KR20180084803A - 회로 부재 접속용 수지 시트 - Google Patents

회로 부재 접속용 수지 시트 Download PDF

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Publication number
KR20180084803A
KR20180084803A KR1020187014227A KR20187014227A KR20180084803A KR 20180084803 A KR20180084803 A KR 20180084803A KR 1020187014227 A KR1020187014227 A KR 1020187014227A KR 20187014227 A KR20187014227 A KR 20187014227A KR 20180084803 A KR20180084803 A KR 20180084803A
Authority
KR
South Korea
Prior art keywords
resin sheet
circuit member
member connection
connection
circuit
Prior art date
Application number
KR1020187014227A
Other languages
English (en)
Inventor
유스케 네즈
다카시 스기노
가즈히로 츠치야
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20180084803A publication Critical patent/KR20180084803A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C09J2201/622—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
KR1020187014227A 2015-11-24 2016-11-10 회로 부재 접속용 수지 시트 KR20180084803A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-229211 2015-11-24
JP2015229211 2015-11-24
PCT/JP2016/083335 WO2017090440A1 (ja) 2015-11-24 2016-11-10 回路部材接続用樹脂シート

Publications (1)

Publication Number Publication Date
KR20180084803A true KR20180084803A (ko) 2018-07-25

Family

ID=58764010

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014227A KR20180084803A (ko) 2015-11-24 2016-11-10 회로 부재 접속용 수지 시트

Country Status (5)

Country Link
JP (1) JPWO2017090440A1 (ko)
KR (1) KR20180084803A (ko)
CN (1) CN108323171A (ko)
TW (1) TW201728641A (ko)
WO (1) WO2017090440A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235854A1 (ja) * 2017-06-21 2018-12-27 日立化成株式会社 半導体用接着剤、半導体装置の製造方法及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10287848A (ja) 1997-02-14 1998-10-27 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP2009277818A (ja) 2008-05-14 2009-11-26 Toray Ind Inc 半導体用接着フィルムおよびこれを用いた半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19931827A1 (de) * 1999-07-08 2001-01-18 Wacker Chemie Gmbh Emissionsarme Klebemittel auf Basis einer wässrigen, schutzkolloidfreien Polymerdispersion von Vinylacetat-Ethylen-Mischpolymerisaten
JP3371894B2 (ja) * 1999-09-17 2003-01-27 ソニーケミカル株式会社 接続材料
JP4666703B2 (ja) * 1999-10-12 2011-04-06 旭化成イーマテリアルズ株式会社 半導体装置及びその材料
KR100704321B1 (ko) * 2002-02-06 2007-04-10 세키스이가가쿠 고교가부시키가이샤 수지 조성물
JP2011047084A (ja) * 2009-08-28 2011-03-10 Sumitomo Bakelite Co Ltd 有機化繊維、樹脂組成物及びその製造方法
JP5961015B2 (ja) * 2012-03-06 2016-08-02 日東電工株式会社 アンダーフィル材及び半導体装置の製造方法
US9085685B2 (en) * 2011-11-28 2015-07-21 Nitto Denko Corporation Under-fill material and method for producing semiconductor device
WO2013125684A1 (ja) * 2012-02-24 2013-08-29 日立化成株式会社 半導体装置及びその製造方法
JP6222941B2 (ja) * 2013-02-21 2017-11-01 日東電工株式会社 アンダーフィルシート、裏面研削用テープ一体型アンダーフィルシート、ダイシングテープ一体型アンダーフィルシート及び半導体装置の製造方法
JP6321910B2 (ja) * 2013-03-26 2018-05-09 日東電工株式会社 封止シート、半導体装置の製造方法及び封止シート付き基板
TWI629306B (zh) * 2013-07-19 2018-07-11 Ajinomoto Co., Inc. Resin composition
JP6374199B2 (ja) * 2014-03-31 2018-08-15 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム及び積層フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10287848A (ja) 1997-02-14 1998-10-27 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP2009277818A (ja) 2008-05-14 2009-11-26 Toray Ind Inc 半導体用接着フィルムおよびこれを用いた半導体装置の製造方法

Also Published As

Publication number Publication date
TW201728641A (zh) 2017-08-16
JPWO2017090440A1 (ja) 2018-09-06
WO2017090440A1 (ja) 2017-06-01
CN108323171A (zh) 2018-07-24

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