CN108323171A - 电路构件连接用树脂片 - Google Patents

电路构件连接用树脂片 Download PDF

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Publication number
CN108323171A
CN108323171A CN201680065267.6A CN201680065267A CN108323171A CN 108323171 A CN108323171 A CN 108323171A CN 201680065267 A CN201680065267 A CN 201680065267A CN 108323171 A CN108323171 A CN 108323171A
Authority
CN
China
Prior art keywords
resin
circuit member
bonding piece
piece
resin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680065267.6A
Other languages
English (en)
Chinese (zh)
Inventor
根津裕介
杉野贵志
土谷和宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN108323171A publication Critical patent/CN108323171A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CN201680065267.6A 2015-11-24 2016-11-10 电路构件连接用树脂片 Pending CN108323171A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-229211 2015-11-24
JP2015229211 2015-11-24
PCT/JP2016/083335 WO2017090440A1 (ja) 2015-11-24 2016-11-10 回路部材接続用樹脂シート

Publications (1)

Publication Number Publication Date
CN108323171A true CN108323171A (zh) 2018-07-24

Family

ID=58764010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680065267.6A Pending CN108323171A (zh) 2015-11-24 2016-11-10 电路构件连接用树脂片

Country Status (5)

Country Link
JP (1) JPWO2017090440A1 (ko)
KR (1) KR20180084803A (ko)
CN (1) CN108323171A (ko)
TW (1) TW201728641A (ko)
WO (1) WO2017090440A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7196841B2 (ja) * 2017-06-21 2022-12-27 昭和電工マテリアルズ株式会社 半導体用接着剤、半導体装置の製造方法及び半導体装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1069169A1 (de) * 1999-07-08 2001-01-17 Wacker-Chemie GmbH Emissionsarme Klebemittel auf Basis einer wässrigen, schutzkolloidfreien Polymerdispersion von Vinylacetat-Ethylen-Mischpolymerisaten
JP2001110898A (ja) * 1999-10-12 2001-04-20 Asahi Kasei Corp 半導体装置及びその材料
CN1299852A (zh) * 1999-09-17 2001-06-20 索尼化学株式会社 连接材料
CN1643070A (zh) * 2002-02-06 2005-07-20 积水化学工业株式会社 树脂组合物
JP2011047084A (ja) * 2009-08-28 2011-03-10 Sumitomo Bakelite Co Ltd 有機化繊維、樹脂組成物及びその製造方法
CN103131355A (zh) * 2011-11-28 2013-06-05 日东电工株式会社 底填剂材料及半导体装置的制造方法
CN104145327A (zh) * 2012-02-24 2014-11-12 日立化成株式会社 半导体装置及其制造方法
CN104292749A (zh) * 2013-07-19 2015-01-21 味之素株式会社 树脂组合物
CN104946147A (zh) * 2014-03-31 2015-09-30 日东电工株式会社 芯片接合膜、切割-芯片接合膜及层叠膜
CN105027271A (zh) * 2013-02-21 2015-11-04 日东电工株式会社 底部填充片、背面研削用胶带一体型底部填充片、切割胶带一体型底部填充片及半导体装置的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514840B2 (ja) 1997-02-14 2010-07-28 日立化成工業株式会社 回路部材接続用接着剤
JP5141366B2 (ja) 2008-05-14 2013-02-13 東レ株式会社 半導体用接着フィルムおよびこれを用いた半導体装置の製造方法
JP5961015B2 (ja) * 2012-03-06 2016-08-02 日東電工株式会社 アンダーフィル材及び半導体装置の製造方法
JP6321910B2 (ja) * 2013-03-26 2018-05-09 日東電工株式会社 封止シート、半導体装置の製造方法及び封止シート付き基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1069169A1 (de) * 1999-07-08 2001-01-17 Wacker-Chemie GmbH Emissionsarme Klebemittel auf Basis einer wässrigen, schutzkolloidfreien Polymerdispersion von Vinylacetat-Ethylen-Mischpolymerisaten
CN1299852A (zh) * 1999-09-17 2001-06-20 索尼化学株式会社 连接材料
JP2001110898A (ja) * 1999-10-12 2001-04-20 Asahi Kasei Corp 半導体装置及びその材料
CN1643070A (zh) * 2002-02-06 2005-07-20 积水化学工业株式会社 树脂组合物
JP2011047084A (ja) * 2009-08-28 2011-03-10 Sumitomo Bakelite Co Ltd 有機化繊維、樹脂組成物及びその製造方法
CN103131355A (zh) * 2011-11-28 2013-06-05 日东电工株式会社 底填剂材料及半导体装置的制造方法
CN104145327A (zh) * 2012-02-24 2014-11-12 日立化成株式会社 半导体装置及其制造方法
CN105027271A (zh) * 2013-02-21 2015-11-04 日东电工株式会社 底部填充片、背面研削用胶带一体型底部填充片、切割胶带一体型底部填充片及半导体装置的制造方法
CN104292749A (zh) * 2013-07-19 2015-01-21 味之素株式会社 树脂组合物
CN104946147A (zh) * 2014-03-31 2015-09-30 日东电工株式会社 芯片接合膜、切割-芯片接合膜及层叠膜

Also Published As

Publication number Publication date
TW201728641A (zh) 2017-08-16
KR20180084803A (ko) 2018-07-25
JPWO2017090440A1 (ja) 2018-09-06
WO2017090440A1 (ja) 2017-06-01

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Application publication date: 20180724

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