KR102391753B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

Info

Publication number
KR102391753B1
KR102391753B1 KR1020177010936A KR20177010936A KR102391753B1 KR 102391753 B1 KR102391753 B1 KR 102391753B1 KR 1020177010936 A KR1020177010936 A KR 1020177010936A KR 20177010936 A KR20177010936 A KR 20177010936A KR 102391753 B1 KR102391753 B1 KR 102391753B1
Authority
KR
South Korea
Prior art keywords
nozzle
removal
gas
substrate
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177010936A
Other languages
English (en)
Korean (ko)
Other versions
KR20170063779A (ko
Inventor
고노스케 하야시
다카시 오오타가키
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Priority to KR1020227013577A priority Critical patent/KR102404961B1/ko
Publication of KR20170063779A publication Critical patent/KR20170063779A/ko
Application granted granted Critical
Publication of KR102391753B1 publication Critical patent/KR102391753B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020177010936A 2014-09-30 2015-09-30 기판 처리 장치 Active KR102391753B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227013577A KR102404961B1 (ko) 2014-09-30 2015-09-30 기판 처리 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014201917 2014-09-30
JPJP-P-2014-201917 2014-09-30
PCT/JP2015/077790 WO2016052642A1 (ja) 2014-09-30 2015-09-30 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227013577A Division KR102404961B1 (ko) 2014-09-30 2015-09-30 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20170063779A KR20170063779A (ko) 2017-06-08
KR102391753B1 true KR102391753B1 (ko) 2022-04-28

Family

ID=55630666

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177010936A Active KR102391753B1 (ko) 2014-09-30 2015-09-30 기판 처리 장치
KR1020227013577A Active KR102404961B1 (ko) 2014-09-30 2015-09-30 기판 처리 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227013577A Active KR102404961B1 (ko) 2014-09-30 2015-09-30 기판 처리 장치

Country Status (6)

Country Link
US (3) US10607863B2 (enExample)
JP (3) JP6625058B2 (enExample)
KR (2) KR102391753B1 (enExample)
CN (2) CN106716605B (enExample)
TW (1) TWI585842B (enExample)
WO (1) WO2016052642A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622091B (zh) * 2015-06-18 2018-04-21 思可林集團股份有限公司 基板處理裝置
JP6779769B2 (ja) * 2016-12-07 2020-11-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6804325B2 (ja) * 2017-02-09 2020-12-23 東京エレクトロン株式会社 液処理装置
CN109056085A (zh) * 2018-08-01 2018-12-21 南通纺织丝绸产业技术研究院 熔喷喷嘴结构
JP7221657B2 (ja) * 2018-11-12 2023-02-14 キオクシア株式会社 基板処理装置
CN113409699B (zh) * 2020-03-16 2024-11-15 重庆康佳光电科技有限公司 一种便于修复的led显示器及其修复方法
JP7634405B2 (ja) * 2021-03-30 2025-02-21 芝浦メカトロニクス株式会社 基板処理装置
JP7556328B2 (ja) * 2021-05-21 2024-09-26 株式会社Sumco 半導体ウェーハの洗浄装置、半導体ウェーハの洗浄方法およびシリコンウェーハの製造方法
JP7584361B2 (ja) * 2021-06-17 2024-11-15 株式会社荏原製作所 基板洗浄装置、基板処理装置
KR102535766B1 (ko) * 2021-08-24 2023-05-26 (주)디바이스이엔지 백 노즐 어셈블리를 포함하는 기판 처리장치
EP4489064A1 (en) * 2023-07-03 2025-01-08 Unity Semiconductor Substrate dimension adapter
CN118925962B (zh) * 2024-10-12 2025-02-28 浙江丽水中欣晶圆半导体科技有限公司 一种用于洗净机上并具有彻底清洁的喷头
CN119650464A (zh) * 2024-12-02 2025-03-18 西安奕斯伟材料科技股份有限公司 硅片清洗系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085287A (ja) * 1999-09-09 2001-03-30 Tokyo Electron Ltd 現像処理装置及び現像処理方法
JP2005217138A (ja) * 2004-01-29 2005-08-11 Shibaura Mechatronics Corp スピン処理装置及びスピン処理方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61178187U (enExample) * 1985-04-26 1986-11-06
JPH07105336B2 (ja) * 1992-08-27 1995-11-13 日本電気株式会社 レジスト現像方法
US5960555A (en) * 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
KR100613919B1 (ko) 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
JP4111299B2 (ja) * 1999-07-26 2008-07-02 東京エレクトロン株式会社 基板洗浄具，基板洗浄装置及び基板洗浄方法
JP4327304B2 (ja) * 1999-07-27 2009-09-09 芝浦メカトロニクス株式会社 スピン処理装置
JP3802446B2 (ja) * 2002-05-15 2006-07-26 東邦化成株式会社 基板乾燥方法およびその装置
JP4342343B2 (ja) * 2004-02-26 2009-10-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP4627681B2 (ja) * 2005-04-20 2011-02-09 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
CN101165854A (zh) * 2006-10-19 2008-04-23 大日本网目版制造株式会社 基板处理装置和基板处理方法
JP4774004B2 (ja) 2007-03-30 2011-09-14 富士フイルム株式会社 ウエブ状被洗浄物の洗浄方法及び装置
JP5249915B2 (ja) * 2009-01-22 2013-07-31 東京エレクトロン株式会社 薬液処理装置および薬液処理方法
JP5156661B2 (ja) * 2009-02-12 2013-03-06 東京エレクトロン株式会社 液処理装置および液処理方法
JP2010219119A (ja) * 2009-03-13 2010-09-30 Shibaura Mechatronics Corp 基板処理装置および基板処理方法
JP3155351U (ja) * 2009-09-02 2009-11-12 東京エレクトロン株式会社 液処理装置
JP4927158B2 (ja) * 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
JP5440441B2 (ja) * 2010-08-12 2014-03-12 東京エレクトロン株式会社 液処理装置
JP5975563B2 (ja) * 2012-03-30 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6046417B2 (ja) * 2012-08-17 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および基板処理方法
JP6017262B2 (ja) * 2012-10-25 2016-10-26 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5951444B2 (ja) * 2012-10-25 2016-07-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6319941B2 (ja) * 2013-03-15 2018-05-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および吐出ヘッド待機方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085287A (ja) * 1999-09-09 2001-03-30 Tokyo Electron Ltd 現像処理装置及び現像処理方法
JP2005217138A (ja) * 2004-01-29 2005-08-11 Shibaura Mechatronics Corp スピン処理装置及びスピン処理方法

Also Published As

Publication number Publication date
JP6761081B2 (ja) 2020-09-23
CN113363187A (zh) 2021-09-07
JPWO2016052642A1 (ja) 2017-07-13
CN113363187B (zh) 2024-03-22
US20200135505A1 (en) 2020-04-30
TW201633392A (zh) 2016-09-16
KR20170063779A (ko) 2017-06-08
JP2020074395A (ja) 2020-05-14
CN106716605A (zh) 2017-05-24
KR102404961B1 (ko) 2022-06-07
TWI585842B (zh) 2017-06-01
CN106716605B (zh) 2021-06-08
JP6625058B2 (ja) 2019-12-25
JP2019186565A (ja) 2019-10-24
WO2016052642A1 (ja) 2016-04-07
US20170278729A1 (en) 2017-09-28
KR20220054469A (ko) 2022-05-02
US10607863B2 (en) 2020-03-31
US20200135504A1 (en) 2020-04-30
JP6804622B2 (ja) 2020-12-23

Similar Documents

Publication Publication Date Title
KR102391753B1 (ko) 기판 처리 장치
JP5284004B2 (ja) 基板の処理装置
TWI579909B (zh) 基板液體處理方法、基板液體處理裝置及記憶媒體
US5989632A (en) Coating solution applying method and apparatus
US9048269B2 (en) Substrate liquid treatment apparatus with lift pin plate
KR100365042B1 (ko) 도포액 도포방법 및 장치
JP4905232B2 (ja) ミスト発生装置およびこれを備えた浴室暖房装置
JP2018041855A (ja) 基板処理装置
JP5309907B2 (ja) レジスト塗布方法
JPH11297652A (ja) 基板処理装置
KR20220153666A (ko) 기판 처리 방법 및 기판 처리 장치
JP3206142U (ja) 試料乾燥装置
JP6465744B2 (ja) 基板処理装置および基板処理方法
JP4816554B2 (ja) ミスト発生装置およびこれを備えた浴室暖房装置
JP2005217138A (ja) スピン処理装置及びスピン処理方法
JP2011075139A (ja) ミスト発生装置
TWI819570B (zh) 塗佈處理方法及塗佈處理裝置
JP2006032637A (ja) 基板洗浄装置及び基板洗浄方法
KR200341814Y1 (ko) 스핀 컵
TW202224784A (zh) 基板處理裝置及基板處理方法
KR20050042427A (ko) 스핀 컵
JP2009291483A (ja) ミスト発生装置およびこれを備えた浴室空調装置
JP2000188276A (ja) 回転式基板処理装置
JPS59182527A (ja) 塗布装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20170421

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20200901

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20220103

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20220325

PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20220422

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220425

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220426

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20250310

Start annual number: 4

End annual number: 4