WO2017090440A1 - Circuit member-connecting resin sheet - Google Patents
Circuit member-connecting resin sheet Download PDFInfo
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- WO2017090440A1 WO2017090440A1 PCT/JP2016/083335 JP2016083335W WO2017090440A1 WO 2017090440 A1 WO2017090440 A1 WO 2017090440A1 JP 2016083335 W JP2016083335 W JP 2016083335W WO 2017090440 A1 WO2017090440 A1 WO 2017090440A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Abstract
Description
本実施形態に係る回路部材接続用樹脂シートは、相対向する電極間に介在され、相対向する電極を電気的に接続するために用いられるものである。回路部材としては、回路に電極が形成された部材であれば特に限定されないが、例えば、半導体チップ、半導体ウエハのほか、リードフレーム、セラミック回路基板、ガラス回路基板などの無機回路基板、有機リジッド回路基板、フレキシブル回路基板などの有機回路基板、を挙げることができる。 Hereinafter, embodiments of the present invention will be described.
The resin sheet for connecting circuit members according to the present embodiment is interposed between electrodes facing each other, and is used to electrically connect the electrodes facing each other. The circuit member is not particularly limited as long as it is a member in which an electrode is formed on a circuit. For example, in addition to a semiconductor chip and a semiconductor wafer, an inorganic circuit substrate such as a lead frame, a ceramic circuit substrate, and a glass circuit substrate, an organic rigid circuit Examples thereof include organic circuit boards such as substrates and flexible circuit boards.
本実施形態において、樹脂シートを構成する材料は、硬化物のガラス転移温度(Tg)が、下限値として150℃以上であり、好ましくは200℃以上であり、特に好ましくは240℃以上である。硬化物のガラス転移温度が上記下限値以上であると、温度サイクル試験時に硬化物の変形が抑制され、樹脂シートと被着体との間で発生し得る応力を低減することができる。これにより、本実施形態に係る回路部材接続用樹脂シートは、回路部材同士の接続信頼性を高いものとすることができ、特に実施例で示す温度サイクル試験において高い接続信頼性を示すものとなる。 (1) Glass transition temperature of hardened | cured material In this embodiment, as for the material which comprises a resin sheet, the glass transition temperature (Tg) of hardened | cured material is 150 degreeC or more as a lower limit, Preferably it is 200 degreeC or more, Especially preferably, it is 240 degreeC or more. When the glass transition temperature of the cured product is equal to or higher than the lower limit, deformation of the cured product is suppressed during the temperature cycle test, and stress that can be generated between the resin sheet and the adherend can be reduced. Thereby, the resin sheet for circuit member connection which concerns on this embodiment can make the connection reliability of circuit members high, and shows high connection reliability especially in the temperature cycle test shown in an Example. .
本実施形態において、樹脂シートを構成する材料は、硬化物の0~130℃における平均線膨張係数(以下、単に「平均線膨張係数」ということがある。)が、上限値として45ppm以下であり、好ましくは35ppm以下であり、特に好ましくは25ppm以下である。平均線膨張係数が上記上限値以下であると、硬化物からなる樹脂シートと被着体(回路部材)との線膨張係数の差が小さくなり、かかる差に基づき樹脂シートと被着体との間で発生し得る応力を低減することができる。これにより、本実施形態に係る回路部材接続用樹脂シートは、回路部材同士の接続信頼性を高いものとすることができ、特に実施例で示す温度サイクル試験において高い接続信頼性を示すものとなる。 (2) Average Linear Expansion Coefficient of Cured Product In this embodiment, the material constituting the resin sheet is sometimes referred to as an average linear expansion coefficient at 0 to 130 ° C. of the cured product (hereinafter simply referred to as “average linear expansion coefficient”). ) Is 45 ppm or less as an upper limit, preferably 35 ppm or less, and particularly preferably 25 ppm or less. If the average linear expansion coefficient is not more than the above upper limit, the difference in linear expansion coefficient between the cured resin sheet and the adherend (circuit member) becomes small, and based on the difference between the resin sheet and the adherend. It is possible to reduce the stress that can be generated between the two. Thereby, the resin sheet for circuit member connection which concerns on this embodiment can make the connection reliability of circuit members high, and shows high connection reliability especially in the temperature cycle test shown in an Example. .
(3)溶融粘度
本実施形態において、樹脂シートを構成する材料は、硬化前における90℃での溶融粘度(以下、「90℃溶融粘度」ということがある。)が、上限値として5.0×105Pa・s以下であることが好ましく、1.0×105Pa・s以下であることがさらに好ましく、5.0×104Pa・s以下であることが特に好ましい。90℃溶融粘度が上記上限値以下であると、回路部材接続用樹脂シートを電極間に介在させたときに、チップや基板等の回路部材の表面の凹凸に良好に追従し、回路部材と樹脂シートからなる層との界面にボイドが発生するのを防止することができる。また、90℃溶融粘度は、下限値として1.0×100Pa・s以上であることが好ましく、1.0×101Pa・s以上であることがさらに好ましく、1.0×102Pa・s以上であることが特に好ましい。90℃溶融粘度が上記下限値以上であると、上記樹脂シートを構成する材料がフローし過ぎることがなく、樹脂シート貼付時や回路接続時において装置の汚染を防止することができる。
ここで、樹脂シートを構成する材料の90℃溶融粘度は、フローテスター(島津製作所社製,CFT-100D)を用い、荷重50kgf、温度範囲50~120℃、昇温速度10℃/minの条件にて測定した値である。 Here, the average linear expansion coefficient of the material constituting the resin sheet is a value measured using a thermomechanical analyzer, and the details of the test method are as shown in Examples described later.
(3) Melt Viscosity In this embodiment, the material constituting the resin sheet has a melt viscosity at 90 ° C. before curing (hereinafter sometimes referred to as “90 ° C. melt viscosity”) of 5.0 as an upper limit. X10 5 Pa · s or less is preferred, 1.0 × 10 5 Pa · s or less is more preferred, and 5.0 × 10 4 Pa · s or less is particularly preferred. When the 90 ° C. melt viscosity is less than or equal to the above upper limit, when the circuit member connecting resin sheet is interposed between the electrodes, the circuit member and the resin are satisfactorily followed by unevenness on the surface of the circuit member such as a chip or a substrate. It is possible to prevent generation of voids at the interface with the layer made of the sheet. The 90 ° C. melt viscosity is preferably 1.0 × 10 0 Pa · s or more as a lower limit, more preferably 1.0 × 10 1 Pa · s or more, and 1.0 × 10 2. It is particularly preferable that it is Pa · s or more. When the 90 ° C. melt viscosity is equal to or higher than the lower limit, the material constituting the resin sheet does not flow excessively, and contamination of the apparatus can be prevented when the resin sheet is stuck or when a circuit is connected.
Here, the 90 ° C. melt viscosity of the material constituting the resin sheet is determined by using a flow tester (manufactured by Shimadzu Corporation, CFT-100D) under the conditions of a load of 50 kgf, a temperature range of 50 to 120 ° C., and a temperature increase rate of 10 ° C./min. It is the value measured by.
本実施形態に係る回路部材接続用樹脂シートは、硬化物のガラス転移温度および平均線膨張係数を満たし、好ましくは、さらに前述した90℃溶融粘度を満たす材料によって構成される。 2. Material The resin sheet for connecting circuit members according to the present embodiment satisfies the glass transition temperature and the average linear expansion coefficient of the cured product, and is preferably made of a material that satisfies the above-described 90 ° C. melt viscosity.
上記樹脂シートを構成する材料は、熱可塑性成分を含有することが好ましい。熱可塑性成分を含有することで、当該材料の硬化物のガラス転移温度および平均線膨張係数が、前述した数値範囲を満たしやすくなる。 (1) Thermoplastic component It is preferable that the material which comprises the said resin sheet contains a thermoplastic component. By containing the thermoplastic component, the glass transition temperature and the average linear expansion coefficient of the cured product of the material can easily satisfy the numerical range described above.
上記樹脂シートを構成する材料は、無機フィラーを含有することが好ましい。樹脂シートを構成する材料は、無機フィラーを含有することで、平均線膨張係数が低い値となるため、本実施形態に係る回路部材接続用樹脂シートを用いたときに、回路部材同士の接続信頼性を高いものとすることができる。 (2) Inorganic filler It is preferable that the material which comprises the said resin sheet contains an inorganic filler. Since the material constituting the resin sheet contains an inorganic filler, the average linear expansion coefficient becomes a low value. Therefore, when the resin sheet for connecting circuit members according to this embodiment is used, the connection reliability between the circuit members is The property can be made high.
本実施形態において、回路部材の電極が半田で接合される場合、本実施形態の回路部材接続用樹脂シートを構成する材料は、フラックス機能を有する成分(以下「フラックス成分」ということがある。)を含有することが好ましい。フラックス成分は、電極表面に形成された金属酸化膜を除去する作用を有するものであり、半田による電極間の電気的接続をより確実なものとし、半田接合部における接続信頼性を高めることができる。 (3) Component having a flux function In the present embodiment, when the electrodes of the circuit member are joined by solder, the material constituting the resin sheet for connecting a circuit member of the present embodiment is a component having a flux function (hereinafter referred to as “flux”). It is preferable to contain a "component". The flux component has an action of removing the metal oxide film formed on the electrode surface, makes the electrical connection between the electrodes by solder more reliable, and can improve the connection reliability at the solder joint. .
ロジン誘導体としてはガムロジン、トールロジン、ウッドロジン、重合ロジン、水素添加ロジン、ホルミル化ロジン、ロジンエステル、ロジン変性マレイン酸樹脂、ロジン変性フェノール樹脂、ロジン変性アルキド樹脂、などが挙げられる。 Specific flux components include, for example, glutaric acid, 2-methylglutaric acid, orthoanisic acid, diphenolic acid, adipic acid, acetylsalicylic acid, benzoic acid, benzylic acid, azelaic acid, benzylbenzoic acid, malonic acid, 2, 2-bis (hydroxymethyl) propionic acid, salicylic acid, o-methoxybenzoic acid, m-hydroxybenzoic acid, succinic acid, 2,6-dimethoxymethylparacresol, benzoic hydrazide, carbohydrazide, malonic dihydrazide, succinic dihydrazide Glutaric acid dihydrazide, salicylic acid hydrazide, iminodiacetic acid dihydrazide, itaconic acid dihydrazide, citric acid trihydrazide, thiocarbohydrazide, benzophenone hydrazone, 4,4′-oxybisbenzenesulfonylhydrazide, adipic acid dihydride A hydrazide, a rosin derivative, etc. are mentioned, These can be used individually by 1 type or in combination of 2 or more types.
Examples of rosin derivatives include gum rosin, tall rosin, wood rosin, polymerized rosin, hydrogenated rosin, formylated rosin, rosin ester, rosin modified maleic resin, rosin modified phenolic resin, rosin modified alkyd resin, and the like.
本実施形態の回路部材接続用樹脂シートを構成する材料は、熱硬化性成分を含有することが好ましい。
熱硬化性成分としては、半導体チップ等の回路部材の接続用に通常用いられる接着剤成分であれば特に限定されない。具体的には、エポキシ樹脂、フェノール樹脂、メラミン樹脂、尿素樹脂、ポリエステル樹脂、ウレタン樹脂、アクリル樹脂、ポリイミド樹脂、ベンゾオキサジン樹脂などが挙げられ、これらは1種を単独でまたは2種以上を組み合わせて用いることができる。これらの中でも、接着性等の観点から、エポキシ樹脂およびフェノール樹脂が好ましく、エポキシ樹脂が特に好ましい。 (4) Thermosetting component It is preferable that the material which comprises the resin sheet for circuit member connection of this embodiment contains a thermosetting component.
The thermosetting component is not particularly limited as long as it is an adhesive component usually used for connecting circuit members such as semiconductor chips. Specific examples include epoxy resins, phenol resins, melamine resins, urea resins, polyester resins, urethane resins, acrylic resins, polyimide resins, benzoxazine resins, and the like. These may be used alone or in combination of two or more. Can be used. Among these, from the viewpoint of adhesiveness and the like, an epoxy resin and a phenol resin are preferable, and an epoxy resin is particularly preferable.
本実施形態の回路部材接続用樹脂シートを構成する材料が前述した熱硬化性成分を含有する場合、当該材料はさらに硬化剤および硬化触媒を含有することが好ましい。 (5) Curing Agent / Curing Catalyst When the material constituting the resin sheet for connecting circuit members of this embodiment contains the thermosetting component described above, the material preferably further contains a curing agent and a curing catalyst.
本実施形態に係る回路部材接続用樹脂シートは、当該樹脂シートを構成する材料として、さらに、可塑剤、安定剤、粘着付与材、着色剤、カップリング剤、帯電防止剤、酸化防止剤、導電性粒子等を含有してもよい。 (6) Other components The resin sheet for connecting circuit members according to the present embodiment further includes a plasticizer, a stabilizer, a tackifier, a colorant, a coupling agent, and an antistatic agent as a material constituting the resin sheet. Further, it may contain an antioxidant, conductive particles and the like.
本実施形態に係る回路部材接続用樹脂シートは、さらに剥離シートが積層されていてもよい。また、本実施形態に係る回路部材接続用樹脂シートにダイシングシートをさらに積層したダイシングシート一体型シート(ダイシング・ダイボンディングシート)としてもよく、バックグラインドシートをさらに積層したバックグラインドシート一体型接着シートとしてもよい。 3. Other Configurations The resin sheet for connecting circuit members according to the present embodiment may be further laminated with a release sheet. Also, a dicing sheet integrated sheet (dicing / die bonding sheet) obtained by further laminating a dicing sheet on the circuit member connecting resin sheet according to the present embodiment, or a back grind sheet integrated adhesive sheet obtained by further laminating a back grind sheet. It is good.
本実施形態に係る回路部材接続用樹脂シートは、従来の回路部材接続用樹脂シートと同様に製造することができる。例えば、回路部材接続用樹脂シートと剥離シートとの積層体を製造する場合、回路部材接続用樹脂シートを構成する材料、および所望によりさらに溶媒または分散媒を含有する塗工液を調製し、剥離シートの一の面上に、ダイコーター、カーテンコーター、スプレーコーター、スリットコーター、ナイフコーター等によりその塗工液を塗布して塗膜を形成し、当該塗膜を乾燥させることにより、剥離シートとの積層体の一部として樹脂シートを形成することができる。塗工液は、塗布を行うことが可能であればその性状は特に限定されず、樹脂シートを形成するための成分を溶質として含有する場合もあれば、分散質として含有する場合もある。この積層体における剥離シートは工程材料として剥離してもよいし、半導体ウエハやセラミックグリーンシート積層体等の被着体に貼付するまでの間、樹脂シートを保護していてもよい。 4). Manufacturing method of resin sheet for circuit member connection The resin sheet for circuit member connection which concerns on this embodiment can be manufactured similarly to the conventional resin sheet for circuit member connection. For example, when producing a laminate of a resin sheet for connecting a circuit member and a release sheet, a coating liquid containing a material constituting the resin sheet for connecting a circuit member and, if desired, further containing a solvent or a dispersion medium is prepared and peeled off. On one surface of the sheet, a coating film is formed by applying the coating liquid with a die coater, curtain coater, spray coater, slit coater, knife coater, etc. A resin sheet can be formed as a part of the laminate. The properties of the coating liquid are not particularly limited as long as it can be applied. The coating liquid may contain a component for forming a resin sheet as a solute or a dispersoid. The release sheet in the laminate may be peeled off as a process material, or the resin sheet may be protected until being attached to an adherend such as a semiconductor wafer or a ceramic green sheet laminate.
次に、本実施形態に係る回路部材接続用樹脂シートの使用方法について、フリップチップ実装に用いる場合を例にとって説明する。 5). Next, a method for using the resin sheet for connecting a circuit member according to the present embodiment will be described with reference to a case where it is used for flip chip mounting.
表1に示す構成成分を含有する組成物を、メチルエチルケトンにて固形分濃度が40質量%となるように希釈し、シリコーン処理された剥離フィルム(リンテック社製,SP-PET381031)上に塗布し、得られた塗膜をオーブンにて100℃で1分間乾燥し、厚さ45μmの塗膜を形成し、剥離フィルム上に形成されたフィルム状樹脂組成物を得た。その後、フィルム状樹脂組成物をポリオレフィン基材上に転写することで、回路部材接続用樹脂シートを得た。 [Examples 1 to 5, Comparative Example 1]
The composition containing the constituents shown in Table 1 was diluted with methyl ethyl ketone so that the solid content concentration was 40% by mass, and applied on a silicone-treated release film (SP-PET 381031 manufactured by Lintec Corporation). The obtained coating film was dried in an oven at 100 ° C. for 1 minute to form a coating film having a thickness of 45 μm, and a film-like resin composition formed on the release film was obtained. Then, the resin sheet for circuit member connection was obtained by transcribe | transferring a film-form resin composition on a polyolefin base material.
熱可塑性成分
・ポリビニルアセタール樹脂,ガラス転移温度:86℃,重量平均分子量:13万
・ポリビニルブチラール樹脂,ガラス転移温度:71℃,重量平均分子量:11万
・ポリエステル樹脂,ガラス転移温度:83℃,重量平均分子量:4万
・ビスフェノールA(BisA)型フェノキシ樹脂,ガラス転移温度:84℃,重量平均分子量:6万
・アクリル酸エステル,ガラス転移温度:-28℃,重量平均分子量:80万
熱硬化性成分
・ビスフェノールA(BisA)型エポキシ樹脂,エポキシ当量:180-190g/eq
無機フィラー
・シリカフィラー,平均粒径:100nm Here, the detail of the component shown in Table 1 is as follows.
Thermoplastic component polyvinyl acetal resin, a glass transition temperature: 86 ° C., a weight average molecular weight: 130,000 Polyvinyl butyral resin, a glass transition temperature: 71 ° C., a weight average molecular weight: 110,000 polyester resin, a glass transition temperature: 83 ° C., Weight average molecular weight: 40,000 · Bisphenol A (BisA) type phenoxy resin, glass transition temperature: 84 ° C, weight average molecular weight: 60,000 · acrylic ester, glass transition temperature: -28 ° C, weight average molecular weight: 800,000
Thermosetting component , bisphenol A (BisA) type epoxy resin, epoxy equivalent: 180-190 g / eq
Inorganic filler / silica filler, average particle size: 100 nm
・カラム :「TSK guard column HXL-L」、「TSK gel G2500HXL」、「TSK gel G2000HXL」、「TSK gel G1000HXL」(いずれも東ソー社製)を順次連結したもの
・カラム温度:40℃
・展開溶媒 :テトラヒドロフラン
・流速 :1.0mL/min
・検出器 :示差屈折計
・標準試料 :ポリスチレン <GPC measurement conditions>
Column: “TSK guard column HXL-L”, “TSK gel G2500HXL”, “TSK gel G2000HXL”, “TSK gel G1000HXL” (all manufactured by Tosoh Corporation) • Column temperature: 40 ° C.
・ Developing solvent: Tetrahydrofuran ・ Flow rate: 1.0 mL / min
・ Detector: Differential refractometer ・ Standard sample: Polystyrene
実施例および比較例で作成した回路部材接続用樹脂シートを、5×20mmに切断し、測定用サンプルとした。得られたサンプルを160℃で1時間処理することにより硬化させた。得られた硬化物について、動的粘弾性測定機器(ティー・エイ・インスツルメント社製,DMA Q800)を使用し、周波数11Hz、振幅10μm、昇温速度3℃/分で、0℃から300℃まで昇温させたときの引張モードによる粘弾性を測定し、この測定で得られたtanδ(損失弾性率/貯蔵弾性率)の最大点の温度をガラス転移温度(Tg)とした。測定結果を第1表に示す。 [Test Example 1] Measurement of glass transition temperature of cured product The resin sheet for connecting circuit members prepared in Examples and Comparative Examples was cut into 5 × 20 mm to obtain a measurement sample. The obtained sample was cured by treating at 160 ° C. for 1 hour. About the obtained hardened | cured material, using a dynamic viscoelasticity measuring apparatus (The product made from TA instrument company, DMA Q800), frequency 11Hz, amplitude 10micrometer, and the temperature increase rate of 3 degree-C / min, 0 to 300 degreeC The viscoelasticity in the tensile mode when the temperature was raised to ° C. was measured, and the temperature at the maximum point of tan δ (loss elastic modulus / storage elastic modulus) obtained by this measurement was defined as the glass transition temperature (Tg). The measurement results are shown in Table 1.
実施例および比較例で作成した回路部材接続用樹脂シートを、15×4.5mmに切断し、測定用サンプルとした。得られたサンプルを160℃で1時間処理することにより硬化させた。得られた硬化物について、熱機械分析装置(ブルカー・エイエックス社製,TMA4030SA)を用い、荷重2g、温度範囲0~300℃、昇温速度5℃/minの条件にて線膨張係数を測定した。得られた結果より、0~130℃での平均線膨張係数を算出した。結果を表1に示す。 [Test Example 2] Measurement of average linear expansion coefficient The resin sheet for connecting circuit members prepared in Examples and Comparative Examples was cut into 15 x 4.5 mm to obtain measurement samples. The obtained sample was cured by treating at 160 ° C. for 1 hour. Using the thermomechanical analyzer (manufactured by Bruker Ax, TMA4030SA), the coefficient of linear expansion was measured under the conditions of a load of 2 g, a temperature range of 0 to 300 ° C., and a heating rate of 5 ° C./min. did. From the obtained results, the average linear expansion coefficient at 0 to 130 ° C. was calculated. The results are shown in Table 1.
実施例および比較例で作成した回路部材接続用樹脂シートを、ダイシング済み100μmチップ(ウォルツ社製TEGウエハ:CC80-0101JY Model I)にラミネートし、樹脂シート付きTEGチップを得た。得られた樹脂シート付きTEGチップを、FCボンダー(東レエンジニアリング社製,FC3000W)を用いて基板にフリップチップボンディングし、半導体装置を製造した。得られた半導体装置を、-55℃10分および125℃10分を1サイクルとする環境下に1000サイクル付し、試験後の半導体装置について、半導体チップと回路基板の接続抵抗値をデジタルマルチメーターで測定し、以下の評価基準に従って接続信頼性を評価した。結果を表1に示す。
○:接続抵抗値の変化率が20%以下
×:接続抵抗値の変化率が20%超 [Test Example 3] Temperature cycle test The circuit member connecting resin sheet prepared in the examples and comparative examples was laminated on a diced 100 μm chip (TEG wafer manufactured by Waltz: CC80-0101JY Model I), and a TEG chip with a resin sheet Got. The obtained TEG chip with a resin sheet was flip-chip bonded to a substrate using an FC bonder (manufactured by Toray Engineering Co., Ltd., FC3000W) to manufacture a semiconductor device. The obtained semiconductor device is subjected to 1000 cycles in an environment where −55 ° C. for 10 minutes and 125 ° C. for 10 minutes is one cycle, and the connection resistance value between the semiconductor chip and the circuit board for the tested semiconductor device is a digital multimeter. The connection reliability was evaluated according to the following evaluation criteria. The results are shown in Table 1.
○: Change rate of connection resistance value is 20% or less ×: Change rate of connection resistance value exceeds 20%
Claims (10)
- 相対向する電極間に介在され、前記相対向する電極を電気的に接続するために用いられる回路部材接続用樹脂シートであって、
前記樹脂シートを構成する材料の硬化物は、ガラス転移温度が150~350℃であり、かつ、0~130℃における平均線膨張係数が45ppm以下である
ことを特徴とする回路部材接続用樹脂シート。 A resin sheet for connecting a circuit member, which is interposed between electrodes facing each other and used to electrically connect the electrodes facing each other,
The cured product of the material constituting the resin sheet has a glass transition temperature of 150 to 350 ° C. and an average linear expansion coefficient at 0 to 130 ° C. of 45 ppm or less, and is a resin sheet for connecting circuit members . - 前記樹脂シートを構成する材料は、ポリビニルアセタール樹脂、およびポリエステル樹脂からなる群より選択される1種以上の熱可塑性成分を含有することを特徴とする請求項1に記載の回路部材接続用樹脂シート。 2. The resin sheet for connecting a circuit member according to claim 1, wherein the material constituting the resin sheet contains one or more thermoplastic components selected from the group consisting of a polyvinyl acetal resin and a polyester resin. .
- 前記樹脂シートを構成する材料は、前記熱可塑性成分として、さらにフェノキシ樹脂を含有することを特徴とする請求項2に記載の回路部材接続用樹脂シート。 3. The resin sheet for connecting circuit members according to claim 2, wherein the material constituting the resin sheet further contains a phenoxy resin as the thermoplastic component.
- 前記樹脂シートを構成する材料は、無機フィラーを含有することを特徴とする請求項1~3のいずれか一項に記載の回路部材接続用樹脂シート。 The resin sheet for connecting circuit members according to any one of claims 1 to 3, wherein the material constituting the resin sheet contains an inorganic filler.
- 前記無機フィラーはシリカフィラーであることを特徴とする請求項4に記載の回路部材接続用樹脂シート。 The circuit sheet connecting resin sheet according to claim 4, wherein the inorganic filler is a silica filler.
- 前記無機フィラーの平均粒径は10~200nmであることを特徴とする請求項4または5に記載の回路部材接続用樹脂シート。 6. The resin sheet for connecting circuit members according to claim 4, wherein the inorganic filler has an average particle size of 10 to 200 nm.
- 前記樹脂シートを構成する材料は、前記無機フィラーを35~64質量%含有することを特徴とする請求項4~6のいずれか一項に記載の回路部材接続用樹脂シート。 7. The resin sheet for connecting circuit members according to claim 4, wherein the material constituting the resin sheet contains 35 to 64% by mass of the inorganic filler.
- 前記樹脂シートを構成する材料は、フラックス機能を有する成分を含有することを特徴とする請求項1~7のいずれか一項に記載の回路部材接続用樹脂シート。 The resin sheet for connecting circuit members according to any one of claims 1 to 7, wherein the material constituting the resin sheet contains a component having a flux function.
- 前記フラックス機能を有する成分として、カルボキシル基を有する成分を含有することを特徴とする請求項8に記載の回路部材接続用樹脂シート。 9. The resin sheet for connecting circuit members according to claim 8, wherein the component having a flux function contains a component having a carboxyl group.
- 前記カルボキシル基を有する成分が2-メチルグルタル酸であることを特徴とする請求項9に記載の回路部材接続用樹脂シート。 10. The resin sheet for connecting circuit members according to claim 9, wherein the component having a carboxyl group is 2-methylglutaric acid.
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