JPS61178187U - - Google Patents
Info
- Publication number
- JPS61178187U JPS61178187U JP1985063546U JP6354685U JPS61178187U JP S61178187 U JPS61178187 U JP S61178187U JP 1985063546 U JP1985063546 U JP 1985063546U JP 6354685 U JP6354685 U JP 6354685U JP S61178187 U JPS61178187 U JP S61178187U
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- exhaust
- annular
- substrates
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000428 dust Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molecular Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Description
第1図ないし第3図は本考案に係る回転乾燥装
置を示し、第1図は第1の実施例による縦断面図
、第2図は第1図の―矢視平面図、第3図は
第2の実施例による縦断面図、第4図は従来技術
に係る回転乾燥装置の縦断面図である。 1……チヤンバー、2……乾燥室、3……蓋体
、4……取入口、5……排気ダクト、6……回転
体、7……基板収納ケース、7a……基板、8…
…環状遮蔽板、9……ノズル、11……ケースホ
ルダ、13……天板、14……回転体の上側開口
、16……環状排気用スリツト、17……排気チ
ヤンバー、18……連結ダクト、19……除塵フ
イルタ。
置を示し、第1図は第1の実施例による縦断面図
、第2図は第1図の―矢視平面図、第3図は
第2の実施例による縦断面図、第4図は従来技術
に係る回転乾燥装置の縦断面図である。 1……チヤンバー、2……乾燥室、3……蓋体
、4……取入口、5……排気ダクト、6……回転
体、7……基板収納ケース、7a……基板、8…
…環状遮蔽板、9……ノズル、11……ケースホ
ルダ、13……天板、14……回転体の上側開口
、16……環状排気用スリツト、17……排気チ
ヤンバー、18……連結ダクト、19……除塵フ
イルタ。
Claims (1)
- 【実用新案登録請求の範囲】 1 チヤンバー上の蓋体に取入口を、チヤンバー
所要部に強制排気手段と連結された排気ダクトを
それぞれ設け、チヤンバー内には回転体と、この
回転体の上側外周に可及的に近接させてチヤンバ
ーの蓋体に環状遮蔽板を配設して乾燥室を形成し
、上記回転体には乾燥すべき基板を収納した基板
収納ケースを複数個装着し、この回転体を回転さ
せて基板を乾燥するように構成した基板の回転乾
燥装置において、 前記環状遮蔽板の外側に環状排気用スリツトを
有する排気チヤンバーを設け、この排気チヤンバ
ーを強制排気手段に連結したことを特徴とする基
板の回転乾燥装置。 2 環状排気用スリツトを有する排気チヤンバー
が蓋体と一体に形成された実用新案登録請求の範
囲第1項に記載した基板の回転乾燥装置。 3 環状排気用スリツトを有する排気チヤンバー
が乾燥室を形成するチヤンバーの上側内周部に形
成された実用新案登録請求の範囲第1項に記載し
た基板の回転乾燥装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985063546U JPS61178187U (ja) | 1985-04-26 | 1985-04-26 | |
KR1019860003137A KR900001231B1 (ko) | 1985-04-26 | 1986-04-23 | 기판의 회전 건조 장치 |
US06/856,938 US4750505A (en) | 1985-04-26 | 1986-04-25 | Apparatus for processing wafers and the like |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985063546U JPS61178187U (ja) | 1985-04-26 | 1985-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61178187U true JPS61178187U (ja) | 1986-11-06 |
Family
ID=13232331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985063546U Pending JPS61178187U (ja) | 1985-04-26 | 1985-04-26 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4750505A (ja) |
JP (1) | JPS61178187U (ja) |
KR (1) | KR900001231B1 (ja) |
Families Citing this family (54)
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---|---|---|---|---|
US5169408A (en) * | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
US6375741B2 (en) * | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
US5238503A (en) * | 1991-04-09 | 1993-08-24 | International Business Machines Corporation | Device for decontaminating a semiconductor wafer container |
KR100230694B1 (ko) * | 1992-05-18 | 1999-11-15 | 다카시마 히로시 | 기판세정처리장치 |
US5224503A (en) * | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
DE69420474T2 (de) * | 1993-06-30 | 2000-05-18 | Applied Materials Inc | Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum |
US5608943A (en) * | 1993-08-23 | 1997-03-11 | Tokyo Electron Limited | Apparatus for removing process liquid |
US5475892A (en) * | 1993-10-29 | 1995-12-19 | Texas Instruments Incorporated | Semiconductor wafer particle extractor |
US5417768A (en) * | 1993-12-14 | 1995-05-23 | Autoclave Engineers, Inc. | Method of cleaning workpiece with solvent and then with liquid carbon dioxide |
US5509431A (en) * | 1993-12-14 | 1996-04-23 | Snap-Tite, Inc. | Precision cleaning vessel |
US5672212A (en) * | 1994-07-01 | 1997-09-30 | Texas Instruments Incorporated | Rotational megasonic cleaner/etcher for wafers |
US5958146A (en) * | 1994-11-14 | 1999-09-28 | Yieldup International | Ultra-low particle semiconductor cleaner using heated fluids |
US5849104A (en) * | 1996-09-19 | 1998-12-15 | Yieldup International | Method and apparatus for cleaning wafers using multiple tanks |
US5571337A (en) * | 1994-11-14 | 1996-11-05 | Yieldup International | Method for cleaning and drying a semiconductor wafer |
US5634978A (en) * | 1994-11-14 | 1997-06-03 | Yieldup International | Ultra-low particle semiconductor method |
US5772784A (en) | 1994-11-14 | 1998-06-30 | Yieldup International | Ultra-low particle semiconductor cleaner |
US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
US6350319B1 (en) | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
US6413436B1 (en) | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
US20050217707A1 (en) * | 1998-03-13 | 2005-10-06 | Aegerter Brian K | Selective processing of microelectronic workpiece surfaces |
US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
TW452828B (en) * | 1998-03-13 | 2001-09-01 | Semitool Inc | Micro-environment reactor for processing a microelectronic workpiece |
US6047717A (en) * | 1998-04-29 | 2000-04-11 | Scd Mountain View, Inc. | Mandrel device and method for hard disks |
US6062239A (en) * | 1998-06-30 | 2000-05-16 | Semitool, Inc. | Cross flow centrifugal processor |
US6125863A (en) * | 1998-06-30 | 2000-10-03 | Semitool, Inc. | Offset rotor flat media processor |
US6432214B2 (en) | 1998-07-10 | 2002-08-13 | Semitool, Inc. | Cleaning apparatus |
US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
US6511914B2 (en) | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
US7217325B2 (en) * | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
US6806194B2 (en) * | 1999-01-22 | 2004-10-19 | Semitool. Inc. | Apparatus and methods for processing a workpiece |
US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
US6216710B1 (en) | 1999-02-05 | 2001-04-17 | Caterpillar Inc. | Method and apparatus for removing quench oil from a permeable metal part |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
EP1192298A4 (en) | 1999-04-13 | 2006-08-23 | Semitool Inc | APPENDIX FOR THE ELECTROCHEMICAL TREATMENT OF A WORKPIECE |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6774056B2 (en) * | 1999-11-10 | 2004-08-10 | Semitool, Inc. | Sonic immersion process system and methods |
US6286231B1 (en) | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
AU2001282879A1 (en) * | 2000-07-08 | 2002-01-21 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
JP3662484B2 (ja) * | 2000-08-09 | 2005-06-22 | エム・エフエスアイ株式会社 | ウェット処理方法及びウェット処理装置 |
JP2002079201A (ja) * | 2000-09-07 | 2002-03-19 | Showa Kogyosho:Kk | 筒状被清掃体の清掃装置 |
KR100689808B1 (ko) * | 2000-12-07 | 2007-03-08 | 삼성전자주식회사 | 반도체소자 제조용 웨트 스테이션의 스핀 드라이어 |
US20050061676A1 (en) * | 2001-03-12 | 2005-03-24 | Wilson Gregory J. | System for electrochemically processing a workpiece |
AU2002322587A1 (en) * | 2001-07-16 | 2003-03-03 | Semitool, Inc. | Apparatus for processing a workpiece |
EP1481114A4 (en) * | 2001-08-31 | 2005-06-22 | Semitool Inc | DEVICE AND METHOD FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7371022B2 (en) | 2004-12-22 | 2008-05-13 | Sokudo Co., Ltd. | Developer endpoint detection in a track lithography system |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
KR102042635B1 (ko) | 2012-07-02 | 2019-11-08 | 삼성전자주식회사 | 매엽식 건조 장치 및 이를 포함하는 매엽식 세정 시스템 |
CN106716605B (zh) * | 2014-09-30 | 2021-06-08 | 芝浦机械电子株式会社 | 基板处理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58190031A (ja) * | 1982-04-30 | 1983-11-05 | Toshiba Corp | 半導体ウエハ清浄乾燥装置 |
JPH08210480A (ja) * | 1995-02-06 | 1996-08-20 | Unisia Jecs Corp | 自動変速機の変速動作開始時期検出装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2893410A (en) * | 1952-07-17 | 1959-07-07 | Cornell Dubilier Electric | Washing electrolytic capacitor sections |
JPS5212576A (en) * | 1975-07-21 | 1977-01-31 | Hitachi Ltd | Wafer washing drying device |
US4445281A (en) * | 1980-04-23 | 1984-05-01 | Seiichiro Aigoo | Dehydrating drier |
US4316750A (en) * | 1981-01-16 | 1982-02-23 | Western Electric Company, Inc. | Apparatus and method for cleaning a flux station of a soldering system |
US4421131A (en) * | 1982-01-19 | 1983-12-20 | Auvil Jr Raymond G | Cleaning apparatus |
-
1985
- 1985-04-26 JP JP1985063546U patent/JPS61178187U/ja active Pending
-
1986
- 1986-04-23 KR KR1019860003137A patent/KR900001231B1/ko not_active IP Right Cessation
- 1986-04-25 US US06/856,938 patent/US4750505A/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58190031A (ja) * | 1982-04-30 | 1983-11-05 | Toshiba Corp | 半導体ウエハ清浄乾燥装置 |
JPH08210480A (ja) * | 1995-02-06 | 1996-08-20 | Unisia Jecs Corp | 自動変速機の変速動作開始時期検出装置 |
Also Published As
Publication number | Publication date |
---|---|
KR860008594A (ko) | 1986-11-17 |
KR900001231B1 (ko) | 1990-03-05 |
US4750505A (en) | 1988-06-14 |