JP6574413B2 - フラッドコーティング電子回路アセンブリのための配合された樹脂組成物 - Google Patents

フラッドコーティング電子回路アセンブリのための配合された樹脂組成物 Download PDF

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Publication number
JP6574413B2
JP6574413B2 JP2016517071A JP2016517071A JP6574413B2 JP 6574413 B2 JP6574413 B2 JP 6574413B2 JP 2016517071 A JP2016517071 A JP 2016517071A JP 2016517071 A JP2016517071 A JP 2016517071A JP 6574413 B2 JP6574413 B2 JP 6574413B2
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JP
Japan
Prior art keywords
electronic circuit
polyurethane
circuit assembly
composition
flood coat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016517071A
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English (en)
Japanese (ja)
Other versions
JP2016529333A5 (de
JP2016529333A (ja
Inventor
ジヨーダン，リチヤード・デービツド，ジユニア
スカンロン，トーマス・シー，ザ・フオース
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elantas PDG Inc
Original Assignee
Elantas PDG Inc
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Publication date
Application filed by Elantas PDG Inc filed Critical Elantas PDG Inc
Publication of JP2016529333A publication Critical patent/JP2016529333A/ja
Publication of JP2016529333A5 publication Critical patent/JP2016529333A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/24—Catalysts containing metal compounds of tin
    • C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2016517071A 2013-05-31 2014-05-31 フラッドコーティング電子回路アセンブリのための配合された樹脂組成物 Active JP6574413B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361829681P 2013-05-31 2013-05-31
US61/829,681 2013-05-31
PCT/US2014/040421 WO2014194303A1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Publications (3)

Publication Number Publication Date
JP2016529333A JP2016529333A (ja) 2016-09-23
JP2016529333A5 JP2016529333A5 (de) 2017-06-22
JP6574413B2 true JP6574413B2 (ja) 2019-09-11

Family

ID=51014655

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2016517071A Active JP6574413B2 (ja) 2013-05-31 2014-05-31 フラッドコーティング電子回路アセンブリのための配合された樹脂組成物
JP2017515665A Active JP6600681B2 (ja) 2013-05-31 2014-11-29 フラッドコーティング電子回路アセンブリのための配合された樹脂組成物
JP2019162154A Active JP6811818B2 (ja) 2013-05-31 2019-09-05 フラッドコーティング電子回路アセンブリのための配合された樹脂組成物

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2017515665A Active JP6600681B2 (ja) 2013-05-31 2014-11-29 フラッドコーティング電子回路アセンブリのための配合された樹脂組成物
JP2019162154A Active JP6811818B2 (ja) 2013-05-31 2019-09-05 フラッドコーティング電子回路アセンブリのための配合された樹脂組成物

Country Status (13)

Country Link
US (1) US9699917B2 (de)
EP (1) EP2997099B1 (de)
JP (3) JP6574413B2 (de)
KR (1) KR102355209B1 (de)
CN (2) CN105358638B (de)
CA (2) CA2913996C (de)
ES (1) ES2839083T3 (de)
HU (1) HUE053002T2 (de)
MX (2) MX2015016482A (de)
PL (1) PL2997099T3 (de)
PT (1) PT2997099T (de)
SI (1) SI2997099T1 (de)
WO (1) WO2014194303A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020077847A (ja) * 2013-05-31 2020-05-21 エランタス ピー・ディー・ジー インコーポレイテッドＥｌａｎｔａｓ Ｐｄｇ， Ｉｎｃ． フラッドコーティング電子回路アセンブリのための配合された樹脂組成物

Families Citing this family (10)

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Publication number Priority date Publication date Assignee Title
US9832902B2 (en) 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
CN106471087B (zh) 2014-03-12 2020-07-07 艾伦塔斯Pdg有限公司 用于反渗透组件的聚氨酯粘合剂
JP2017536459A (ja) 2014-11-26 2017-12-07 サイテク・インダストリーズ・インコーポレーテツド 多液型ポリウレタン組成物、その物品、及び製造方法
PL3280516T3 (pl) * 2015-04-09 2020-06-01 Elantas Pdg, Inc. Kleje poliuretanowe do modułów do odwróconej osmozy
JP2017147388A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電子装置の製造方法
WO2020092800A1 (en) * 2018-10-31 2020-05-07 H.B. Fuller Company Two component polyurethane system for liquid applied sound deadener
CA3110279A1 (en) * 2018-09-10 2020-03-19 Huntsman International Llc Oxazolidinedione-terminated prepolymer
MX2021002772A (es) 2018-09-10 2021-05-12 Huntsman Int Llc Prepolimero con grupos terminales oxazolidinediona.
CN116888206A (zh) * 2021-02-10 2023-10-13 卡博特公司 生产热塑性弹性体的方法和由此获得的聚合物复合材料
GB2613561A (en) 2021-12-03 2023-06-14 H K Wentworth Ltd Expandable protective coating

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CN106471087B (zh) 2014-03-12 2020-07-07 艾伦塔斯Pdg有限公司 用于反渗透组件的聚氨酯粘合剂
JP2017536459A (ja) 2014-11-26 2017-12-07 サイテク・インダストリーズ・インコーポレーテツド 多液型ポリウレタン組成物、その物品、及び製造方法
PL3280516T3 (pl) 2015-04-09 2020-06-01 Elantas Pdg, Inc. Kleje poliuretanowe do modułów do odwróconej osmozy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020077847A (ja) * 2013-05-31 2020-05-21 エランタス ピー・ディー・ジー インコーポレイテッドＥｌａｎｔａｓ Ｐｄｇ， Ｉｎｃ． フラッドコーティング電子回路アセンブリのための配合された樹脂組成物

Also Published As

Publication number Publication date
JP6600681B2 (ja) 2019-11-06
KR20160014677A (ko) 2016-02-11
CA2913565A1 (en) 2015-11-30
CN105358638B (zh) 2018-08-07
CN105358638A (zh) 2016-02-24
CA2913996A1 (en) 2014-12-04
CN105683316A (zh) 2016-06-15
CN105683316B (zh) 2019-12-31
CA2913996C (en) 2021-08-31
EP2997099B1 (de) 2020-10-14
HUE053002T2 (hu) 2021-06-28
SI2997099T1 (sl) 2021-03-31
PT2997099T (pt) 2021-01-11
MX2015016483A (es) 2016-07-07
EP2997099A1 (de) 2016-03-23
WO2014194303A1 (en) 2014-12-04
JP6811818B2 (ja) 2021-01-13
JP2017524794A (ja) 2017-08-31
JP2016529333A (ja) 2016-09-23
ES2839083T3 (es) 2021-07-05
US9699917B2 (en) 2017-07-04
MX2015016482A (es) 2016-06-21
US20140355225A1 (en) 2014-12-04
KR102355209B1 (ko) 2022-01-25
JP2020077847A (ja) 2020-05-21
PL2997099T3 (pl) 2021-04-19

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