JP6625058B2 - 基板処理装置 - Google Patents
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- JP6625058B2 JP6625058B2 JP2016552130A JP2016552130A JP6625058B2 JP 6625058 B2 JP6625058 B2 JP 6625058B2 JP 2016552130 A JP2016552130 A JP 2016552130A JP 2016552130 A JP2016552130 A JP 2016552130A JP 6625058 B2 JP6625058 B2 JP 6625058B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
30 凹部
30a 排液孔
30b 斜面
32 ノズルヘッド
33 気体吐出ノズル
34 純水吐出ノズル
D1 除去部(第1のノズル)
D1a 孔
Claims (15)
- 基板の被処理面に対向し、前記被処理面に向けて開口した凹部を備えるノズルヘッドと、前記ノズルヘッドに設けられ、前記被処理面に処理液を供給する処理液供給ノズル、前記被処理面に向けて気体を吐出する気体吐出ノズル、とを有し、前記被処理面に対して、前記処理液による処理と、前記気体を用いた乾燥処理を行なう基板処理装置において、
前記凹部に存在する液滴を除去する除去部と、
前記ノズルヘッドの前記凹部の底部に設けられ、除去対象となる前記液滴を前記凹部の外へと排出する排液部と、
前記被処理面に対する前記処理液によるリンス処理が終了し、かつ前記気体を用いた乾燥処理が開始されるまでの期間に、前記気体吐出ノズルから、前記基板の被処理面までは届かない程度の流量の気体を吐出させる期間が存在するように前記気体吐出ノズルの吐出状態を制御する制御部と、
を備えることを特徴とする基板処理装置。 - 前記除去部は、前記ノズルヘッドの表面から突出させて形成される、前記被処理面に対して気体を吐出する第1のノズルであって、
前記第1のノズルは、前記気体の吐出方向に直交する方向であって前記凹部に向けて前記気体を吐出させることが可能な孔を備えていることを特徴とする請求項1に記載の基板処理装置。 - 前記ノズルヘッドと前記基板との間に配置され、前記被処理面に対して処理を行うべく前記ノズルヘッドに設けられる前記処理液供給ノズルから吐出される処理液を通過させる開口を具備するカバーと、を備え、
前記除去部は、前記ノズルヘッドに形成され、前記カバーに向けた気体の吐出口を備える第2のノズル、及び、前記カバーの前記開口に形成される返しであって、
前記第2のノズルは、吐出された前記気体を前記凹部へと導くべく、前記返しに向けて前記気体を吐出することを特徴とする請求項1に記載の基板処理装置。 - 前記除去部は、前記凹部の表面に配置され、前記凹部に存在する液滴を除去するべく前記底部に設けられている前記排液部に向けて除去材を吐出する吐出口であることを特徴とする請求項1に記載の基板処理装置。
- 前記吐出口は、前記凹部表面に環状に設けられていることを特徴とする請求項4に記載の基板処理装置。
- 前記吐出口は、前記凹部の上部に配置され、その配置場所と前記排液部との間を最短で結ぶ線に対して直交し、かつ、前記凹部表面に沿って前記除去材を吐出させることが可能な向きに設けられていることを特徴とする請求項4に記載の基板処理装置。
- 前記除去部は、前記ノズルヘッドを振動させる振動部であることを特徴とする請求項1に記載の基板処理装置。
- 前記除去部は、前記ノズルヘッドを加熱させる加熱部であることを特徴とする請求項1に記載の基板処理装置。
- 前記除去部は、前記排液部に接続され、前記凹部に存在する前記液滴を吸引する吸引部であることを特徴とする請求項1に記載の基板処理装置。
- 前記除去部は、前記凹部の上部から前記凹部の底部に設けられている前記排液部との間
を最短で結ぶように形成される溝であることを特徴とする請求項1に記載の基板処理装置。 - 前記除去部は、前記凹部の上部から前記凹部の底部に設けられている前記排液部に向けてらせん状に形成される溝であることを特徴とする請求項1に記載の基板処理装置。
- 前記らせん状に形成される溝の向きは、前記基板に対する処理が行われる際の前記基板の回転方向と同じ向きに形成されることを特徴とする請求項11に記載の基板処理装置。
- 前記除去部は、前記凹部の表面を荒らすことで除去対象となる前記液滴の滞留を回避する前記ノズルヘッドであることを特徴とする請求項1に記載の基板処理装置。
- 前記除去部は、前記凹部の表面に多孔質材を塗布することにより形成される前記ノズルヘッドであることを特徴とする請求項1に記載の基板処理装置。
- 前記除去部は、前記凹部を多孔質材で形成することにより構成される前記ノズルヘッドであることを特徴とする請求項1に記載の基板処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014201917 | 2014-09-30 | ||
JP2014201917 | 2014-09-30 | ||
PCT/JP2015/077790 WO2016052642A1 (ja) | 2014-09-30 | 2015-09-30 | 基板処理装置 |
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JP2019125068A Division JP6761081B2 (ja) | 2014-09-30 | 2019-07-04 | 基板処理装置 |
JP2019200987A Division JP6804622B2 (ja) | 2014-09-30 | 2019-11-05 | 基板処理装置 |
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JPWO2016052642A1 JPWO2016052642A1 (ja) | 2017-07-13 |
JP6625058B2 true JP6625058B2 (ja) | 2019-12-25 |
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JP2016552130A Active JP6625058B2 (ja) | 2014-09-30 | 2015-09-30 | 基板処理装置 |
JP2019125068A Active JP6761081B2 (ja) | 2014-09-30 | 2019-07-04 | 基板処理装置 |
JP2019200987A Active JP6804622B2 (ja) | 2014-09-30 | 2019-11-05 | 基板処理装置 |
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JP2019200987A Active JP6804622B2 (ja) | 2014-09-30 | 2019-11-05 | 基板処理装置 |
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US (3) | US10607863B2 (ja) |
JP (3) | JP6625058B2 (ja) |
KR (2) | KR102391753B1 (ja) |
CN (2) | CN106716605B (ja) |
TW (1) | TWI585842B (ja) |
WO (1) | WO2016052642A1 (ja) |
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TWI622091B (zh) * | 2015-06-18 | 2018-04-21 | 思可林集團股份有限公司 | 基板處理裝置 |
JP6779769B2 (ja) * | 2016-12-07 | 2020-11-04 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP6804325B2 (ja) * | 2017-02-09 | 2020-12-23 | 東京エレクトロン株式会社 | 液処理装置 |
CN109056085A (zh) * | 2018-08-01 | 2018-12-21 | 南通纺织丝绸产业技术研究院 | 熔喷喷嘴结构 |
JP7221657B2 (ja) * | 2018-11-12 | 2023-02-14 | キオクシア株式会社 | 基板処理装置 |
CN113409699A (zh) * | 2020-03-16 | 2021-09-17 | 重庆康佳光电技术研究院有限公司 | 一种便于修复的led显示器及其修复方法 |
JP2022155377A (ja) * | 2021-03-30 | 2022-10-13 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
JP2022179202A (ja) * | 2021-05-21 | 2022-12-02 | 株式会社Sumco | 半導体ウェーハの洗浄装置、半導体ウェーハの洗浄方法およびシリコンウェーハの製造方法 |
KR102535766B1 (ko) * | 2021-08-24 | 2023-05-26 | (주)디바이스이엔지 | 백 노즐 어셈블리를 포함하는 기판 처리장치 |
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JP3155351U (ja) * | 2009-09-02 | 2009-11-12 | 東京エレクトロン株式会社 | 液処理装置 |
JP4927158B2 (ja) * | 2009-12-25 | 2012-05-09 | 東京エレクトロン株式会社 | 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置 |
JP5440441B2 (ja) * | 2010-08-12 | 2014-03-12 | 東京エレクトロン株式会社 | 液処理装置 |
JP5975563B2 (ja) * | 2012-03-30 | 2016-08-23 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6046417B2 (ja) * | 2012-08-17 | 2016-12-14 | 株式会社Screenホールディングス | 基板処理装置、および基板処理方法 |
JP6017262B2 (ja) * | 2012-10-25 | 2016-10-26 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP5951444B2 (ja) * | 2012-10-25 | 2016-07-13 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP6319941B2 (ja) * | 2013-03-15 | 2018-05-09 | 株式会社Screenホールディングス | 基板処理装置および吐出ヘッド待機方法 |
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Also Published As
Publication number | Publication date |
---|---|
JPWO2016052642A1 (ja) | 2017-07-13 |
JP2019186565A (ja) | 2019-10-24 |
US20200135504A1 (en) | 2020-04-30 |
CN106716605B (zh) | 2021-06-08 |
JP2020074395A (ja) | 2020-05-14 |
US20200135505A1 (en) | 2020-04-30 |
KR102404961B1 (ko) | 2022-06-07 |
CN113363187B (zh) | 2024-03-22 |
TW201633392A (zh) | 2016-09-16 |
KR20220054469A (ko) | 2022-05-02 |
JP6804622B2 (ja) | 2020-12-23 |
KR20170063779A (ko) | 2017-06-08 |
TWI585842B (zh) | 2017-06-01 |
CN106716605A (zh) | 2017-05-24 |
US10607863B2 (en) | 2020-03-31 |
JP6761081B2 (ja) | 2020-09-23 |
US20170278729A1 (en) | 2017-09-28 |
KR102391753B1 (ko) | 2022-04-28 |
WO2016052642A1 (ja) | 2016-04-07 |
CN113363187A (zh) | 2021-09-07 |
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