JP2012195414A - Dicing tape integrated adhesive sheet, multilayer circuit board, electronic component and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dicing tape integrated adhesive sheet exhibiting excellent workability which can connect terminals of members facing each other and seal a gap between the members simultaneously, can connect terminals of members facing each other reliably, and has an adhesive film less prone to generate out gas and bubbles.SOLUTION: A dicing tape integrated adhesive sheet 10 has a laminate structure consisting of an adhesive film 3 which bonds a support and a bonded body by connecting a first terminal of the support and a second terminal of the bonded body electrically by using solder, and a dicing tape 2. The minimum melting viscosity of the adhesive film 3 is 0.01-100,000 Pa s or lower, and when the exothermic peak temperature of the adhesive film 3 is defined as (a), and the 5% weight loss on heating temperature of the adhesive film 3 is defined as (b), the problems can be solved by a dicing tape integrated adhesive sheet 10 satisfying the following formula (1): (b)-(a)≥100°C...(1).

Description

  The present invention relates to a dicing tape-integrated adhesive sheet, a multilayer circuit board, an electronic component, and a semiconductor device.

In recent years, electronic devices such as semiconductor packages have been integrated with high density and high density packaging in response to the demands for higher functionality and lighter, thinner and shorter electronic devices. These electronic components have become smaller and more pins. It is out. In order to obtain an electrical connection between these electronic components, solder bonding is used.
Examples of the solder bonding include a conductive bonding portion between semiconductor chips, a conductive bonding portion between a semiconductor chip such as a package mounted in a flip chip and a circuit board, a conductive bonding portion between circuit boards, and the like. In order to ensure electrical connection strength and mechanical connection strength, a sealing resin generally called an underfill material is injected into the solder joint portion (underfill sealing).

  When the gap (gap) generated by this solder joint is reinforced with a liquid sealing resin (underfill material), the liquid sealing resin (underfill material) is supplied after the solder joint, and the solder is bonded by curing it. The part is reinforced. However, as the electronic components become thinner and smaller, the solder joints are narrowed in pitch / narrow gap. Therefore, even if liquid sealing resin (underfill material) is supplied after soldering, the liquid sealing between the gaps There is a problem that the stop resin (underfill material) does not spread and it becomes difficult to completely fill the resin.

  In order to solve such a problem, a method is known in which electrical connection and adhesion between terminals are collectively performed through an anisotropic conductive film. For example, an adhesive film containing solder particles is interposed between members and thermocompression bonded so that the solder particles are interposed between the terminals of both members and the resin component is filled in the other part, or metal particles are brought into contact with each other. Describes a method of establishing an electrical connection (for example, Patent Documents 1 and 2).

  However, in this method, since conductive particles exist between adjacent terminals, insulation between adjacent terminals is ensured and bubbles exist between adjacent terminals, so that reliability of electronic components and semiconductor devices is improved. It was difficult to secure.

JP-A 61-276873 JP-A-9-31419

  The object of the present invention is to simultaneously connect the terminals of the opposing members and seal the gaps between the members, to reliably connect the terminals of the opposing members, and to further reduce the outgas An object of the present invention is to provide a dicing tape-integrated adhesive sheet that generates less bubbles. Another object is to provide a multilayer circuit board, an electronic component, and a semiconductor device having high electrical connection reliability and less bubbles.

Such an object is achieved by the following (1) to (14).
(1) An adhesive film for electrically connecting the first terminal of the support and the second terminal of the adherend using solder, and bonding the support and the adherend, and a dicing tape A dicing tape-integrated adhesive sheet having a laminated structure comprising:
The minimum melt viscosity of the adhesive film is 0.01 to 100,000 Pa · s or less, the exothermic peak temperature of the adhesive film is (a), and the 5% weight loss on heating weight of the adhesive film is (b). A dicing tape integrated adhesive sheet characterized by satisfying the following formula (1) when defined:
(B)-(a) ≧ 100 ° C. (1)
(2) The adhesive film according to (1), comprising (A) a thermosetting resin, (B) a curing agent, (C) a compound having a flux function, and (D) a film-forming resin.
(3) Said (2) whose compounding ratio ((A) / (C)) of said (A) thermosetting resin and said (C) compound which has a flux function is 0.5-20.0. The dicing tape-integrated adhesive sheet as described in 1.
(4) The dicing tape-integrated adhesive sheet according to (2) or (3), wherein the content of the (A) thermosetting resin is 5 to 80% by weight.
(5) The dicing tape-integrated adhesive sheet according to any one of (2) to (4), wherein the (A) thermosetting resin is an epoxy resin.
(6) The dicing tape integrated type according to any one of (2) to (5), wherein the compound having the flux function (C) is a compound having a flux function having a carboxyl group and / or a phenolic hydroxyl group. Adhesive sheet.
(7) The compound (C) having a flux function is a compound having a flux function having two phenolic hydroxyl groups in one molecule and a carboxyl group directly bonded to at least one aromatic group. The dicing tape-integrated adhesive sheet according to any one of (2) to (6).
(8) The dicing tape-integrated adhesive sheet according to (2) to (7), wherein the compound having the (C) flux function includes a compound represented by the following general formula (2).
_{HOOC- (CH 2) n-COOH} (2)
(In Formula (2), n is an integer of 1-20.)
(9) The dicing tape according to any one of (2) to (8), wherein the compound having the (C) flux function includes a compound represented by the following general formula (3) and / or (4): Body adhesive sheet.

［式中、Ｒ^１〜Ｒ^５は、それぞれ独立して、１価の有機基であり、Ｒ^１〜Ｒ^５の少なくとも一つは水酸基である。］

[Wherein, R ^{1 to} R ⁵ are each independently a monovalent organic group, and at least one of R ^{1 to} R ⁵ is a hydroxyl group. ]

［式中、Ｒ^６〜Ｒ^２０は、それぞれ独立して、１価の有機基であり、Ｒ^６〜Ｒ^２０の少なくとも一つは水酸基又はカルボキシル基である。］
（１０） 前記接着フィルムが、さらに充填材を含む上記（１）ないし（９）のいずれかに記載のダイシングテープ一体型接着シート。
（１１） 前記充填材の含有量が、０．１重量％以上８０重量％未満である上記（１０）に記載のダイシングテープ一体型接着シート。
（１２） 上記（１）ないし（１１）のいずれかに記載の接着フィルムの硬化物を有することを特徴とする多層回路基板。
（１３） 上記（１）ないし（１１）のいずれかに記載の接着フィルムの硬化物を有することを特徴とする電子部品。
（１４） 上記（１）ないし（１１）のいずれかに記載の接着フィルムの硬化物を有することを特徴とする半導体装置。

[Wherein, R ^{6 to} R ²⁰ are each independently a monovalent organic group, and at least one of R ^{6 to} R ²⁰ is a hydroxyl group or a carboxyl group. ]
(10) The dicing tape-integrated adhesive sheet according to any one of (1) to (9), wherein the adhesive film further includes a filler.
(11) The dicing tape-integrated adhesive sheet according to (10), wherein the content of the filler is 0.1 wt% or more and less than 80 wt%.
(12) A multilayer circuit board comprising a cured product of the adhesive film according to any one of (1) to (11).
(13) An electronic component comprising a cured product of the adhesive film according to any one of (1) to (11).
(14) A semiconductor device comprising a cured product of the adhesive film according to any one of (1) to (11).

  According to the present invention, the connection between the terminals of the opposing members and the sealing of the gap between the members can be performed simultaneously, the terminals of the opposing members can be reliably connected, and the outgas is further reduced. A dicing tape-integrated adhesive sheet with less generation of bubbles can be provided. In addition, according to the present invention, it is possible to provide a multilayer circuit board, an electronic component, and a semiconductor device having high electrical connection reliability and few bubbles.

FIG. 1 is a cross-sectional view schematically showing an example of a semiconductor device manufacturing method using the dicing tape-integrated adhesive sheet of the present invention. FIG. 2 is a cross-sectional view schematically showing an example of a method for manufacturing a semiconductor device using the dicing tape-integrated adhesive sheet of the present invention. FIG. 3 is a cross-sectional view schematically showing an example of a manufacturing method of the dicing tape-integrated adhesive sheet of the present invention.

Hereinafter, the dicing tape integrated adhesive sheet, multilayer circuit board, electronic component, and semiconductor device of the present invention will be described.
The dicing tape-integrated adhesive sheet of the present invention is formed by electrically connecting the first terminal of the support and the second terminal of the adherend using solder, and connecting the support and the adherend. A dicing tape integrated adhesive sheet having a laminated structure composed of an adhesive film to be bonded and a dicing tape,
The minimum melt viscosity of the adhesive film is 0.01 to 100,000 Pa · s or less, the exothermic peak temperature of the adhesive film is (a), and the 5% weight loss on heating weight of the adhesive film is (b). When defined, the following formula (1) is satisfied.
(B)-(a) ≧ 100 ° C. (1)
The multilayer circuit board, the electronic component, and the semiconductor device of the present invention electrically connect the support having the first terminal and the adherend having the second terminal using the adhesive film. The support and the adherend are bonded together.

  Hereinafter, the dicing tape integrated adhesive sheet, multilayer circuit board, electronic component, and semiconductor device of the present invention will be described in detail.

  The dicing tape-integrated adhesive sheet of the present invention is formed by electrically connecting the first terminal of the support and the second terminal of the adherend using solder, and connecting the support and the adherend. An adhesive film to be bonded and a dicing tape are essential components. In addition, an intervening layer and an outer layer described later may be provided. The configuration of each part of the dicing tape integrated adhesive sheet will be described in detail sequentially.

(Dicing tape)
As the dicing tape, any dicing tape generally used can be used.
Specifically, what is comprised with the 1st resin composition containing an acrylic adhesive, a rubber adhesive, etc. can be used as a dicing tape.

  Examples of the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, Copolymers with styrene, acrylonitrile, etc.) are used. Two or more kinds of these copolymers may be mixed.

  Of these, one or more selected from the group consisting of methyl (meth) acrylate, ethylhexyl (meth) acrylate and butyl (meth) acrylate, and selected from hydroxyethyl (meth) acrylate and vinyl acetate Preferred are copolymers with one or more of the above. Thereby, the adhesiveness and adhesiveness control with the other party (adhered body) to which the dicing tape 2 adheres can be easily controlled.

  In addition, the first resin composition includes urethane acrylate, acrylate monomer, polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate) in order to control adhesiveness (adhesiveness). Monomers and oligomers such as isocyanate compounds may be added.

  Furthermore, you may add the photoinitiator similar to the 2nd resin composition mentioned later to a 1st resin composition.

  Also, for the purpose of increasing adhesive strength and shear strength, tackifying rosin resin, terpene resin, coumarone resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic petroleum resin, etc. An agent or the like may be added.

  The average thickness of such a dicing tape is not particularly limited, but is preferably about 1 to 100 μm, and more preferably about 3 to 20 μm. When the average thickness of the dicing tape is within the above range, the shape following property of the dicing tape is ensured, and the adhesion of the adhesive film to the semiconductor wafer can be further enhanced.

  Although the intervening layer will be described later, in the dicing tape-integrated adhesive sheet, when the intervening layer is provided between the dicing tape and the adhesive film, the dicing tape preferably has higher adhesiveness than the intervening layer. Thereby, the adhesive force of the dicing tape with respect to an intervening layer and a support film becomes larger than the adhesive force of the intervening layer with respect to an adhesive film. Therefore, in a pickup process in manufacturing a semiconductor device described later, it is possible to cause peeling at a desired interface (that is, an interface between the intervening layer and the adhesive film) where peeling should occur.

  In addition, by increasing the adhesiveness of the dicing tape, in the second step of manufacturing the semiconductor device described later, when the semiconductor wafer is diced into individual pieces, the gap between the dicing tape and the wafer ring is ensured. It will be fixed. As a result, the positional deviation of the semiconductor wafer is reliably prevented, and the dimensional accuracy of the semiconductor element can be increased.

(Adhesive film)
In the adhesive film of the present invention, the minimum melt viscosity of the adhesive film is 0.01 to 100,000 Pa · s, and the exothermic peak temperature of the adhesive film is (a). When the temperature is defined as (b), the following formula (1) is satisfied.
(B)-(a) ≧ 100 ° C. (1)

  By setting the minimum melt viscosity of the adhesive film to 0.01 to 100,000 Pa · s, the adhesive film is interposed between the first terminal of the opposite support and the second terminal of the adherend. It is possible to ensure good connection reliability when the film is heated and melted to electrically connect the support and the adherend and further adhere.

  By setting the minimum melt viscosity to 0.01 Pa · s or more, it is possible to prevent the molten adhesive film from creeping up and contaminating the support or the adherend. In addition, by setting the melt viscosity to 100,000 Pa · s or less, it is possible to prevent a poor conduction due to the adhesive film melted between the terminals facing each other.

  The minimum melt viscosity is preferably 0.02 Pa · s or more, particularly 0.05 Pa · s or more. Thereby, it can prevent more effectively that the fuse | melted adhesive film crawls and contaminates a support body or a to-be-adhered body. The minimum melt viscosity is preferably 70,000 Pa · s or less, particularly preferably 30,000 Pa · s or less. Thereby, it can prevent more effectively that the adhesive film which fuse | melted between the terminals which oppose is bitten, and electrical conduction failure generate | occur | produces.

  Here, the minimum melt viscosity of the adhesive film was measured using a viscoelasticity measuring device ("RheoStress RS150" manufactured by HAAKE), a parallel plate of 20 mmφ, a gap of 0.05 mm, a frequency of 0.1 Hz, and a heating rate of 10 ° C. It can be measured under the conditions of / min.

Further, when the exothermic peak temperature of the adhesive film is defined as (a) and the 5% weight loss on heating temperature of the adhesive film is defined as (b), by satisfying the following formula (1), When the adhesive film is heated and melted between the second terminal of the adherend and the second terminal of the adherend, the support film and the adherend are electrically connected, and further, bubbles are generated when the adhesive is adhered. Since generation | occurrence | production can be prevented, the reliability of the produced multilayer circuit board, an electronic component, and a semiconductor device can be improved.
(B)-(a) ≧ 100 ° C. (1)

  The larger the difference between the 5% weight loss on heating (b) and the exothermic peak temperature (a) of the adhesive film, the more difficult it is to generate outgas by heating the adhesive film. Can be prevented. Furthermore, even when outgas is generated, outgas is generated behind the curing reaction of the adhesive film, and it is difficult for the outgas to move through the three-dimensional adhesive film. Can be prevented.

  The difference between the 5% weight loss on heating (b) and the exothermic peak temperature (a) of the adhesive film is preferably 120 ° C. or higher, particularly 150 ° C. or higher. Thereby, generation | occurrence | production of the outgas of an adhesive film can be prevented more effectively. Further, even if outgas is generated, it is difficult for the outgas to move in the adhesive film, so that the generation of bubbles after electrical connection and bonding can be more effectively prevented.

  Here, the exothermic peak temperature (b) of the adhesive film can be measured with a differential scanning calorimeter (DSC-6200, manufactured by Seiko Instruments Inc.) at a heating rate of 10 ° C./min.

  The 5% weight loss on heating (a) of the adhesive film was measured at a heating rate of 10 ° C./min using a thermogravimetric / differential heat simultaneous measurement apparatus (TG / DTA6200, manufactured by Seiko Instruments Inc.). can do.

  The method of setting the difference between the 5% weight loss on heating (b) and the exothermic peak temperature (a) of the adhesive film in the above range is not particularly limited, but (A) a thermosetting resin, (B It can be carried out by appropriately adjusting the softening point and content of the curing agent and (C) the compound having a flux function, and further the content of the low molecular component.

  The adhesive film preferably contains (A) a thermosetting resin, (B) a curing agent, (C) a compound having a flux function, and (D) a film-forming resin. By including (A) a thermosetting resin, (B) a curing agent, and (D) a film-forming resin, the melt viscosity of the adhesive film can be easily adjusted to the above range. By appropriately selecting the softening point and blending amount of (A) thermosetting resin, (B) curing agent, and D) film-forming resin, the optimum melt viscosity can be adjusted.

(A) Thermosetting resin The (A) thermosetting resin according to the present invention is not particularly limited. For example, epoxy resin, phenoxy resin, silicone resin, oxetane resin, phenol resin, (meth) acrylate resin , Polyester resin (unsaturated polyester resin), diallyl phthalate resin, maleimide resin, polyimide resin (polyimide precursor resin), bismaleimide-triazine resin, and the like. In particular, the use of a thermosetting resin containing at least one selected from the group consisting of epoxy resins, (meth) acrylate resins, phenoxy resins, polyester resins, polyimide resins, silicone resins, maleimide resins, and bismaleimide-triazine resins. preferable. Among these, an epoxy resin is preferable from the viewpoint of excellent curability and storage stability, heat resistance of the cured product, moisture resistance, and chemical resistance. Moreover, these thermosetting resins may be used individually by 1 type, or may use 2 or more types together.

Although content of the said (A) thermosetting resin is not necessarily limited, 5 to 80 weight% is preferable, 8-75 weight% is preferable and 10 to 55 weight% is especially preferable. (A) By making content of thermosetting resin more than the said lower limit, since the heat resistance of the adhesive film after hardening improves, it can improve the reliability of a multilayer circuit board, an electronic component, and a semiconductor device. it can.
Moreover, since it can prevent that the elasticity modulus of the adhesive film after hardening becomes high too much by setting it as the said upper limit or less, the adhesiveness of a support body and a to-be-adhered body can be improved.

  The epoxy resin is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type An epoxy resin, a trifunctional epoxy resin, a tetrafunctional epoxy resin, etc. are mentioned.

  More preferably, the epoxy resin has a viscosity at 25 ° C. of 500 to 50,000 mPa · s, more preferably 800 to 40,000 mPa · s, and the viscosity at 25 ° C. By setting it to the lower limit value or more, the flexibility and flexibility of the adhesive film can be ensured. Moreover, the tack property of an adhesive film becomes strong by making the viscosity in 25 degreeC below the said upper limit, and it can prevent that handling property falls.

  Moreover, although content of the said epoxy resin is not specifically limited, 10 to 80 weight% is preferable and 8 to 75 weight% is especially preferable. By setting it as the said lower limit or more, the softness | flexibility and flexibility of an adhesive film can be expressed more effectively. Moreover, by setting it as the said upper limit or less, the tack property of an adhesive film becomes strong and it can prevent more effectively that handling property falls.

  Among the epoxy resins, it is easy to adjust both the melt viscosity of the adhesive film in the range of 0.01 to 100,000 Pa · s and the workability (tackiness and flexibility) of the adhesive film. The bisphenol A type epoxy resin and the liquid bisphenol F type epoxy resin are preferred.

(B) Curing Agent The (B) curing agent according to the present invention is not particularly limited, and can be appropriately selected depending on the type of the (A) thermosetting resin to be used. Examples of the curing agent (B) include phenols, amines, thiols, acid anhydrides, isocyanates, organic peroxides, azo compounds, and the like. You may use the above together.

  When an epoxy resin is used as the (A) thermosetting resin, the (B) curing agent is preferably a phenol. (B) By using phenols as the curing agent, the heat resistance of the adhesive film after curing can be increased and the water absorption rate can be decreased, so that the reliability of multilayer circuit boards, electronic components and semiconductor devices can be improved. Can be improved.

  Examples of the phenols include, but are not limited to, phenol novolak resins, cresol novolak resins, bisphenol A type novolak resins, bisphenol F type novolak resins, bisphenol AF type novolak resins, and the like. Phenol novolak resins and cresol novolak resins that can effectively increase the glass transition temperature of the product and can reduce components that cause outgassing are preferable.

  The phenol novolac resin or the cresol novolak resin preferably has a total content of 1 to 3 nuclei of 30 to 70%. Thereby, the glass transition temperature of the hardened | cured material of an adhesive film can be raised, the quantity of the phenol-type novolak resin used as outgas can be reduced, and it becomes possible to improve ion migration resistance. Moreover, since moderate softness | flexibility can be provided to an adhesive film, it becomes possible to improve the brittleness of an adhesive film. Furthermore, since an appropriate tackiness can be imparted to the adhesive film, an adhesive film excellent in workability can be obtained.

  When the total content of the mononuclear body to the trinuclear body is smaller than 30% (the total content of the 4-nuclear body or more is 70% or more), the reactivity with the epoxy resin is lowered, and the adhesive film is cured. Since unreacted phenolic novolak resin remains in the product, the migration resistance is lowered, and the adhesive film becomes brittle and the workability may be lowered. In addition, when the total content of the mononuclear to trinuclear is greater than 70% (the total content of four or more nuclei is 30% or less), the amount of outgas when curing the adhesive film increases, There is a possibility that the surface of the support or the adherend is contaminated, migration resistance is lowered, tackiness of the adhesive film is increased, and workability of the adhesive film is lowered.

The total content of the binuclear body and the trinuclear body in the phenol novolac resin or cresol novolac resin is not particularly limited, but is preferably 30 to 70%.
By setting it to the above lower limit value or more, it is possible to more effectively prevent the amount of outgas when the adhesive film is cured and contaminate the surface of the support or adherend. Moreover, the softness | flexibility and flexibility of an adhesive film can be more effectively ensured by setting it as the said upper limit or less.

  The content of the mononuclear body in the phenol novolac resin or the cresol novolac resin is not particularly limited, but is preferably 1% or less in the adhesive film, and particularly preferably 0.8% or less. preferable. By setting the content of the mononuclear body within the above range, the amount of outgas when curing the adhesive film can be reduced, contamination of the support or adherend can be suppressed, and further, Migration can be improved.

  The weight average molecular weight of the phenol novolak resin or cresol novolak resin is not particularly limited, but is preferably 300 to 1,500, and particularly preferably 400 to 1,400. By setting it to the above lower limit value or more, it is possible to more effectively prevent the amount of outgas when the adhesive film is cured and contaminate the surface of the support or adherend. Also. By setting it as the upper limit value or less, the flexibility and flexibility of the adhesive film can be more effectively ensured.

  The adhesive film of the present invention contains (C) a compound having a flux function. Thereby, the oxide film on the solder surface of at least one of the first terminal of the support and the second terminal of the adherend is removed, and in some cases, the first terminal of the support or the adherend Since the oxide film on the surface of the second terminal can be removed and the first terminal and the second terminal can be surely soldered, a multilayer circuit board with high connection reliability, an electronic component, A semiconductor device or the like can be obtained.

  The compound having the flux function (C) is not particularly limited as long as it has a function of removing an oxide film on the solder surface, but is either a carboxyl group or a phenolic hydroxyl group, or a carboxyl group and phenol. Compounds having both hydroxyl groups are preferred.

  The compounding amount of the compound having the (C) flux function is preferably 1 to 30% by weight, particularly preferably 3 to 20% by weight. (C) When the compounding quantity of the compound which has a flux function is the said range, while being able to improve a flux activity, when an adhesive film is hardened, (A) thermosetting resin which is unreacted, ( C) A compound having a flux function remains, and it is possible to prevent outgassing when the adhesive film is thermally cured, and migration resistance can be improved.

In addition, among the compounds that act as curing agents for epoxy resins, there are (C) compounds having a flux function (hereinafter, such compounds are also referred to as flux active curing agents).
For example, aliphatic dicarboxylic acids, aromatic dicarboxylic acids and the like that act as curing agents for epoxy resins also have a flux action. In the present invention, such a flux active curing agent that acts as a flux and also acts as a curing agent for an epoxy resin can be suitably used.

  The compound having a carboxyl group (C) having a flux function means a compound having one or more carboxyl groups in the molecule, and may be liquid or solid. In addition, the compound having a phenolic hydroxyl group (C) having a flux function means a compound having one or more phenolic hydroxyl groups in the molecule, and may be liquid or solid. Moreover, the compound having a carboxyl function and a phenolic hydroxyl group (C) having a flux function means a compound in which one or more carboxyl groups and phenolic hydroxyl groups are present in the molecule. Also good.

  Of these, (C) the compound having a flux function having a carboxyl group includes aliphatic acid anhydrides, alicyclic acid anhydrides, aromatic acid anhydrides, aliphatic carboxylic acids, aromatic carboxylic acids, and the like. It is done.

  Examples of the aliphatic acid anhydride according to the compound having a carboxyl group (C) having a flux function include succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, and polysebacic acid anhydride.

  Examples of the alicyclic acid anhydride relating to the compound having the carboxyl group (C) having a flux function include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydroanhydride Examples include phthalic acid, trialkyltetrahydrophthalic anhydride, and methylcyclohexene dicarboxylic acid anhydride.

  The aromatic acid anhydride relating to the compound having the carboxyl group (C) having a flux function includes phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, Examples thereof include glycerol tristrimate.

Examples of the aliphatic carboxylic acid related to the compound having the carboxyl group (C) having a flux function include compounds represented by the following general formula (1), formic acid, acetic acid, propionic acid, butyric acid, valeric acid, and caproic acid pivalate. , Caprylic acid, lauric acid, myristic acid, palmitic acid, stearic acid, acrylic acid, methacrylic acid, crotonic acid, oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid, oxalic acid and the like.
_{HOOC- (CH 2) n -COOH (} 1)
(In formula (1), n represents an integer of 1 or more and 20 or less.)

  Among the aliphatic carboxylic acids, (C) the activity of the compound having a flux function, the amount of outgas generated when the adhesive film is cured, the elastic modulus of the adhesive film after curing, the glass transition temperature, and the like are well balanced. In this respect, the compound represented by the general formula (1) is preferable. And among the compounds shown by said general formula (1), while the compound whose n in Formula (1) is 3-10 can suppress that the elasticity modulus in the adhesive film after hardening increases. It is particularly preferable in that the adhesion between the support and the adherend can be improved.

Among the compounds represented by the general formula (1), as the compound in which n in the formula (1) is 3 to 10, for example, n = 3 glutaric acid (HOOC— (CH ₂ ) ₃ —COOH), n = 4 adipic acid (HOOC— (CH ₂ ) ₄ —COOH), n = 5 pimelic acid (HOOC— (CH ₂ ) ₅ —COOH), n = 8 sebacic acid (HOOC— (CH ₂ ) ₈ -COOH) and of _{n = 10 HOOC- (CH 2)} 10 -COOH- , and the like.

  Examples of the aromatic carboxylic acid related to the compound having a carboxyl group (C) having a flux function include (C) a compound having a flux function represented by the following general formula (3) or (4).

［式中、Ｒ^１〜Ｒ^５は、それぞれ独立して、１価の有機基であり、Ｒ^１〜Ｒ^５の少なくとも一つは水酸基である。］

[Wherein, R ^{1 to} R ⁵ are each independently a monovalent organic group, and at least one of R ^{1 to} R ⁵ is a hydroxyl group. ]

［式中、Ｒ^６〜Ｒ^２０は、それぞれ独立して、１価の有機基であり、Ｒ^６〜Ｒ^２０の少なくとも一つは水酸基又はカルボキシル基である。］

[Wherein, R ^{6 to} R ²⁰ are each independently a monovalent organic group, and at least one of R ^{6 to} R ²⁰ is a hydroxyl group or a carboxyl group. ]

Examples of the aromatic carboxylic acid include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, merophanic acid, planitic acid, pyromellitic acid, merit acid, triylic acid, and xylyl. Acid, hemelic acid, mesitylene acid, prenylic acid, toluic acid, cinnamic acid, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2, 6-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid Examples thereof include naphthoic acid derivatives such as acid, phenolphthaline, and diphenolic acid.

  Among the compounds having the (C) flux function represented by the general formula (3) or (4), from the viewpoint of improving the formation of a three-dimensional network of the epoxy resin after curing, in one molecule. A compound having two or more phenolic hydroxyl groups that can be added to an epoxy resin and one or more carboxyl groups directly bonded to an aromatic group exhibiting a flux action (reduction action) is preferable. Such flux active curing agents include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,4- Benzoic acid derivatives such as dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,7- Examples thereof include naphthoic acid derivatives such as dihydroxy-2-naphthoic acid; phenolphthaline; and diphenolic acid. These may be used alone or in combination of two or more. Among these, 2,3-dihydroxybenzoic acid, gentisic acid, and phenolphthaline, which are excellent in the effect of removing the oxide film on the solder surface and the reactivity with the epoxy resin, are preferable.

  Examples of the compound having a phenolic hydroxyl group (C) having a flux function include phenols, and specifically, for example, phenol, o-cresol, 2,6-xylenol, p-cresol, m-cresol, o-ethylphenol, 2,4-xylenol, 2,5 xylenol, m-ethylphenol, 2,3-xylenol, meditol, 3,5-xylenol, p-tertiarybutylphenol, catechol, p-tertiaryamylphenol, Phenolic hydroxyl groups such as resorcinol, p-octylphenol, p-phenylphenol, bisphenol A, bisphenol F, bisphenol AF, biphenol, diallyl bisphenol F, diallyl bisphenol A, trisphenol, tetrakisphenol Monomers or the like having the like.

  Moreover, 1-30 weight% is preferable and, as for the compounding quantity of a flux active hardening | curing agent in an adhesive film, 3-20 weight% is especially preferable. When the blending amount of the flux active curing agent in the adhesive film is within the above range, the flux activity of the adhesive film can be improved and the epoxy resin and the unreacted flux active curing agent remain in the adhesive film. Is prevented. If unreacted flux active curing agent remains, migration occurs.

  The blending ratio of the (A) thermosetting resin and the compound (C) having a flux function is not particularly limited, but ((A) / (C)) is 0.5 to 20.0. It is particularly preferably 1 to 18, and more preferably 2 to 15. By setting ((A) / (C)) to the above lower limit value or more, when curing the adhesive film, the outgassing (C) flux compound can be reduced, so voids in the adhesive film are reduced. can do. Further, by setting ((A) / (C)) to the upper limit value or less, it is possible to effectively remove the oxide film on the adherend and the terminal surface of the support and the solder surface.

The adhesive film of the present invention includes (D) a film-forming resin that improves the film-forming property of the adhesive film.
Thereby, it becomes easy to make a film state. Moreover, it is excellent also in the mechanical characteristic of an adhesive film.

  The (D) film-forming resin is not particularly limited. For example, (meth) acrylic resin, phenoxy resin, polyester resin, polyurethane resin, polyimide resin, siloxane-modified polyimide resin, polybutadiene, polypropylene, Styrene-butadiene-styrene copolymer, styrene-ethylene-butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene- Acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, polyvinyl acetate, nylon and the like can be mentioned. These may be used alone or in combination of two or more. Among these, at least one selected from the group consisting of (meth) acrylic resins, phenoxy resins, and polyimide resins is preferable.

The weight average molecular weight of the film-forming resin (D) is not particularly limited, but is preferably 10,000 or more, more preferably 20,000 to 1,000,000, still more preferably 30,000 to 900,000. When the weight average molecular weight is in the above range, the film formability of the adhesive film can be further improved.
Although content of said (D) film-forming resin is not specifically limited, 5-70 weight% in the said adhesive film is preferable, 10-60 weight% is more preferable, Especially 15-55 weight% is preferable. When the content is within the above range, the fluidity of the adhesive film can be suppressed, and the handling of the adhesive film becomes easy.

  The adhesive film may further contain (E) a curing accelerator. (E) A hardening accelerator can be suitably selected according to the kind etc. of curable resin. (E) Examples of the curing accelerator include tri-substituted phosphoniophenolate or a salt thereof, an imidazole compound having a melting point of 150 ° C. or higher, and the like. Although an imidazole compound having a melting point of 150 ° C. or higher is preferable. When the melting point of the imidazole compound is 150 ° C. or higher, the terminal of the adherend and the terminal of the support can be joined before the curing of the adhesive film is completed. Examples of the imidazole compound having a melting point of 150 ° C. or higher include 2-phenylhydroxyimidazole and 2-phenyl-4-methylhydroxyimidazole.

Although content of the said (E) hardening accelerator is not necessarily limited, It is preferable that it is 0.005 to 10 weight% in an adhesive film, More preferably, it is 0.01 to 5 weight%. By making the compounding quantity of an imidazole compound more than the said lower limit, the function as (E) hardening accelerator can be exhibited more effectively and the sclerosis | hardenability of an adhesive film can be improved. Moreover, by setting the blending amount of imidazole to the upper limit value or less, it is possible to reliably bond the terminal of the adherend and the terminal of the support before the adhesive film is cured, and further, the storability of the adhesive film A decrease can be prevented. These (E) curing accelerators may be used alone or in combination of two or more.

  The adhesive film may further include (F) a silane coupling agent. (F) By including a silane coupling agent, the adhesiveness of the adhesive film to a support such as a semiconductor chip or a substrate or an adherend can be enhanced. (F) As a silane coupling agent, an epoxy silane coupling agent, an aromatic-containing aminosilane coupling agent, etc. can be used, for example. These may be used alone or in combination of two or more. (F) Although the compounding quantity of a silane coupling agent should just be selected suitably, Preferably it is 0.01 to 10 weight% with respect to the said whole resin composition, More preferably, it is 0.05 to 5 weight% More preferably, it is 0.1 to 2% by weight.

  The adhesive film may further include (G) a filler. Thereby, the linear expansion coefficient of an adhesive film can be reduced, and the minimum melt viscosity of an adhesive film can be adjusted to a range of 0.01 to 100,000 Pa · s.

  Examples of the filler (G) include silver, titanium oxide, silica, mica and the like. Among these, silica is preferable. Moreover, as a shape of a silica filler, although there exists crushing silica, spherical silica, etc., spherical silica is preferable.

  The average particle diameter of the filler (G) is not particularly limited, but is preferably 0.01 μm or more and 20 μm or less, and particularly preferably 0.1 μm or more and 5 μm or less. By setting it as the said range, aggregation of (G) filler can be suppressed in an adhesive film, and an external appearance can be improved.

  Although content of the said (G) filler is not specifically limited, 3-70 weight% is preferable in the said adhesive film, 5-60 weight% is especially preferable, and 8-55 weight% is especially preferable. By setting the filler content to the above lower limit or more, the difference in linear expansion coefficient between the cured adhesive film and the adherend becomes small, and the stress generated during thermal shock can be reduced. Further, peeling of the adherend can be more reliably suppressed. Moreover, since it can suppress that the elasticity modulus of the adhesive film after hardening becomes high by making content of a filler into the said upper limit or less, the reliability of a semiconductor device improves. Moreover, it becomes easy to adjust the minimum melt viscosity of an adhesive film to 0.01-100,000 Pa.s by making content of a filler into the said range.

  Apply the varnish obtained by mixing each resin component as described above in a solvent onto a base material that has been subjected to a release treatment such as a polyester sheet, and at a predetermined temperature, substantially free of solvent. The adhesive film can be obtained by drying the film. The solvent used here is not particularly limited as long as it is inert to the components used, but ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, DAA (diacetone alcohol), etc. , Aromatic hydrocarbons such as benzene, xylene, toluene, alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol, n-butyl alcohol, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, etc. Cellosolve, NMP (N-methyl-2-pyrrolidone), THF (tetrahydrofuran), DMF (dimethylformamide), DBE (dibasic acid ester), EEP (3-ethoxypropionic acid ester) Le), DMC (dimethyl carbonate), etc. is preferably used. The amount of the solvent used is preferably in the range where the solid content of the components mixed in the solvent is 10 to 60% by weight.

  Although the thickness of the obtained adhesive film is not specifically limited, It is preferable that it is 1-300 micrometers, and it is especially preferable that it is 5-200 micrometers. When the thickness is within the above range, the resin component can be sufficiently filled in the gap between the joint portions, and the mechanical adhesive strength after curing of the resin component can be ensured.

  The adhesive film thus obtained has a flux activity. Therefore, the dicing tape-integrated adhesive sheet of the present invention includes a semiconductor chip and a substrate, a substrate and a substrate, a semiconductor chip and a semiconductor chip, a semiconductor chip and a semiconductor wafer, a semiconductor wafer and a semiconductor wafer, and other members that require solder connection. It can be suitably used for connection.

  Moreover, the dicing tape-integrated adhesive sheet of the present invention may be provided with one or more intervening layers in addition to the above-described adhesive film and dicing tape. Further, one or more outer layers may be provided on one side or both sides of the dicing tape integrated adhesive sheet. Examples of the intervening layer and the outer layer include base materials such as the following support film and adhesive layer.

(Support film)
The support film is a support having a function of supporting the dicing tape and the adhesive film as described above. Moreover, when providing as an outer layer of a dicing tape integrated adhesive sheet, it also has a function as a protective film for protecting from contamination and impact.

  As a constituent material of such a support film, for example, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymer, Examples include ionomers, ethylene / (meth) acrylic acid copolymers, ethylene / (meth) acrylic acid ester copolymers, polystyrene, vinyl polyisoprene, polycarbonate, etc., and one or a mixture of two or more of these may be used. Can be mentioned.

  Although the average thickness of a support film is not specifically limited, It is preferable that it is about 5-200 micrometers, and it is more preferable that it is about 30-150 micrometers. As a result, since the support film has moderate rigidity, the dicing tape and the adhesive film are reliably supported, and the handling of the dicing tape integrated adhesive sheet is facilitated. Adhesiveness with the support body which has a 1st terminal can be improved by curving moderately.

(Adhesive layer)
The pressure-sensitive adhesive layer is composed of a general pressure-sensitive adhesive, specifically, a second resin composition containing an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and the like.
Examples of the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, And copolymers with styrene, acrylonitrile, etc.). Two or more of these resins may be mixed.

  Among these, one or more selected from the group consisting of methyl (meth) acrylate, ethylhexyl (meth) acrylate and butyl (meth) acrylate, and hydroxyethyl (meth) acrylate and vinyl acetate A copolymer with one or more selected is preferred. This facilitates control of adhesion and adhesiveness with the counterpart (adherent) to which the adhesive layer adheres.

  In addition, the second resin composition includes urethane acrylate, acrylate monomer, polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate) in order to control tackiness (adhesiveness). Monomers and oligomers such as isocyanate compounds may be added.

  Further, the second resin composition includes methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl as a photopolymerization initiator when the adhesive layer is cured by ultraviolet rays or the like. Acetophenone compounds such as -1- [4- (methylthio) -phenyl] -2-morpholinopropane-1, benzophenone compounds, benzoin compounds, benzoin isobutyl ether compounds, benzoin benzoic acid methyl compounds, benzoin benzoic acid compounds A compound, a benzoin methyl ether compound, a benzylfinyl sulfide compound, a benzyl compound, a dibenzyl compound, a diacetyl compound, or the like may be added.

  The second resin composition also includes a rosin resin, a terpene resin, a coumarone resin, a phenol resin, a styrene resin, an aliphatic petroleum resin, an aromatic petroleum resin, an aliphatic aroma for the purpose of increasing adhesive strength and shear strength. You may add tackifiers, such as a group petroleum resin.

  The average thickness of such an adhesive layer is not particularly limited, but is preferably about 1 to 100 μm, more preferably about 3 to 50 μm. When the thickness is within the above range, it is not peeled off especially during dicing, it can be peeled off relatively easily with a tensile load during picking up, and it is difficult to be deformed during dicing or picking up. Thus, a layer excellent in pick-up property can be obtained.

(Manufacturing method of dicing tape integrated adhesive sheet)
The dicing tape-integrated adhesive sheet 10 as described above is manufactured, for example, by the following method.

  First, the base material 4a shown in FIG. 3A is prepared, and the intervening layer 1 is formed on one surface of the base material 4a. Thereby, the laminated body 61 of the base material 4a and the intervening layer 1 is obtained. The intervening layer 1 is formed by, for example, applying the resin varnish containing the second resin composition described above by various application methods and then drying the applied film, or laminating a film made of the second resin composition, etc. Can be performed. Further, the coating film may be cured by irradiating radiation such as ultraviolet rays.

  Examples of the coating method include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method.

  Further, similarly to the laminate 61, as shown in FIG. 3A, the adhesive film 3 is formed on one surface of the prepared base material 4b, whereby the base material 4b and the adhesive film 3 are formed. The laminate 62 is obtained.

  Further, as shown in FIG. 3A, the dicing tape 2 is formed on one surface of the prepared support film 4 in the same manner as each of the laminates 61 and 62, whereby the support film 4 and the dicing are formed. A laminate 63 with the tape 2 is obtained.

  Next, as illustrated in FIG. 3B, the stacked body 61 and the stacked body 62 are stacked so that the intervening layer 1 and the adhesive film 3 are in contact with each other to obtain a stacked body 64. This lamination can be performed by, for example, a roll lamination method.

  Next, as shown in FIG. 3 (c), the base material 4 a is peeled from the laminate 64. And as shown in FIG.3 (d), the outer side part of the effective area | region of the said adhesive film 3 and the said intervening layer 1 is removed, leaving the base material 4b with respect to the laminated body 64 which peeled the said base material 4a. To do. Here, the effective area refers to an area whose outer periphery is larger than the outer diameter of the semiconductor wafer 7 and smaller than the inner diameter of the wafer ring 9.

  Next, as shown in FIG. 3 (e), a laminate 64 and a laminate in which the substrate 4a is peeled and the outer portion of the effective area is removed in a ring shape so that the dicing tape 2 is in contact with the exposed surface of the intervening layer 1. 63 is laminated. Then, the base material 4b is peeled to obtain the dicing tape integrated adhesive sheet 10 shown in FIG.

  Although the method for forming the dicing tape 2 directly on the support film has been described above, the dicing tape is formed on the substrate in the same manner as the intervening layer 1 and the adhesive film 3, and is then formed on the adhesive film 3 and the interposing layer 1. And a dicing tape integrated adhesive sheet may be produced.

  In addition, although the intervening layer 1, the dicing tape 2, and the adhesive film 3 have mutually different adhesive forces, it is preferable that they have the following characteristics.

  First, the adhesion force of the intervening layer 1 to the adhesive film 3 is preferably smaller than the adhesion force of the dicing tape 2 to the support film 4. Thereby, in the 3rd process mentioned later, when picking up the piece 83, between the support film 4 and the dicing tape 2 does not peel, but between the adhesive film 3 and the intervening layer 1 is selective. Peel off. When dicing, the laminated body 8 can be reliably supported by the wafer ring 9.

Next, an electronic component and a semiconductor device using the above-described dicing tape integrated adhesive sheet will be described.
[1] As shown in FIG. 1A, the adhesive film 3 of the dicing tape-integrated adhesive sheet 10 as described above and the semiconductor wafer 7 are brought into close contact with each other, and the dicing tape-integrated adhesive sheet 10 and the semiconductor wafer ( (Support 1) is laminated (first step). Here, in the semiconductor wafer (support) 7, the surface bonded to the adhesive film 3 has a first terminal (not shown). In the dicing tape-integrated adhesive sheet 10 shown in FIG. 1, the size and shape of the adhesive film 3 in plan view are larger than the outer diameter of the semiconductor wafer 7 and smaller than the inner diameter of the wafer ring 9. , Have been set in advance. For this reason, the entire lower surface of the semiconductor wafer 7 is in close contact with the entire upper surface of the adhesive film 3, whereby the semiconductor wafer 7 is supported by the dicing tape-integrated adhesive sheet 10. A dicing tape-integrated adhesive sheet 10 is laminated so that the first terminals of the semiconductor wafer 7 are covered with the adhesive film 3 (FIG. 1B).

Examples of the method of laminating the dicing tape integrated adhesive sheet 10 on the semiconductor wafer 7 include a roll laminator, a flat plate press, a wafer laminator and the like.
Among these, a method of laminating under vacuum (vacuum laminator) is preferable in order to prevent air from being involved during lamination.

In addition, the conditions for laminating are not particularly limited, and it is only necessary to be able to laminate without voids. Specifically, the conditions of heating at 60 to 150 ° C. for 1 second to 120 seconds are preferable, and particularly at 80 to 120 ° C. for 5 to 60 seconds. Heating conditions are preferred. When the laminating conditions are within the above range, the balance between the sticking property, the effect of suppressing the protrusion of the resin, and the degree of curing of the resin is excellent.
Moreover, although pressurization conditions are not specifically limited, 0.2-2.0 MPa is preferable and 0.5-1.5 MPa is especially preferable.

  As a result of the above lamination, as shown in FIG. 1B, a laminated body 8 in which a dicing tape-integrated adhesive sheet 10 and a semiconductor wafer 7 are laminated is obtained.

[2]
[2-1] Next, a wafer ring 9 is prepared. Subsequently, the laminate 8 and the wafer ring 9 are laminated so that the upper surface of the outer peripheral portion 21 of the dicing tape 2 and the lower surface of the wafer ring 9 are in close contact with each other. Thereby, the outer peripheral part of the laminated body 8 is supported by the wafer ring 9.

  Since the wafer ring 9 is generally made of various metal materials such as stainless steel and aluminum, the wafer ring 9 has high rigidity and can surely prevent the laminate 8 from being deformed.

  [2-2] Next, a dicer table (not shown) is prepared, and the laminate 8 is placed on the dicer table so that the dicer table and the support film 4 are in contact with each other.

  Subsequently, as shown in FIG. 1C, a plurality of cuts 81 are formed in the laminate 8 using a dicing blade 82 (dicing). The dicing blade 82 is composed of a disk-shaped diamond blade or the like, and a cut 81 is formed by pressing the dicing blade 82 against the surface of the laminated body 8 on the semiconductor wafer 7 side. Then, the semiconductor wafer 7 is separated into a plurality of semiconductor elements 71 by relatively moving the dicing blade 82 along the gap between the circuit patterns formed on the semiconductor wafer 7 (second step). ). Similarly, the adhesive film 3 is separated into a plurality of adhesive films 31. In such dicing, vibration and impact are applied to the semiconductor wafer 7, but the lower surface of the semiconductor wafer 7 is supported by the dicing tape-integrated adhesive sheet 10, so that the vibration and impact are alleviated. It becomes. As a result, the occurrence of defects such as cracks and chippings in the semiconductor wafer 7 can be reliably prevented.

  In the second step, the cutting depth may be set so that the tip of the dicing blade 82 remains in the adhesive layer. In other words, dicing is performed so that the front end of the cut 81 does not reach the support film 4 and remains in either the intervening layer 1 or the dicing tape 2. In this way, since the shavings of the support film 4 cannot be generated, the problems associated with the generation of the shavings are surely solved. That is, when picking up the semiconductor element 71, the occurrence of catching or the like is prevented, and when the picked-up semiconductor element 71 is mounted on the adherend 5, entry of foreign matter and defective soldering are prevented. As a result, the manufacturing yield of the semiconductor device 100 can be improved, and the highly reliable semiconductor device 100 can be obtained.

[3]
[3-1] Next, the laminated body 8 in which the plurality of cuts 81 are formed is radially extended (expanded) by an expanding device (not shown). Thereby, as shown in FIG.1 (d), the width | variety of the notch 81 formed in the laminated body 8 spreads, and the space | interval of the semiconductor elements 71 separated into pieces is also expanded in connection with it. As a result, there is no possibility that the semiconductor elements 71 interfere with each other, and the individual semiconductor elements 71 can be easily picked up. Note that the expanding device is configured to maintain such an expanded state even in a process described later.

  [3-2] Next, the die bonder 250 attracts one of the separated semiconductor elements 71 by the die bonder collet (chip suction part) 260 and pulls it upward. As a result, as shown in FIG. 2E, the interface between the adhesive film 31 and the intervening layer 1 is selectively peeled off, and a piece 83 formed by laminating the semiconductor element 71 and the adhesive film 31 is picked up. (Third step).

  The reason why the interface between the adhesive film 31 and the intervening layer 1 is selectively peeled is that the adhesiveness of the dicing tape 2 is higher than the adhesiveness of the intervening layer 1 as described above. This is because the adhesive force at the interface between the intermediate layer 1 and the adhesive force at the interface with the intervening layer 1 of the dicing tape 2 are larger than the adhesive force between the intervening layer 1 and the adhesive film 3. That is, when the semiconductor element 71 is picked up, the interface between the intervening layer 1 having the smallest adhesive force and the adhesive film 3 among these three locations is selectively peeled off.

  Further, when picking up the individual piece 83, the individual piece 83 to be picked up may be selectively pushed up from below the dicing tape-integrated adhesive sheet 10 by the push-up device 400. Thereby, since the piece 83 is pushed up from the laminated body 8, the pickup of the piece 83 mentioned above can be performed more easily. In order to push up the individual piece 83, a needle-like body (needle) or the like that pushes up the dicing tape-integrated adhesive sheet 10 from below is used (not shown).

[4]
[4-1] Next, the adherend 5 for mounting (mounting) the semiconductor element (chip) 71 is prepared.

  The adherend 5 has a second terminal (not shown) on the surface to be bonded to the adhesive film 3. Examples of the adherend 5 include a substrate on which a semiconductor element 71 is mounted and a wiring for electrically connecting the semiconductor element 71 and the outside, a semiconductor element, and the like.

  In addition, as a 1st terminal and a 2nd terminal, a pad part, a solder bump, etc. are mentioned, for example. Moreover, it is preferable that solder exists in at least one of the first terminal and the second terminal.

  Next, as shown in FIG. 2 (f), the picked-up piece 83 is placed on the adherend 5. At this time, the first terminal of the semiconductor wafer (support) 7 and the second terminal of the adherend 5 are temporarily bonded via the adhesive film 3 while being aligned.

[4-2] Next, the adherend 5 and the semiconductor element 71 are soldered (fourth step). The condition for solder connection depends on the type of solder to be used. For example, in the case of Sn-Ag, the solder connection is preferably performed by heating at 220 to 260 ° C. for 5 to 500 seconds, and particularly at 230 to 240 ° C. It is preferable to heat for 100 seconds.
This solder bonding is preferably performed under the condition that the adhesive film 3 is cured after the solder is melted. That is, the solder bonding is preferably performed under the condition that the solder is melted but the curing reaction of the adhesive film 3 does not proceed so much. Thereby, the shape of the solder connection part at the time of soldering can be made into the stable shape which is excellent in connection reliability.

  Next, the adhesive film 3 is heated and cured (fifth step). Conditions for curing are not particularly limited, but conditions for heating at 130 to 220 ° C. for 30 to 500 minutes are preferable, and conditions for heating at 150 to 200 ° C. for 60 to 180 minutes are particularly preferable.

  According to the method as described above, in the third step, the adhesive film 31 is picked up in a state where the adhesive film 31 is attached to the semiconductor element 71, that is, in the state of the piece 83. Therefore, in the fourth step, the adhesive film 31 is picked up. Can be used for adhesion to the adherend 5 as it is. Therefore, by using the dicing tape-integrated adhesive sheet of the present invention, it is not necessary to separately prepare an underfill or the like, and the semiconductor element (support) 71 and the adherend 5 are electrically connected using solder. The manufacturing efficiency of the semiconductor device 100 can be further increased.

  In addition, as the support body 7 and the to-be-adhered body 5, a chip | tip, a board | substrate (circuit board | substrate), a wafer etc. are mentioned, for example. When circuit boards are used as the support 7 and the adherend 5, respectively, a multilayer circuit board bonded with a cured product of the adhesive film 2 can be obtained. Moreover, when using a semiconductor chip as the support body 7 and the adherend 5 respectively, an electronic component bonded with a cured product of the adhesive film 2 can be obtained.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited to this.

Example 1
<Formation of adhesive layer>
100 parts by weight of a copolymer having a weight average molecular weight of 300,000 obtained by copolymerizing 30% by weight of 2-ethylhexyl acrylate and 70% by weight of vinyl acetate, and 45 parts by weight of a pentafunctional acrylate monomer having a molecular weight of 700 2 parts by weight of 2,2-dimethoxy-2-phenylacetophenone and 3 parts by weight of tolylene diisocyanate (Coronate T-100, manufactured by Nippon Polyurethane Industry Co., Ltd.) with respect to a 38 μm thick polyester film The film was applied so that the thickness after drying was 10 μm, and then dried at 80 ° C. for 5 minutes. And the ultraviolet-ray 500mJ / cm < ² > was irradiated with respect to the obtained coating film, and the adhesion layer was formed into a film on the polyester film.

<Formation of dicing tape>
100 parts by weight of a copolymer having a weight average molecular weight of 500,000 obtained by copolymerizing 70% by weight of butyl acrylate and 30% by weight of 2-ethylhexyl acrylate, and tolylene diisocyanate (Coronate T-100, Nippon Polyurethane 3 parts by weight of Kogyo Co., Ltd.) was applied to a 38 μm-thick polyester film having been subjected to a release treatment so that the thickness after drying was 10 μm, and then dried at 80 ° C. for 5 minutes. Then, a dicing tape was formed on the polyester film. Thereafter, a polyethylene sheet having a thickness of 100 μm was laminated as a support film.

<Preparation of varnish for adhesive film>
(A) 55.0 parts by weight of a bisphenol F type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-830LVP) as a thermosetting resin, and (B) a phenol novolak resin (manufactured by Mitsui Chemicals, VR- 9305) 30.8 parts by weight, (C) 3.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol F-type phenoxy resin (Toto Kasei) as a film-forming resin YP-70) 10.0 parts by weight, (E) 0.2 parts by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) silane coupling Β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) 1.0 part by weight as an agent, It was dissolved in ethyl ketone, to prepare a resin concentration of 50% resin varnish.

<Manufacture of adhesive film>
The obtained resin varnish was applied to a base polyester film (manufactured by Toray Industries, Inc., Lumirror) to a thickness of 50 μm and dried at 100 ° C. for 5 minutes to obtain an adhesive film having a thickness of 25 μm.

<Manufacture of dicing tape integrated adhesive sheet>
The polyester film on the adhesive side was peeled off, and the film on which the adhesive layer was formed and the film on which the adhesive film was formed were laminated (laminated) so that the adhesive layer and the adhesive film were in contact with each other to obtain a laminate. .

  Next, using a roll-shaped mold, the pressure-sensitive adhesive layer and the adhesive film are punched larger than the outer diameter of the semiconductor wafer and smaller than the inner diameter of the wafer ring, and then unnecessary portions are removed, and the second laminate is formed. Obtained.

  Further, the polyester film on one surface side of the dicing tape was peeled off. And these were laminated | stacked so that the adhesion layer and dicing tape of a said 2nd laminated body might contact | connect. As a result, a dicing tape integrated adhesive sheet in which five layers of a polyethylene sheet (support film), a dicing tape, an adhesive layer (intervening layer), an adhesive film and a polyester film were laminated in this order was obtained.

<Manufacture of semiconductor devices>
A silicon wafer (diameter 8 inches, thickness 100 μm) having solder bumps was prepared. The polyester film was peeled from the dicing tape-integrated adhesive sheet, and the dicing tape-integrated adhesive sheet and the silicon wafer were laminated so that the peeled surface was in contact with the surface having the solder bumps of the silicon wafer. This was laminated at 100 ° C. with a vacuum roll laminator to obtain a silicon wafer with a dicing tape integrated adhesive sheet.

  Next, the silicon wafer with the dicing tape integrated adhesive sheet was diced (cut) from the silicon wafer side using a dicing saw (DFD6360, manufactured by DISCO Corporation) under the following conditions. As a result, the silicon wafer was singulated, and a semiconductor element having the following dicing size was obtained.

<Dicing conditions>
Dicing size: 10 mm x 10 mm square Dicing speed: 50 mm / sec
Spindle speed: 40,000 rpm
Dicing maximum depth: 0.130 mm (cutting amount from the surface of the silicon wafer)
Dicing blade thickness: 15 μm
Cut cross-sectional area: 7.5 × 10 ⁻⁵ mm ² (cross-sectional area at the tip side from the interface between the adhesive film and the intervening layer)

  In addition, the notch formed by this dicing had the front-end | tip reached in the intervening layer.

  Next, one of the semiconductor elements was pushed up with a needle from the back surface of the semiconductor film, and the pushed-up surface of the semiconductor element was pulled upward while being adsorbed by a collet of a die bonder. This picked up the semiconductor element with an adhesive film.

Next, the semiconductor element was temporarily pressure-bonded to the circuit board at 100 ° C. for 30 seconds while being aligned so that the pads of the circuit board having the pads and the solder bumps were in contact with each other.
Next, the solder bumps were melted by heating at 235 ° C. for 30 seconds to perform solder connection.
And it heated at 180 degreeC for 60 minute (s), the adhesive film was hardened, and the semiconductor device with which the semiconductor element and the circuit board were adhere | attached with the hardened | cured material of the adhesive film was obtained.

(Example 2)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 50.0 parts by weight of a bisphenol A type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-840S) as a thermosetting resin, and (B) a phenol novolac resin (manufactured by Mitsui Chemicals, VR- 9305) 25.5 parts by weight, (C) 3.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol F-type phenoxy resin (Toto Kasei) as a film-forming resin. YP-70) 20.0 parts by weight, (E) 0.5 parts by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) silane coupling Β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) 1.0 part by weight as an agent, methyl ethyl It was dissolved in a ketone, except that to prepare a resin concentration of 50% of the resin varnish was produced similarly adhesive film as in Example 1.

(Example 3)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 20.0 parts by weight of a cresol novolac epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-70) as a thermosetting resin, and (B) a phenol novolac resin (manufactured by Sumitomo Bakelite, PR55617) as a curing agent 15.0 parts by weight, (C) 3.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol A type phenoxy resin (manufactured by Toto Kasei Co., Ltd.) as a film-forming resin , YP-50) 60.0 parts by weight, (E) 1.0 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) as a silane coupling agent β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-303) in an amount of 1.0 parts by weight It was dissolved in a ketone, except that to prepare a resin concentration of 50% of the resin varnish was produced in the production of similarly adhesive film as in Example 1.

Example 4
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 15.0 parts by weight of a cresol novolac epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-70) as a thermosetting resin, and a phenol novolak resin (manufactured by Sumitomo Bakelite, PR55617) as a curing agent 8.0 parts by weight, (C) 6.0 parts by weight of phenolphthalin (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol A type phenoxy resin (Toto Kasei Co., Ltd.) as a film-forming resin Made by YP-50) 46.0 parts by weight, (G) 23.0 parts by weight of spherical silica filler (manufactured by Admatechs, SC1050-LC, average particle size 0.25 μm), and (E) curing 1.0 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as an accelerator and (F) β as a silane coupling agent Except that 1.0 part by weight of (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) was dissolved in methyl ethyl ketone to prepare a resin varnish having a solid content of 40%, An adhesive film was produced in the same manner as in Example 1.

(Example 5)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 13.0 parts by weight of a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-70) as a thermosetting resin, and (B) a phenol novolak resin (manufactured by Sumitomo Bakelite, PR55617) as a curing agent 6.0 parts by weight, (C) 5.0 parts by weight of phenolphthalin (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol A type phenoxy resin (Toto Kasei Co., Ltd.) as a film-forming resin YP-50) 39.0 parts by weight, (G) spherical silica filler (manufactured by Admatechs, SC1050-LC, average particle size 0.25 μm) 36.0 parts by weight, and (E) curing 0.5 parts by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as an accelerator and (F) β as a silane coupling agent Except that 0.5 parts by weight of (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) was dissolved in methyl ethyl ketone to prepare a resin varnish having a solid content concentration of 30%, An adhesive film was produced in the same manner as in Example 1.

(Example 6)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 9.0 parts by weight of a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-70) as a thermosetting resin, and (B) a phenol novolak resin (manufactured by Sumitomo Bakelite, PR55617) as a curing agent 4.0 parts by weight, (C) 4.0 parts by weight of phenolphthalin (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) an acrylate copolymer resin (Nagase Chem) as a film-forming resin Tex, SG-P3) 27.0 parts by weight, (G) spherical silica filler (manufactured by Admatechs, SC1050-LC, average particle size 0.25 μm) 55.0 parts by weight, (E ) 0.5 parts by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) a silane coupling agent Except that 0.5 parts by weight of β- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) was dissolved in methyl ethyl ketone to prepare a resin varnish having a solid content of 20%. Produced an adhesive film in the same manner as in Example 1.

(Example 7)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 55.0 parts by weight of a bisphenol F type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-830LVP) as a thermosetting resin, and (B) a phenol novolak resin (manufactured by Mitsui Chemicals, VR- 9305) 31.8 parts by weight, (C) 2.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol F-type phenoxy resin (Toto Kasei) as a film-forming resin. YP-70) 10.0 parts by weight, (E) 0.2 parts by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) silane coupling Β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) 1.0 part by weight as an agent, It was dissolved in ethyl ketone, except that to prepare a resin concentration of 50% of the resin varnish was produced similarly adhesive film as in Example 1.

(Example 8)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 15.0 parts by weight of a cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-70) as a thermosetting resin, and (B) a phenol novolac resin (manufactured by Mitsui Chemicals, VR- 9305) 5.0 parts by weight, (C) 60.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol A type phenoxy resin (Toto Kasei) as a film-forming resin YP-50) 18.0 parts by weight, (E) 1.0 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) silane cup As a ring agent, 1.0 part by weight of β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-303), methyl ethyl ketone Dissolved, except that to prepare a resin concentration of 50% of the resin varnish was produced similarly adhesive film as in Example 1.

Example 9
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 22.0 parts by weight of a bisphenol A type epoxy resin (Dainippon Ink and Chemicals, EPICLON-840S) as a thermosetting resin, and (B) 4-methylhexahydrophthalic anhydride (Shin Nippon) 12.5 parts by weight, manufactured by Rika Co., Ltd., Rikasit MH), (C) 6.0 parts by weight of phenolphthalin (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol F as a film-forming resin Type phenoxy resin (Toto Kasei Co., Ltd., YP-70) 9.0 parts by weight, and (E) 2-phenyl-4-methylimidazole (Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.1 part by weight as a curing accelerator; (F) β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-303) 0.4 weight as a silane coupling agent (G) 50.0 parts by weight of a spherical silica filler (manufactured by Admatechs, SC1050-LC, average particle size of 0.25 μm) as a filler is dissolved in methyl ethyl ketone to prepare a resin varnish having a resin concentration of 50%. An adhesive film was produced in the same manner as in Example 1 except that.

(Example 10)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 16.5 parts by weight of isocyanuric acid ethylene glycol-modified triacrylate (manufactured by Toagosei Co., Ltd., M-315) as a thermosetting resin, and (B) t-butyl peroxypenzoate (NOF Corporation) as a curing agent Manufactured by Perchable Z), 0.5 parts by weight, (C) 2.0 parts by weight of phenolphthalin (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) polyvinyl butyral resin ( Sekisui Chemical Co., Ltd., BX-1) 5.5 parts by weight, and (F) β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-303) 0 as a silane coupling agent 5 parts by weight and (G) 75.0 parts by weight of spherical silica filler (manufactured by Admatechs, SC1050-LC, average particle size 0.25 μm) as a filler An adhesive film was produced in the same manner as in Example 1 except that it was dissolved in ruethyl ketone and a resin varnish having a resin concentration of 20% was prepared.

(Comparative Example 1)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 59.0 parts by weight of a bisphenol F type epoxy resin (Dainippon Ink and Chemicals, EPICLON-830LVP) as a thermosetting resin, and (B) a phenol novolac resin (Mitsui Chemicals, VR- 9305) 34.9 parts by weight, (C) 3.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) bisphenol F type phenoxy resin (Toto Kasei) as a film-forming resin. YP-70) 2.0 parts by weight, (E) 2-phenyl-4-methylimidazole (Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.1 parts by weight, and (F) silane cup As a ring agent, 1.0 part by weight of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-303) It was dissolved in ketone, except that to prepare a resin concentration of 50% of the resin varnish was produced similarly adhesive film as in Example 1.

(Comparative Example 2)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 20.0 parts by weight of a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-70) as a thermosetting resin, and (B) a phenol novolac resin (manufactured by Sumitomo Bakelite Co., PR55167) as a curing agent 10.0 parts by weight, (C) 8.0 parts by weight of phenolphthalin (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) an acrylate copolymer resin (Nagase Chem) as a film-forming resin Tex, SG-P3) 60.0 parts by weight, (E) 1.0 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as a curing accelerator, and (F) silane 1.0 part by weight of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-303) as a coupling agent; , Methyl ethyl ketone, except that to prepare a resin concentration of 50% of the resin varnish was produced similarly adhesive film as in Example 1.

(Comparative Example 3)
A dicing tape-integrated adhesive sheet and a semiconductor device were produced in the same manner as in Example 1 except that the varnish for adhesive film and the adhesive film were produced as follows.
<Preparation of varnish for adhesive film>
(A) 42.0 parts by weight of a bisphenol F-type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-830LVP) as a thermosetting resin, and (B) a phenol novolak resin (manufactured by Mitsui Chemicals, VR- 9305) 30.0 parts by weight, (C) 3.0 parts by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound having a flux function, and (D) an acrylate copolymer resin (Toto) as a film-forming resin. SG-P3) 15.0 parts by weight, (E) 2-phenyl-4-methylimidazole (Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.01 parts by weight, and (F) silane As coupling agent, 10.0 parts by weight of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-303) and methyl It was dissolved in ethyl ketone, except that to prepare a resin concentration of 50% of the resin varnish was produced similarly adhesive film as in Example 1.

  Moreover, the following evaluation was performed about the adhesive film and semiconductor device which were obtained by each Example and the comparative example. The evaluation items are shown together with the contents. The obtained results are shown in Table 1.

1. Minimum Melt Viscosity of Adhesive Film Using the viscoelasticity measuring device (“RheoStress RS150” manufactured by HAAKE, Inc.), the adhesive film obtained in each example and comparative example was parallel plate 20 mmφ, gap 0.05 mm, frequency 0.1 Hz. The temperature increase rate was determined by measuring the melt viscosity under conditions of 10 ° C./min, and taking the lowest melt viscosity as the measured value.

2. 5% weight loss on heating temperature of adhesive film (b)-exothermic peak temperature (a)
The exothermic peak temperature (a) of the adhesive film obtained in each example and comparative example was cured using a differential scanning calorimeter (DSC-6200, manufactured by Seiko Instruments Inc.) at a heating rate of 10 ° C./min. The amount was measured and the peak temperature was taken as the measured value.
Next, the 5% weight loss on heating (b) of the adhesive film obtained in each Example and Comparative Example was increased using a thermogravimetric / differential heat simultaneous measurement apparatus (TG / DTA6200, manufactured by Seiko Instruments Inc.). Heat loss was measured at a temperature rate of 10 ° C./min, and the temperature at which 5% weight loss was measured was taken as the measured value.
From the obtained (a) and (b), (b)-(a) was calculated.

3. Cavity and Void of Semiconductor Device For each of the 20 semiconductor devices obtained in each of the examples and comparative examples, cross-sectional observation of the solder bumps of the semiconductor chip and the pad portion of the circuit board was performed using a scanning electron microscope (SEM). And evaluation of voids (bubbles). Each code is as follows.
○: Cavities and voids of 5 μm or more were not observed at all.
X: Cavities and voids of 5 μm or more were observed.

4). Conductivity connectivity of semiconductor devices For 20 semiconductor devices obtained in each of the examples and comparative examples, the connection resistance value between the semiconductor chip and the circuit board was measured at 10 points with a digital multimeter, and the connection reliability was evaluated. did. Each code is as follows.
○: The connection resistance values of all 20 (measurement points: 20 × 10 = 200) semiconductor devices were 3Ω or less.
Δ: There is no point that does not conduct, but the connection resistance value at 10 to 20 points was 3Ω or more (no problem in practical use).
X: The connection resistance value of 20 points or more was 3Ω or more, or there were 1 or more open defects (problem in practical use).

5. Insulation Reliability of Semiconductor Device For each of the 20 semiconductor devices obtained in each of the examples and comparative examples, the insulation resistance value between adjacent bumps was determined while applying a voltage of 3 V in an environment of 130 ° C. and 85% RH. Three-point continuous measurement (200 hr) was performed to evaluate ion migration. Each code is as follows.
○: Dielectric breakdown did not occur at all measurement points (20 × 3 = 60).
Δ: Dielectric breakdown occurred at less than 3 points.
X: There were 3 or more points where dielectric breakdown occurred.

  The adhesive film used for the dicing tape-integrated adhesive sheet obtained in Example 1 has a minimum melt viscosity of 0.02 Pa · s, a 5% weight loss on heating (b), and an exothermic peak temperature (a). The difference was 168 ° C. When a semiconductor device was manufactured with the adhesive film obtained in Example 1 and evaluated, all of cavities and voids, conductive connectivity, and insulation reliability were good as shown in Table 1.

  In addition, the adhesive films and semiconductor devices obtained in Examples 2 to 10 showed almost the same behavior as Example 1.

DESCRIPTION OF SYMBOLS 1 Intervening layer 11 Outer periphery 2 Dicing tape 21 Outer peripheral part 3, 31 Adhesive film
DESCRIPTION OF SYMBOLS 4 Support film 41 Outer peripheral part 4a, 4b Base material 5 Adhered body 61-64 Laminated body 7 Semiconductor wafer (support body)
71 Semiconductor element 8 Laminate 81 Notch 82 Dicing blade 83 Piece 9 Wafer ring 10, 10 'Dicing tape integrated adhesive sheet 250 Die bonder 260 Collet 270 units (heater)
280 400 units (push-up device)

Claims (14)

The first terminal of the support and the second terminal of the adherend are electrically connected using solder, and are composed of an adhesive film that bonds the support and the adherend, and a dicing tape. A dicing tape integrated adhesive sheet having a laminated structure,
The minimum melt viscosity of the adhesive film is 0.01 to 100,000 Pa · s or less, the exothermic peak temperature of the adhesive film is (a), and the 5% weight loss on heating weight of the adhesive film is (b). A dicing tape integrated adhesive sheet characterized by satisfying the following formula (1) when defined:
(B)-(a) ≧ 100 ° C. (1) (A) a thermosetting resin, (B) a curing agent, (C) a compound having a flux function,
The adhesive film according to claim 1, comprising (D) a film-forming resin.   The dicing according to claim 2, wherein a blending ratio ((A) / (C)) of the (A) thermosetting resin and the (C) compound having a flux function is 0.5 to 20.0. Tape-integrated adhesive sheet.   The dicing tape-integrated adhesive sheet according to claim 2 or 3, wherein the content of the (A) thermosetting resin is 5 to 80% by weight.   The dicing tape-integrated adhesive sheet according to any one of claims 2 to 4, wherein the (A) thermosetting resin is an epoxy resin.   The dicing tape-integrated adhesive sheet according to any one of claims 2 to 5, wherein the compound (C) having a flux function is a compound having a flux function having a carboxyl group and / or a phenolic hydroxyl group.   The compound (C) having a flux function is a compound having a flux function having two phenolic hydroxyl groups in one molecule and a carboxyl group directly bonded to at least one aromatic group. The dicing tape-integrated adhesive sheet according to any one of 6. The dicing tape-integrated adhesive sheet according to claim 2, wherein the compound having the (C) flux function includes a compound represented by the following general formula (2).
_{HOOC- (CH 2) n-COOH} (2)
(In Formula (2), n is an integer of 1-20.) The dicing tape-integrated adhesive sheet according to any one of claims 2 to 8, wherein the compound (C) having a flux function includes a compound represented by the following general formula (3) and / or (4).

[Wherein, R ^{1 to} R ⁵ are each independently a monovalent organic group, and at least one of R ^{1 to} R ⁵ is a hydroxyl group. ]

[Wherein, R ^{6 to} R ²⁰ are each independently a monovalent organic group, and at least one of R ^{6 to} R ²⁰ is a hydroxyl group or a carboxyl group. ]   The dicing tape-integrated adhesive sheet according to any one of claims 1 to 9, wherein the adhesive film further contains a filler.   The dicing tape-integrated adhesive sheet according to claim 10, wherein the content of the filler is 0.1 wt% or more and less than 80 wt%.   A multilayer circuit board comprising a cured product of the adhesive film according to claim 1.   An electronic component comprising the cured product of the adhesive film according to claim 1.   A semiconductor device comprising a cured product of the adhesive film according to claim 1.

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