JP6582366B2 - 樹脂組成物、接着フィルム、硬化物、多層プリント配線板、半導体装置及び絶縁層用樹脂組成物 - Google Patents

樹脂組成物、接着フィルム、硬化物、多層プリント配線板、半導体装置及び絶縁層用樹脂組成物 Download PDF

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Publication number
JP6582366B2
JP6582366B2 JP2014141737A JP2014141737A JP6582366B2 JP 6582366 B2 JP6582366 B2 JP 6582366B2 JP 2014141737 A JP2014141737 A JP 2014141737A JP 2014141737 A JP2014141737 A JP 2014141737A JP 6582366 B2 JP6582366 B2 JP 6582366B2
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resin composition
epoxy resin
resin
less
cured product
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JP2015038197A (ja
Inventor
真俊 渡邊
真俊 渡邊
中村 茂雄
茂雄 中村
幸一郎 佐川
幸一郎 佐川
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/32Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/40Glass
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)
JP2014141737A 2013-07-19 2014-07-09 樹脂組成物、接着フィルム、硬化物、多層プリント配線板、半導体装置及び絶縁層用樹脂組成物 Active JP6582366B2 (ja)

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JP2013150497 2013-07-19
JP2013150497 2013-07-19
JP2014141737A JP6582366B2 (ja) 2013-07-19 2014-07-09 樹脂組成物、接着フィルム、硬化物、多層プリント配線板、半導体装置及び絶縁層用樹脂組成物

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JP6582366B2 true JP6582366B2 (ja) 2019-10-02

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JP2019073269A Active JP6801736B2 (ja) 2013-07-19 2019-04-08 樹脂組成物、接着フィルム、硬化物、多層プリント配線板及び半導体装置

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JP (2) JP6582366B2 (zh)
KR (1) KR20150010624A (zh)
CN (1) CN104292749A (zh)
TW (1) TWI629306B (zh)

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JP6710034B2 (ja) * 2014-12-12 2020-06-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6672630B2 (ja) * 2015-08-07 2020-03-25 味の素株式会社 樹脂組成物
JP6620457B2 (ja) * 2015-08-11 2019-12-18 味の素株式会社 樹脂組成物
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
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WO2020065872A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7543909B2 (ja) * 2018-10-11 2024-09-03 三菱ケミカル株式会社 樹脂組成物、樹脂硬化物および複合成形体
JP7087912B2 (ja) * 2018-10-25 2022-06-21 味の素株式会社 樹脂組成物
JPWO2020129249A1 (ja) * 2018-12-21 2021-11-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物及び電子部品装置
US11332599B2 (en) 2019-03-07 2022-05-17 Nippon Chemical Industrial Co., Ltd. Modified zirconium phosphate tungstate, negative thermal expansion filler and polymer composition
JP2020143238A (ja) * 2019-03-07 2020-09-10 味の素株式会社 樹脂組成物
JP7342433B2 (ja) * 2019-06-05 2023-09-12 Tdk株式会社 プリント配線基板およびその製造方法
JP7333736B2 (ja) * 2019-09-30 2023-08-25 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、及び電子部品
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Publication number Publication date
TW201518390A (zh) 2015-05-16
KR20150010624A (ko) 2015-01-28
CN104292749A (zh) 2015-01-21
TWI629306B (zh) 2018-07-11
JP2015038197A (ja) 2015-02-26
JP6801736B2 (ja) 2020-12-16
JP2019104941A (ja) 2019-06-27

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