JP6625058B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP6625058B2
JP6625058B2 JP2016552130A JP2016552130A JP6625058B2 JP 6625058 B2 JP6625058 B2 JP 6625058B2 JP 2016552130 A JP2016552130 A JP 2016552130A JP 2016552130 A JP2016552130 A JP 2016552130A JP 6625058 B2 JP6625058 B2 JP 6625058B2
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Prior art keywords
nozzle
substrate
gas
processing apparatus
concave portion
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JP2016552130A
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Japanese (ja)
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JPWO2016052642A1 (ja
Inventor
林　航之介
航之介 林
崇 大田垣
崇 大田垣
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016552130A 2014-09-30 2015-09-30 基板処理装置 Active JP6625058B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014201917 2014-09-30
JP2014201917 2014-09-30
PCT/JP2015/077790 WO2016052642A1 (ja) 2014-09-30 2015-09-30 基板処理装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2019125068A Division JP6761081B2 (ja) 2014-09-30 2019-07-04 基板処理装置
JP2019200987A Division JP6804622B2 (ja) 2014-09-30 2019-11-05 基板処理装置

Publications (2)

Publication Number Publication Date
JPWO2016052642A1 JPWO2016052642A1 (ja) 2017-07-13
JP6625058B2 true JP6625058B2 (ja) 2019-12-25

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ID=55630666

Family Applications (3)

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JP2016552130A Active JP6625058B2 (ja) 2014-09-30 2015-09-30 基板処理装置
JP2019125068A Active JP6761081B2 (ja) 2014-09-30 2019-07-04 基板処理装置
JP2019200987A Active JP6804622B2 (ja) 2014-09-30 2019-11-05 基板処理装置

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JP2019125068A Active JP6761081B2 (ja) 2014-09-30 2019-07-04 基板処理装置
JP2019200987A Active JP6804622B2 (ja) 2014-09-30 2019-11-05 基板処理装置

Country Status (6)

Country Link
US (3) US10607863B2 (enExample)
JP (3) JP6625058B2 (enExample)
KR (2) KR102391753B1 (enExample)
CN (2) CN106716605B (enExample)
TW (1) TWI585842B (enExample)
WO (1) WO2016052642A1 (enExample)

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Publication number Priority date Publication date Assignee Title
TWI622091B (zh) * 2015-06-18 2018-04-21 思可林集團股份有限公司 基板處理裝置
JP6779769B2 (ja) * 2016-12-07 2020-11-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6804325B2 (ja) * 2017-02-09 2020-12-23 東京エレクトロン株式会社 液処理装置
CN109056085A (zh) * 2018-08-01 2018-12-21 南通纺织丝绸产业技术研究院 熔喷喷嘴结构
JP7221657B2 (ja) * 2018-11-12 2023-02-14 キオクシア株式会社 基板処理装置
CN113409699B (zh) * 2020-03-16 2024-11-15 重庆康佳光电科技有限公司 一种便于修复的led显示器及其修复方法
JP7634405B2 (ja) * 2021-03-30 2025-02-21 芝浦メカトロニクス株式会社 基板処理装置
JP7556328B2 (ja) * 2021-05-21 2024-09-26 株式会社Sumco 半導体ウェーハの洗浄装置、半導体ウェーハの洗浄方法およびシリコンウェーハの製造方法
JP7584361B2 (ja) * 2021-06-17 2024-11-15 株式会社荏原製作所 基板洗浄装置、基板処理装置
KR102535766B1 (ko) * 2021-08-24 2023-05-26 (주)디바이스이엔지 백 노즐 어셈블리를 포함하는 기판 처리장치
EP4489064A1 (en) * 2023-07-03 2025-01-08 Unity Semiconductor Substrate dimension adapter
CN118925962B (zh) * 2024-10-12 2025-02-28 浙江丽水中欣晶圆半导体科技有限公司 一种用于洗净机上并具有彻底清洁的喷头
CN119650464A (zh) * 2024-12-02 2025-03-18 西安奕斯伟材料科技股份有限公司 硅片清洗系统

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KR100613919B1 (ko) 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
JP4111299B2 (ja) * 1999-07-26 2008-07-02 東京エレクトロン株式会社 基板洗浄具，基板洗浄装置及び基板洗浄方法
JP4327304B2 (ja) * 1999-07-27 2009-09-09 芝浦メカトロニクス株式会社 スピン処理装置
JP3535053B2 (ja) * 1999-09-09 2004-06-07 東京エレクトロン株式会社 現像処理装置及び現像処理方法
JP3802446B2 (ja) * 2002-05-15 2006-07-26 東邦化成株式会社 基板乾燥方法およびその装置
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JP4342343B2 (ja) * 2004-02-26 2009-10-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
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JP4627681B2 (ja) * 2005-04-20 2011-02-09 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
CN101165854A (zh) * 2006-10-19 2008-04-23 大日本网目版制造株式会社 基板处理装置和基板处理方法
JP4774004B2 (ja) 2007-03-30 2011-09-14 富士フイルム株式会社 ウエブ状被洗浄物の洗浄方法及び装置
JP5249915B2 (ja) * 2009-01-22 2013-07-31 東京エレクトロン株式会社 薬液処理装置および薬液処理方法
JP5156661B2 (ja) * 2009-02-12 2013-03-06 東京エレクトロン株式会社 液処理装置および液処理方法
JP2010219119A (ja) * 2009-03-13 2010-09-30 Shibaura Mechatronics Corp 基板処理装置および基板処理方法
JP3155351U (ja) * 2009-09-02 2009-11-12 東京エレクトロン株式会社 液処理装置
JP4927158B2 (ja) * 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
JP5440441B2 (ja) * 2010-08-12 2014-03-12 東京エレクトロン株式会社 液処理装置
JP5975563B2 (ja) * 2012-03-30 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6046417B2 (ja) * 2012-08-17 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および基板処理方法
JP6017262B2 (ja) * 2012-10-25 2016-10-26 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5951444B2 (ja) * 2012-10-25 2016-07-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6319941B2 (ja) * 2013-03-15 2018-05-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および吐出ヘッド待機方法

Also Published As

Publication number Publication date
JP6761081B2 (ja) 2020-09-23
CN113363187A (zh) 2021-09-07
JPWO2016052642A1 (ja) 2017-07-13
CN113363187B (zh) 2024-03-22
US20200135505A1 (en) 2020-04-30
TW201633392A (zh) 2016-09-16
KR20170063779A (ko) 2017-06-08
JP2020074395A (ja) 2020-05-14
CN106716605A (zh) 2017-05-24
KR102404961B1 (ko) 2022-06-07
TWI585842B (zh) 2017-06-01
CN106716605B (zh) 2021-06-08
JP2019186565A (ja) 2019-10-24
WO2016052642A1 (ja) 2016-04-07
US20170278729A1 (en) 2017-09-28
KR20220054469A (ko) 2022-05-02
KR102391753B1 (ko) 2022-04-28
US10607863B2 (en) 2020-03-31
US20200135504A1 (en) 2020-04-30
JP6804622B2 (ja) 2020-12-23

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