Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/10—Adhesives in the form of films or foils without carriers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/06—Non-macromolecular additives organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
  • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
  • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Definitions

• the present invention relates to a resin sheet, and for example, relates to a resin sheet for connecting a circuit member used for bonding a semiconductor chip and a substrate by a so-called flip chip mounting method.
• This flip chip mounting method is a kind of wireless bonding method, in which bumps made of solder or the like are formed on electrodes on the surface of a semiconductor chip, and the semiconductor chip is turned upside down on a substrate such as a printed circuit board or a ceramic substrate. After placing and aligning the bump and the electrode of the substrate, the bump is heated and melted to join the electrode of the semiconductor chip and the electrode of the substrate.
• an underfill material is generally used between the semiconductor chip and the substrate.
• a resin called an underfill material
• an underfill material made of a liquid resin composition is injected into a gap between the two and cured.
• Patent Document 2 has a problem that the coefficient of linear expansion is still large and good results cannot be secured in the temperature cycle test.
• the present invention has been made in view of such a situation, and an object of the present invention is to provide a resin sheet for connecting a circuit member, in which the connection resistance at the connection portion hardly changes and has high reliability.
• the present invention is a resin sheet for connecting a circuit member, which is interposed between electrodes facing each other and used to electrically connect the electrodes facing each other,
• a cured product of a material constituting the resin sheet has a glass transition temperature of 150 to 350 ° C. and an average linear expansion coefficient at 0 to 130 ° C. of 45 ppm or less.
• the resin sheet for connecting a circuit member according to the invention has a glass transition temperature of a cured product of 150 to 350 ° C. and an average linear expansion coefficient of 45 ppm or less. And the difference in linear expansion coefficient between the resin sheet and the adherend can be reduced. Therefore, the resin sheet for connecting circuit members according to the above invention (Invention 1) can have high connection reliability between the circuit members.
• the material constituting the resin sheet preferably contains one or more thermoplastic components selected from the group consisting of polyvinyl acetal resin and polyester resin (Invention 2).
• the material constituting the resin sheet preferably further contains a phenoxy resin as the thermoplastic component (Invention 3).
• the material constituting the resin sheet preferably contains an inorganic filler (Invention 4).
• the inorganic filler is preferably a silica filler (Invention 5), and the average particle diameter of the inorganic filler is preferably 10 to 200 nm (Invention 6).
• the material constituting the resin sheet preferably contains 35 to 64% by mass of the inorganic filler (Invention 7).
• the material constituting the resin sheet preferably contains a component having a flux function (Invention 8).
• the component having the flux function preferably contains a component having a carboxyl group (Invention 9), and the component having the carboxyl group is preferably 2-methylglutaric acid. (Invention 10).
• the resin sheet for connecting circuit members of the present invention has a high reliability because the connection resistance at the connecting portion hardly changes when the circuit members are connected to each other.
• the resin sheet for connecting circuit members according to the present embodiment is interposed between electrodes facing each other, and is used to electrically connect the electrodes facing each other.
• the circuit member is not particularly limited as long as it is a member in which an electrode is formed on a circuit.
• an inorganic circuit substrate such as a lead frame, a ceramic circuit substrate, and a glass circuit substrate
• organic rigid circuit examples thereof include organic circuit boards such as substrates and flexible circuit boards.
• cured material is 150 degreeC or more as a lower limit, Preferably it is 200 degreeC or more, Especially preferably, it is 240 degreeC or more.
• Tg glass transition temperature of hardened
• the glass transition temperature of the cured product is equal to or higher than the lower limit, deformation of the cured product is suppressed during the temperature cycle test, and stress that can be generated between the resin sheet and the adherend can be reduced.
• the resin sheet for circuit member connection which concerns on this embodiment can make the connection reliability of circuit members high, and shows high connection reliability especially in the temperature cycle test shown in an Example. .
• the upper limit of the glass transition temperature of the cured product is 350 ° C. or less, preferably 300 ° C. or less, and particularly preferably 280 ° C. or less.
• the glass transition temperature of the cured product is not more than the above upper limit value, embrittlement of the cured product can be suppressed, and cracks in the package can be suppressed in the reliability test.
• the glass transition temperature of the cured product of the material constituting the resin sheet is a value measured using a dynamic viscoelasticity measuring apparatus, and details of the test method are as shown in Examples described later.
• the material constituting the resin sheet is sometimes referred to as an average linear expansion coefficient at 0 to 130 ° C. of the cured product (hereinafter simply referred to as “average linear expansion coefficient”). ) Is 45 ppm or less as an upper limit, preferably 35 ppm or less, and particularly preferably 25 ppm or less. If the average linear expansion coefficient is not more than the above upper limit, the difference in linear expansion coefficient between the cured resin sheet and the adherend (circuit member) becomes small, and based on the difference between the resin sheet and the adherend. It is possible to reduce the stress that can be generated between the two. Thereby, the resin sheet for circuit member connection which concerns on this embodiment can make the connection reliability of circuit members high, and shows high connection reliability especially in the temperature cycle test shown in an Example. .
• the lower limit value of the average linear expansion coefficient is not particularly limited, but is preferably 5 ppm or more and more preferably 10 ppm or more from the viewpoint of film formability.
• the average linear expansion coefficient of the material constituting the resin sheet is a value measured using a thermomechanical analyzer, and the details of the test method are as shown in Examples described later.
• the material constituting the resin sheet has a melt viscosity at 90 ° C. before curing (hereinafter sometimes referred to as “90 ° C. melt viscosity”) of 5.0 as an upper limit.
• 90 ° C. melt viscosity a melt viscosity at 90 ° C. before curing
• X10 5 Pa ⁇ s or less is preferred, 1.0 ⁇ 10 5 Pa ⁇ s or less is more preferred, and 5.0 ⁇ 10 4 Pa ⁇ s or less is particularly preferred.
• melt viscosity is less than or equal to the above upper limit, when the circuit member connecting resin sheet is interposed between the electrodes, the circuit member and the resin are satisfactorily followed by unevenness on the surface of the circuit member such as a chip or a substrate. It is possible to prevent generation of voids at the interface with the layer made of the sheet.
• the 90 ° C. melt viscosity is preferably 1.0 ⁇ 10 0 Pa ⁇ s or more as a lower limit, more preferably 1.0 ⁇ 10 1 Pa ⁇ s or more, and 1.0 ⁇ 10 2. It is particularly preferable that it is Pa ⁇ s or more.
• melt viscosity is equal to or higher than the lower limit, the material constituting the resin sheet does not flow excessively, and contamination of the apparatus can be prevented when the resin sheet is stuck or when a circuit is connected.
• the 90 ° C. melt viscosity of the material constituting the resin sheet is determined by using a flow tester (manufactured by Shimadzu Corporation, CFT-100D) under the conditions of a load of 50 kgf, a temperature range of 50 to 120 ° C., and a temperature increase rate of 10 ° C./min. It is the value measured by.
• the resin sheet for connecting circuit members according to the present embodiment satisfies the glass transition temperature and the average linear expansion coefficient of the cured product, and is preferably made of a material that satisfies the above-described 90 ° C. melt viscosity.
• thermoplastic component It is preferable that the material which comprises the said resin sheet contains a thermoplastic component.
• the thermoplastic component By containing the thermoplastic component, the glass transition temperature and the average linear expansion coefficient of the cured product of the material can easily satisfy the numerical range described above.
• thermoplastic component examples include (meth) acrylic resin, phenoxy resin, polyester resin, polyurethane resin, polyimide resin, polyamideimide resin, siloxane-modified polyimide resin, polybutadiene resin, polypropylene resin, and styrene-butadiene-styrene copolymer.
• Styrene-ethylene-butylene-styrene copolymer polyvinyl acetal resin such as polyacetal resin, polyvinyl butyral resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile -Butadiene-styrene copolymer, polyvinyl acetate, nylon and the like can be mentioned, and one kind can be used alone or two or more kinds can be used in combination.
• (meth) acrylic acid in this specification means both acrylic acid and methacrylic acid.
• (meth) acrylic resin in this specification means both acrylic acid and methacrylic acid.
• thermoplastic components described above it is preferable to use one or more selected from the group consisting of polyvinyl acetal resins and polyester resins.
• the material constituting the resin sheet contains these thermoplastic components, so that the glass transition temperature of the cured product becomes a high value and the average linear expansion coefficient becomes a low value. As a result, these values are described above. It becomes easy to be within the numerical range.
• the polyvinyl acetal resin is obtained by acetalizing polyvinyl alcohol obtained by saponifying polyvinyl acetate with aldehyde.
• aldehyde used for acetalization include n-butyraldehyde, n-hexyl aldehyde, n-valeraldehyde and the like.
• the polyvinyl acetal resin it is also preferable to use a polyvinyl butyral resin acetalized with n-butyraldehyde.
• polyester resins include polyester resins obtained by polycondensation of dicarboxylic acid components and diol components such as polyethylene terephthalate resin, polybutylene terephthalate resin, and polyethylene oxalate resin; urethane obtained by reacting these with a polyisocyanate compound.
• Modified polyester resins such as modified polyester resins; polyester resins grafted with acrylic resins and / or vinyl resins, and the like can be used, and one kind can be used alone or two or more kinds can be used in combination.
• the material constituting the resin sheet contains a polyvinyl acetal resin, a polyvinyl butyral resin, or a polyester resin as a thermoplastic component
• the material constituting the resin sheet more easily satisfies the numerical range described above in terms of the glass transition temperature and the average linear expansion coefficient of the cured product.
• the phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, biphenol type, and biphenyl type.
• the lower limit value of the softening point of the thermoplastic component is preferably 50 ° C or higher, more preferably 100 ° C or higher, and particularly preferably 120 ° C or higher.
• the upper limit value of the softening point of the thermoplastic component is preferably 200 ° C. or less, more preferably 180 ° C. or less, and particularly preferably 150 ° C. or less.
• the lower limit value of the glass transition temperature of the thermoplastic component is preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and particularly preferably 80 ° C. or higher.
• the upper limit of the glass transition temperature of the thermoplastic component is preferably 250 ° C. or lower, more preferably 200 ° C. or lower, and particularly preferably 180 ° C. or lower.
• the weight average molecular weight of the thermoplastic component is preferably 10,000 or more, more preferably 30,000 or more, and particularly preferably 50,000 or more.
• the upper limit is preferably 1,000,000 or less, more preferably 700,000 or less, and particularly preferably 500,000 or less. It is preferable for the weight average molecular weight to be not less than the above lower limit value, since the film viscosity can be maintained and the melt viscosity can be lowered.
• a compatibility with low molecular weight components, such as a thermosetting component improves that a weight average molecular weight is below the said upper limit, it is preferable.
• the weight average molecular weight in this specification is the value of standard polystyrene conversion measured by the gel permeation chromatography (GPC) method.
• the lower limit of the content of the thermoplastic component in the material constituting the resin sheet is preferably 3% by mass or more, more preferably 5% by mass or more, and particularly preferably 7% by mass or more. preferable.
• the upper limit of the thermoplastic component content is preferably 95% by mass or less, more preferably 90% by mass or less, and particularly preferably 80% by mass or less.
• the content of the thermoplastic component is not more than the upper limit, the glass transition temperature of the cured product of the material constituting the resin sheet can be increased, and the average linear expansion coefficient can be further reduced. Becomes easier to satisfy the numerical range described above.
• the content of the thermoplastic component is equal to or higher than the lower limit value, the 90 ° C. melt viscosity of the material constituting the resin sheet can be further lowered, and the above-described numerical range is easily satisfied.
• the material which comprises the said resin sheet contains an inorganic filler. Since the material constituting the resin sheet contains an inorganic filler, the average linear expansion coefficient becomes a low value. Therefore, when the resin sheet for connecting circuit members according to this embodiment is used, the connection reliability between the circuit members is The property can be made high.
• the inorganic filler which can be used in this embodiment is not specifically limited, A silica, an alumina, glass, a titanium oxide, mica etc. can be illustrated, These are used individually by 1 type or in combination of 2 or more types. Can do. Among these, silica filler is preferable.
• the shape of the silica filler is preferably spherical.
• the lower limit of the average particle size of the inorganic filler is preferably 10 nm or more, more preferably 20 nm or more, and particularly preferably 30 nm or more.
• the average particle size of the inorganic filler is preferably 200 nm or less, more preferably 150 nm or less, and particularly preferably 100 nm or less.
• both the transparency of the sheet and the low melt viscosity can be achieved.
• 90 degreeC melt viscosity in the material which comprises the said resin sheet can be maintained to a low value as the average particle diameter of an inorganic filler is below the said upper limit.
• the lower limit of the content of the inorganic filler in the material constituting the resin sheet is preferably 35% by mass or more, more preferably 40% by mass or more, and particularly preferably 50% by mass or more.
• the upper limit of the content of the inorganic filler is preferably 64% by mass or less, more preferably 60% by mass or less, and particularly preferably 56% by mass or less.
• the glass transition temperature of the cured product of the material can be increased, and the average linear expansion coefficient can be further reduced. In either case, the above numerical range is easily satisfied.
• the content of the inorganic filler is not more than the above upper limit value, the 90 ° C. melt viscosity of the material can be maintained at a low value, and the above-described numerical range is easily satisfied.
• the material constituting the resin sheet for connecting a circuit member of the present embodiment is a component having a flux function (hereinafter referred to as “flux”). It is preferable to contain a "component”.
• the flux component has an action of removing the metal oxide film formed on the electrode surface, makes the electrical connection between the electrodes by solder more reliable, and can improve the connection reliability at the solder joint. .
• a flux component it does not specifically limit as a flux component, It is preferable that it is a component which has a phenolic hydroxyl group and / or a carboxyl group, and it is especially preferable that it is a component which has a carboxyl group.
• the component having a carboxyl group has a flux function and also has a function as a curing agent when an epoxy resin described later is used as a thermosetting component. For this reason, the component having a carboxyl group reacts and is consumed as a curing agent after the solder bonding is completed, so that it is possible to suppress problems caused by excessive flux components.
• Specific flux components include, for example, glutaric acid, 2-methylglutaric acid, orthoanisic acid, diphenolic acid, adipic acid, acetylsalicylic acid, benzoic acid, benzylic acid, azelaic acid, benzylbenzoic acid, malonic acid, 2, 2-bis (hydroxymethyl) propionic acid, salicylic acid, o-methoxybenzoic acid, m-hydroxybenzoic acid, succinic acid, 2,6-dimethoxymethylparacresol, benzoic hydrazide, carbohydrazide, malonic dihydrazide, succinic dihydrazide Glutaric acid dihydrazide, salicylic acid hydrazide, iminodiacetic acid dihydrazide, itaconic acid dihydrazide, citric acid trihydrazide, thiocarbohydrazide, benzophenone hydrazone, 4,4′-oxybisbenzenesulfonylhydra
• rosin derivatives include gum rosin, tall rosin, wood rosin, polymerized rosin, hydrogenated rosin, formylated rosin, rosin ester, rosin modified maleic resin, rosin modified phenolic resin, rosin modified alkyd resin, and the like.
• 2-methylglutaric acid and rosin derivatives are particularly preferable.
• 2-Methylglutaric acid is a material constituting the resin sheet for connecting circuit members, and has two carboxyl groups in the molecule even though the molecular weight is relatively small. In the embodiment, it can be particularly preferably used. Since the rosin derivative has a high softening point and can impart a flux property while maintaining a low linear expansion coefficient, it can be used particularly suitably in this embodiment.
• the lower limit of the content of the flux component in the material constituting the resin sheet is preferably 1% by mass or more, more preferably 3% by mass or more, and 5% by mass or more. Is particularly preferred.
• the upper limit of the content of the flux component is preferably 20% by mass or less, more preferably 15% by mass or less, and particularly preferably 10% by mass or less.
• the electrical connection between the electrodes by solder can be made more reliable, and the connection reliability at the solder joint can be further improved.
• the content of the flux component is not more than the above upper limit value, it is possible to prevent problems such as ion migration due to an excessive flux component.
• thermosetting component is not particularly limited as long as it is an adhesive component usually used for connecting circuit members such as semiconductor chips.
• Specific examples include epoxy resins, phenol resins, melamine resins, urea resins, polyester resins, urethane resins, acrylic resins, polyimide resins, benzoxazine resins, and the like. These may be used alone or in combination of two or more. Can be used. Among these, from the viewpoint of adhesiveness and the like, an epoxy resin and a phenol resin are preferable, and an epoxy resin is particularly preferable.
• Epoxy resin has the property of forming a three-dimensional network upon heating and forming a hardened product.
• various conventionally known epoxy resins are used. Specifically, glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolac, cresol novolac; butanediol, Glycidyl ether of alcohols such as polyethylene glycol and polypropylene glycol; Glycidyl ether of carboxylic acid such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; Glycidyl type in which active hydrogen bonded to nitrogen atom such as aniline isocyanurate is substituted with glycidyl group Or an alkyl glycidyl type epoxy resin; vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4- Poxy
• an epoxy resin having a biphenyl skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, or the like can also be used. These epoxy resins can be used alone or in combination of two or more.
• the lower limit of the content of the thermosetting component in the material constituting the resin sheet is preferably 5% by mass or more, and more preferably 10% by mass or more.
• the upper limit of the content of the thermosetting component is preferably 75% by mass or less, more preferably 60% by mass or less, and particularly preferably 55% by mass or less.
• the material constituting the resin sheet for connecting circuit members of this embodiment contains the thermosetting component described above, the material preferably further contains a curing agent and a curing catalyst.
• thermosetting component Although it does not specifically limit as a hardening
• phenols are preferable from the viewpoint of reactivity with the epoxy resin.
• phenols include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane type phenol, tetrakisphenol, novolac type phenol, cresol novolac resin, etc. Can be used singly or in combination of two or more.
• the curing catalyst is not particularly limited, and examples thereof include imidazole-based, phosphorus-based, and amine-based, and can be appropriately selected according to the type of the thermosetting component described above.
• an imidazole-based curing catalyst is preferable from the viewpoint of reactivity with the epoxy resin.
• the lower limit of the content of the curing catalyst in the material constituting the resin sheet is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, and 0.4 It is particularly preferable that the content is at least mass%.
• the upper limit of the content of the curing catalyst is preferably 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 3% by mass or less.
• a thermosetting component can fully be hardened as content of a curing catalyst is more than the said lower limit.
• the content of the curing catalyst is not more than the above upper limit value, the storage stability of the resin sheet becomes good.
• the resin sheet for connecting circuit members according to the present embodiment further includes a plasticizer, a stabilizer, a tackifier, a colorant, a coupling agent, and an antistatic agent as a material constituting the resin sheet. Further, it may contain an antioxidant, conductive particles and the like.
• the material constituting the resin sheet contains conductive particles and the like, and anisotropic conductivity is imparted to the resin sheet for connecting circuit members, in an aspect that complements solder bonding, or with solder bonding
• the circuit members can be electrically joined in different manners.
• the resin sheet for connecting circuit members according to the present embodiment may be further laminated with a release sheet. Also, a dicing sheet integrated sheet (dicing / die bonding sheet) obtained by further laminating a dicing sheet on the circuit member connecting resin sheet according to the present embodiment, or a back grind sheet integrated adhesive sheet obtained by further laminating a back grind sheet. It is good.
• the configuration of the release sheet is arbitrary, for example, a polyester film such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polypropylene, Examples thereof include a plastic film such as a polyolefin film such as polyethylene. It is preferable that a peeling treatment is performed on these peeling surfaces (surfaces in contact with the resin sheet).
• the release agent used for the release treatment include silicone-based, fluorine-based, and long-chain alkyl-based release agents.
• one release sheet When laminating release sheets on both sides of the resin sheet for connecting circuit members, one release sheet may be a heavy release release sheet having a high release force, and the other release sheet may be a light release release sheet having a low release force. preferable.
• the thickness of the release sheet is not particularly limited, but is usually about 20 to 250 ⁇ m.
• the dicing sheet is not particularly limited as long as it is generally used.
• a sheet in which an adhesive layer is laminated on one side of a substrate can be exemplified.
• the material constituting the substrate of the dicing sheet is not particularly limited.
• the constituent material of the pressure-sensitive adhesive layer of the dicing sheet is not particularly limited.
• a material composed of a resin composition containing an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or the like can be used.
• the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, Copolymers with styrene, acrylonitrile, etc.) are used. Two or more kinds of these copolymers may be mixed.
• the circuit member connecting resin sheet is laminated on the surface of the dicing sheet on the pressure-sensitive adhesive layer side.
• the pressure-sensitive adhesive layer preferably has a pressure-sensitive adhesive force that is lowered by energy ray irradiation, heating, or the like.
• the back grind sheet is not particularly limited as long as it is generally used.
• a sheet in which an adhesive layer is laminated on one side of a base material can be exemplified.
• the constituent material of the base material of the back grind sheet is not particularly limited, for example, a material made of a resin such as polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), ethylene / vinyl acetate copolymer (EVA), etc. Can be mentioned.
• a resin such as polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), ethylene / vinyl acetate copolymer (EVA), etc.
• PET polyethylene terephthalate
• PE polyethylene
• PP polypropylene
• EVA ethylene / vinyl acetate copolymer
• the constituent material of the pressure-sensitive adhesive layer of the back grind sheet is not particularly limited.
• a material composed of a resin composition containing an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or the like can be used.
• the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, Copolymers with styrene, acrylonitrile, etc.) are used. Two or more kinds of these copolymers may be mixed.
• the circuit member connecting resin sheet is placed on the surface of the back grind sheet on the pressure-sensitive adhesive layer side. Laminated.
• an adhesive layer and the layer which consists of a resin sheet for circuit member connection are peeled after a back surface grinding process. Therefore, the pressure-sensitive adhesive layer preferably has a pressure-sensitive adhesive force that is lowered by energy ray irradiation, heating, or the like.
• the resin sheet for circuit member connection which concerns on this embodiment can be manufactured similarly to the conventional resin sheet for circuit member connection.
• a coating liquid containing a material constituting the resin sheet for connecting a circuit member and, if desired, further containing a solvent or a dispersion medium is prepared and peeled off.
• a coating film is formed by applying the coating liquid with a die coater, curtain coater, spray coater, slit coater, knife coater, etc.
• a resin sheet can be formed as a part of the laminate.
• the properties of the coating liquid are not particularly limited as long as it can be applied.
• the coating liquid may contain a component for forming a resin sheet as a solute or a dispersoid.
• the release sheet in the laminate may be peeled off as a process material, or the resin sheet may be protected until being attached to an adherend such as a semiconductor wafer or a ceramic green sheet laminate.
• a coating liquid is formed on the release surface of the aforementioned release sheet by forming a coating film. Then, it is dried to form a laminate composed of a resin sheet and a release sheet, and the surface opposite to the release sheet side of the resin sheet of this laminate is applied to the release surface of another release sheet, A laminate comprising a release sheet / resin sheet / release sheet can be obtained.
• the release sheet in the laminate may be peeled off as a process material, or the resin sheet may be protected until being attached to an adherend such as a semiconductor wafer or a substrate.
• a dicing sheet integrated adhesive sheet (dicing / die bonding sheet) or a back grind sheet integrated adhesive sheet
• a laminate of the above-described circuit member connecting resin sheet and release sheet is formed, and the lamination is performed.
• a dicing sheet integrated adhesive sheet or a back grind sheet integrated adhesive sheet can be obtained.
• the resin sheet for connecting circuit members is attached to the circuit surface of the semiconductor wafer on which the circuit and solder bumps are formed. Specifically, a laminate of a resin sheet for connecting a circuit member and a release sheet is prepared, and the surface of the laminate on the side of the resin sheet for connecting a circuit member is attached to the circuit surface of the semiconductor wafer, and the release sheet is peeled off. The method of doing is mentioned. Thereby, the circuit surface of a semiconductor wafer will be in the state protected by the resin sheet for circuit member connection. In this state, semiconductor wafer back surface grinding or other back surface processing may be performed.
• the method for cutting the wafer is not particularly limited, and it is performed by various conventionally known dicing methods.
• a normal dicing sheet is affixed to the back side of the semiconductor wafer (the side opposite to the side where the circuit sheet connecting resin sheet is affixed), and is fixed to the ring frame via the dicing sheet.
• a method of cutting a semiconductor wafer using a dicing blade is employed.
• other dicing methods such as laser dicing may be employed.
• the dicing sheet may be expanded to increase the interval between the semiconductor chips and then pick up.
• the collected semiconductor chip is placed on the circuit board.
• the semiconductor chip is placed on the circuit board by using a flip chip bonder so that the electrodes on the semiconductor chip side and the electrodes on the circuit board face each other.
• the semiconductor chip and the circuit board are heated and pressurized, and then cooled. Thereby, the semiconductor chip and the circuit board are bonded via the cured product of the resin sheet for connecting the circuit member, and the electrode of the semiconductor chip and the electrode of the chip mounting portion are connected via the solder bump formed on the semiconductor chip, Electrically joined.
• the soldering conditions depend on the metal composition to be used. For example, in the case of Sn—Ag, it is preferable to heat at 200 to 300 ° C. for 1 to 30 seconds.
• Curing conditions can be performed, for example, by heating at 100 to 200 ° C. for 1 to 120 minutes. Moreover, you may perform this hardening process by pressurization conditions.
• the circuit member connecting resin sheet has been described as an example of the connection between the semiconductor chip and the circuit board, but the circuit connected by the circuit member connecting resin sheet of the present embodiment.
• the member is not limited to this combination.
• a combination of a semiconductor chip and a semiconductor chip, a combination of a semiconductor wafer and a semiconductor wafer, a combination of a semiconductor chip and a semiconductor wafer, a combination of a semiconductor chip and a flexible circuit board, and the like can be given.
• Examples 1 to 5, Comparative Example 1 The composition containing the constituents shown in Table 1 was diluted with methyl ethyl ketone so that the solid content concentration was 40% by mass, and applied on a silicone-treated release film (SP-PET 381031 manufactured by Lintec Corporation). The obtained coating film was dried in an oven at 100 ° C. for 1 minute to form a coating film having a thickness of 45 ⁇ m, and a film-like resin composition formed on the release film was obtained. Then, the resin sheet for circuit member connection was obtained by transcribe
• Thermosetting component bisphenol A (BisA) type epoxy resin, epoxy equivalent: 180-190 g / eq Inorganic filler / silica filler, average particle size: 100 nm
• the glass transition temperature (Tg) of the thermoplastic component was measured using a DSC (PYRIS ⁇ ⁇ Diamond DSC) manufactured by PerkinElmer and a temperature profile of -70 ° C to 150 ° C at a heating / cooling rate of 10 ° C / min. In practice, the inflection point was confirmed and the glass transition temperature was determined.
• the weight average molecular weight (Mw) of the above-mentioned constituent components was measured in terms of standard polystyrene using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name “HLC-8020”) measured under the following conditions (GPC measurement). Average molecular weight.
• Test Example 1 Measurement of glass transition temperature of cured product
• the resin sheet for connecting circuit members prepared in Examples and Comparative Examples was cut into 5 ⁇ 20 mm to obtain a measurement sample.
• the obtained sample was cured by treating at 160 ° C. for 1 hour.
• cured material using a dynamic viscoelasticity measuring apparatus (The product made from TA instrument company, DMA Q800), frequency 11Hz, amplitude 10micrometer, and the temperature increase rate of 3 degree-C / min, 0 to 300 degreeC
• the viscoelasticity in the tensile mode when the temperature was raised to ° C. was measured, and the temperature at the maximum point of tan ⁇ (loss elastic modulus / storage elastic modulus) obtained by this measurement was defined as the glass transition temperature (Tg).
• Tg glass transition temperature
• the circuit member connecting resin sheets obtained in the examples had good results of the temperature cycle test and had high connection reliability.
• the resin sheet for connecting circuit members according to the present invention has high connection reliability when the circuit members are connected to each other, it can be suitably used for joining various circuit members.

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Inorganic Chemistry (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Health & Medical Sciences (AREA)
• Life Sciences & Earth Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Wood Science & Technology (AREA)
• Adhesive Tapes (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Wire Bonding (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=58764010

Family Applications (1)

Country Status (5)

Cited By (1)

Citations (4)

Family Cites Families (10)

• 2016
  • 2016-11-10 JP JP2017552351A patent/JPWO2017090440A1/ja active Pending
  • 2016-11-10 KR KR1020187014227A patent/KR20180084803A/ko unknown
  • 2016-11-10 CN CN201680065267.6A patent/CN108323171A/zh active Pending
  • 2016-11-10 WO PCT/JP2016/083335 patent/WO2017090440A1/ja active Application Filing
  • 2016-11-16 TW TW105137385A patent/TW201728641A/zh unknown

Patent Citations (4)

Also Published As

Similar Documents

Legal Events