JP5513784B2 - 硬質金系めっき液 - Google Patents
硬質金系めっき液 Download PDFInfo
- Publication number
- JP5513784B2 JP5513784B2 JP2009147253A JP2009147253A JP5513784B2 JP 5513784 B2 JP5513784 B2 JP 5513784B2 JP 2009147253 A JP2009147253 A JP 2009147253A JP 2009147253 A JP2009147253 A JP 2009147253A JP 5513784 B2 JP5513784 B2 JP 5513784B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- gold
- acid
- plating solution
- hard gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
硫酸コバルト 3.6g/L(コバルト換算で0.76g/L)
クエン酸 150g/L
水酸化カリウム 20g/L
ジニトロ安息香酸 1g/L、5g/L
pH 4.4
液温 60℃
硫酸コバルト 3.6g/L(コバルト換算で0.76g/L)
クエン酸 150g/L
水酸化カリウム 20g/L
ジニトロ安息香酸 0.5g/L、1.0g/L、
1.5g/L、2.0g/L、
3.0g/L、5.0g/L
pH 4.4
液温 60℃
硫酸ニッケル 9g/L(ニッケル換算で2g/L)
クエン酸 150g/L
水酸化カリウム 20g/L
ジニトロ安息香酸 1g/L、5g/L
pH 4.4
液温 60℃
硫酸ニッケル 9g/L(ニッケル換算で2g/L)
クエン酸 150g/L
水酸化カリウム 20g/L
ジニトロ安息香酸 0.5g/L、1.0g/L、
1.5g/L、2.0g/L、
3.0g/L、5.0g/L
pH 4.4
液温 60℃
シアン化銀 10g/L(銀換算で8g/L)
シアン化カリウム 50g/L
ジニトロ安息香酸 1g/L、5g/L
pH 12
液温 20℃
シアン化銀 10g/L(銀換算で8g/L)
シアン化カリウム 50g/L
ジニトロ安息香酸 0.5g/L、1.0g/L、
1.5g/L、2.0g/L、
3.0g/L、5.0g/L
pH 12
液温 20℃
ポリエチレンアミン 10g/L
クエン酸 150g/L
ジニトロ安息香酸 1g/L、5g/L
pH 7
液温 65℃
ポリエチレンアミン 10g/L
クエン酸 150g/L
ジニトロ安息香酸 0.5g/L、1.0g/L、
1.5g/L、2.0g/L、
3.0g/L、5.0g/L
pH 7
液温 65℃
Claims (2)
- ニッケルめっきを施した下地表面に、めっき処理が必要な部分へ選択的に硬質金系めっき処理を行うための、可溶性金塩または金錯体、伝導塩、キレート化剤を含む硬質金系めっき液において、
可溶性金塩または金錯体は、シアン化第一金カリウム、シアン化第二金カリウム、シアン化金アンモニウムから選ばれるものであり、銀塩の金属塩またはポリエチレンイミンの有機添加剤を含み、ニトロ安息香酸、ジニトロ安息香酸、ニトロベンゼンスルホン酸のいずれかから選ばれた芳香族化合物を含有することを特徴とする硬質金系めっき液。 - ニッケルめっきを施した下地表面に、めっき処理が必要な部分へ選択的に硬質金系めっき処理を行うための、可溶性金塩または金錯体、伝導塩、キレート化剤を含む硬質金系めっき液において、
可溶性金塩または金錯体は、シアン化第一金カリウム、シアン化第二金カリウム、シアン化金アンモニウムから選ばれるものであり、ニッケル塩またはコバルト塩の金属塩を含み、ジニトロ安息香酸、ニトロベンゼンスルホン酸のいずれかから選ばれた芳香族化合物を含有することを特徴とする硬質金系めっき液。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009147253A JP5513784B2 (ja) | 2008-08-25 | 2009-06-22 | 硬質金系めっき液 |
PCT/JP2009/063931 WO2010024099A1 (ja) | 2008-08-25 | 2009-08-06 | 硬質金系めっき液 |
KR1020117004292A KR101275886B1 (ko) | 2008-08-25 | 2009-08-06 | 경질 금계 도금액 |
CN200980133847.4A CN102131962B (zh) | 2008-08-25 | 2009-08-06 | 硬质金系镀液 |
US13/055,038 US20110127168A1 (en) | 2008-08-25 | 2009-08-06 | Hard gold-based plating solution |
TW098127362A TWI495766B (zh) | 2008-08-25 | 2009-08-14 | 硬質金系電鍍液 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008215592 | 2008-08-25 | ||
JP2008215592 | 2008-08-25 | ||
JP2009147253A JP5513784B2 (ja) | 2008-08-25 | 2009-06-22 | 硬質金系めっき液 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014067301A Division JP2014139348A (ja) | 2008-08-25 | 2014-03-28 | 硬質金系めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010077527A JP2010077527A (ja) | 2010-04-08 |
JP5513784B2 true JP5513784B2 (ja) | 2014-06-04 |
Family
ID=41721271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009147253A Active JP5513784B2 (ja) | 2008-08-25 | 2009-06-22 | 硬質金系めっき液 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110127168A1 (ja) |
JP (1) | JP5513784B2 (ja) |
KR (1) | KR101275886B1 (ja) |
CN (1) | CN102131962B (ja) |
TW (1) | TWI495766B (ja) |
WO (1) | WO2010024099A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011021217A (ja) * | 2009-07-14 | 2011-02-03 | Ne Chemcat Corp | 電解硬質金めっき液及びこれを用いるめっき方法 |
JP5731802B2 (ja) * | 2010-11-25 | 2015-06-10 | ローム・アンド・ハース電子材料株式会社 | 金めっき液 |
DE102011114931B4 (de) * | 2011-10-06 | 2013-09-05 | Umicore Galvanotechnik Gmbh | Verfahren zur selektiveren, elektrolytischen Abscheidung von Gold oder einer Goldlegierung |
US20160145756A1 (en) * | 2014-11-21 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Environmentally friendly gold electroplating compositions and methods |
WO2016208340A1 (ja) | 2015-06-26 | 2016-12-29 | メタローテクノロジーズジャパン株式会社 | 電解硬質金めっき液用置換防止剤及びそれを含む電解硬質金めっき液 |
TWI575623B (zh) * | 2015-12-10 | 2017-03-21 | 南茂科技股份有限公司 | 凸塊結構與其製作方法 |
JP2017186627A (ja) * | 2016-04-07 | 2017-10-12 | 小島化学薬品株式会社 | 硬質金めっき溶液 |
TWI807443B (zh) * | 2016-10-14 | 2023-07-01 | 日商上村工業股份有限公司 | 無電解鍍鎳浴 |
CN109881223B (zh) * | 2019-03-11 | 2020-02-14 | 深圳市联合蓝海科技开发有限公司 | 无氰镀金液及其制备方法和应用 |
CN110894618A (zh) * | 2019-10-10 | 2020-03-20 | 深圳市金质金银珠宝检验研究中心有限公司 | 一种环境友好型表面改性电铸金溶液及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE570261A (ja) * | 1957-08-13 | |||
US3864222A (en) * | 1973-03-26 | 1975-02-04 | Technic | Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore |
CH615464A5 (en) * | 1976-06-01 | 1980-01-31 | Systemes Traitements Surfaces | Special compositions and particular additives for gold electrolysis baths and their use |
US4121982A (en) * | 1978-02-03 | 1978-10-24 | American Chemical & Refining Company Incorporated | Gold alloy plating bath and method |
GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
JPH0288788A (ja) * | 1988-09-26 | 1990-03-28 | Hitachi Ltd | 金めっき液 |
JPH02232378A (ja) * | 1989-03-06 | 1990-09-14 | Hitachi Ltd | 金めっき液 |
US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
JP3331261B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JP3331260B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JPH0959792A (ja) * | 1995-08-22 | 1997-03-04 | Shinko Electric Ind Co Ltd | 亜硫酸金めっき液 |
JP3124735B2 (ja) * | 1997-03-25 | 2001-01-15 | メルテックス株式会社 | 金めっき剥離液 |
JP3692454B2 (ja) * | 1997-08-08 | 2005-09-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 亜硫酸金めっき浴及びそのめっき浴の金塩補充液 |
JP4713290B2 (ja) * | 2005-09-30 | 2011-06-29 | エヌ・イーケムキャット株式会社 | 金バンプ又は金配線の形成方法 |
JP4945193B2 (ja) * | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 硬質金合金めっき液 |
KR101079554B1 (ko) * | 2008-06-11 | 2011-11-04 | 니혼 고쥰도가가쿠 가부시키가이샤 | 전해 금도금액 및 그것을 이용하여 얻어진 금피막 |
-
2009
- 2009-06-22 JP JP2009147253A patent/JP5513784B2/ja active Active
- 2009-08-06 US US13/055,038 patent/US20110127168A1/en not_active Abandoned
- 2009-08-06 CN CN200980133847.4A patent/CN102131962B/zh active Active
- 2009-08-06 WO PCT/JP2009/063931 patent/WO2010024099A1/ja active Application Filing
- 2009-08-06 KR KR1020117004292A patent/KR101275886B1/ko active IP Right Review Request
- 2009-08-14 TW TW098127362A patent/TWI495766B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI495766B (zh) | 2015-08-11 |
CN102131962A (zh) | 2011-07-20 |
WO2010024099A1 (ja) | 2010-03-04 |
US20110127168A1 (en) | 2011-06-02 |
KR20110034683A (ko) | 2011-04-05 |
CN102131962B (zh) | 2014-08-13 |
KR101275886B1 (ko) | 2013-06-17 |
JP2010077527A (ja) | 2010-04-08 |
TW201022483A (en) | 2010-06-16 |
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