっき浴 Active JP6719437B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016202365 2016-10-14
JP2016202365 2016-10-14

Publications (2)

Publication Number Publication Date
JP2018066060A JP2018066060A (ja) 2018-04-26
JP6719437B2 true JP6719437B2 (ja) 2020-07-08

Family

ID=61954473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017198416A Active JP6719437B2 (ja) 2016-10-14 2017-10-12 無電解ニッケルめっき浴

Country Status (4)

Country Link
JP (1) JP6719437B2 (ko)
KR (1) KR102311483B1 (ko)
CN (1) CN107955942B (ko)
TW (2) TWI807443B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113463140B (zh) * 2021-06-23 2022-08-05 灵宝金源朝辉铜业有限公司 镀镍溶液及高耐蚀双面镀厚镍压延铜箔工艺
CN114086160A (zh) * 2021-11-10 2022-02-25 江苏艾森半导体材料股份有限公司 一种铜表面化学镀钯活化液及其应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH533172A (de) * 1969-05-22 1973-01-31 Schering Ag Stabilisiertes reduktives Nickelbad
JPH0565656A (ja) * 1991-09-04 1993-03-19 Tanaka Kikinzoku Kogyo Kk ニツケル薄膜形成材料
JP3175527B2 (ja) 1995-03-30 2001-06-11 上村工業株式会社 無電解ニッケルめっき液及びめっき方法
JP2000129470A (ja) * 1998-10-22 2000-05-09 Meltex Inc パラジウムまたはパラジウム合金の剥離液
JP3800213B2 (ja) 2003-09-11 2006-07-26 奥野製薬工業株式会社 無電解ニッケルめっき液
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
JP5513784B2 (ja) * 2008-08-25 2014-06-04 日本エレクトロプレイテイング・エンジニヤース株式会社 硬質金系めっき液
US20120061698A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
JP5622678B2 (ja) 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
JP6347853B2 (ja) * 2014-04-10 2018-06-27 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ パラジウムの無電解めっきのためのめっき浴組成物及び方法
CN105887055B (zh) * 2014-12-01 2018-05-18 苏州市汉宜化学有限公司 一种对锌、铝杂质有高容忍度、长寿命的化学镀镍液
JP6025899B2 (ja) * 2015-03-30 2016-11-16 上村工業株式会社 無電解ニッケルめっき浴及びこれを用いた無電解めっき方法

Also Published As

Publication number Publication date
TWI807443B (zh) 2023-07-01
TW201816183A (zh) 2018-05-01
TW202208682A (zh) 2022-03-01
CN107955942B (zh) 2021-09-07
JP2018066060A (ja) 2018-04-26
CN107955942A (zh) 2018-04-24
KR20180041565A (ko) 2018-04-24
KR102311483B1 (ko) 2021-10-08

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