MX2015016482A - Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante. - Google Patents

Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Info

Publication number
MX2015016482A
MX2015016482A MX2015016482A MX2015016482A MX2015016482A MX 2015016482 A MX2015016482 A MX 2015016482A MX 2015016482 A MX2015016482 A MX 2015016482A MX 2015016482 A MX2015016482 A MX 2015016482A MX 2015016482 A MX2015016482 A MX 2015016482A
Authority
MX
Mexico
Prior art keywords
electronic circuit
mils
circuit assemblies
polyurethane resin
resin compositions
Prior art date
Application number
MX2015016482A
Other languages
English (en)
Inventor
Richard David Jordan Jr
C Scanlon Thomas Iv
Original Assignee
Cytec Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Ind Inc filed Critical Cytec Ind Inc
Publication of MX2015016482A publication Critical patent/MX2015016482A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/24—Catalysts containing metal compounds of tin
    • C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Se proporcionan en la presente sistemas formulados de resina que contienen composiciones de recubrimiento aglutinante y se caracterizan por presentar un índice tixotrópico inicial de la mezcla entre 1 y 5 y un tiempo de gel de entre 5 y 15 minutos de manera tal que cuando se curan las composiciones proporcionan una dureza Shore de 15A a 90A, un espesor en superficies horizontales de 20 mils (0.506mm) a 75 mils (1.905mm), y un espesor en superficies verticales al montaje sea de 4 mils (0.101mm) a 20 mils (0.508mm). También se proporcionan montajes de circuitos electrónicos con recubrimiento de los sistemas de resinas y métodos para proteger y soportar los montajes.
MX2015016482A 2013-05-31 2014-05-31 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante. MX2015016482A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361829681P 2013-05-31 2013-05-31
PCT/US2014/040421 WO2014194303A1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Publications (1)

Publication Number Publication Date
MX2015016482A true MX2015016482A (es) 2016-06-21

Family

ID=51014655

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2015016482A MX2015016482A (es) 2013-05-31 2014-05-31 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.
MX2015016483A MX2015016483A (es) 2013-05-31 2014-11-29 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2015016483A MX2015016483A (es) 2013-05-31 2014-11-29 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Country Status (13)

Country Link
US (1) US9699917B2 (es)
EP (1) EP2997099B1 (es)
JP (3) JP6574413B2 (es)
KR (1) KR102355209B1 (es)
CN (2) CN105358638B (es)
CA (2) CA2913996C (es)
ES (1) ES2839083T3 (es)
HU (1) HUE053002T2 (es)
MX (2) MX2015016482A (es)
PL (1) PL2997099T3 (es)
PT (1) PT2997099T (es)
SI (1) SI2997099T1 (es)
WO (1) WO2014194303A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SI2997099T1 (sl) 2013-05-31 2021-03-31 Elantas Pdg Inc. Formulirani poliuretanski smolni sestavki za prelivno prevlečenje elektronskih tokokrožnih sestavov
US9832902B2 (en) 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
US10590318B2 (en) 2014-11-26 2020-03-17 Elantas Pdg, Inc. Multi-part polyurethane compositions, articles thereof, and method of making
US10865333B2 (en) 2015-04-09 2020-12-15 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
JP2017147388A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電子装置の製造方法
BR112021003432A2 (pt) * 2018-09-10 2021-05-18 Huntsman International Llc composto, composto de poli(uretano-amida), e, produto
US20210340310A1 (en) * 2018-09-10 2021-11-04 Huntsman International Llc Oxazolidinedione-terminated prepolymer
JP7391101B2 (ja) 2018-10-31 2023-12-04 エイチ．ビー．フラー カンパニー 液体塗布型制振材用の２成分ポリウレタン系
EP4291607A1 (en) * 2021-02-10 2023-12-20 Cabot Corporation Method of producing thermoplastic elastomers and polymer composite obtained thereby
GB2613561A (en) 2021-12-03 2023-06-14 H K Wentworth Ltd Expandable protective coating

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3747037A (en) * 1968-01-11 1973-07-17 Gen Electric Petroleum based oil modified castor oil-urethane composition for electrical potting
BE792621A (fr) 1971-12-15 1973-03-30 Western Electric Co Procede et produit pour chasser l'eau infiltree dans des cablestelephoniques et analogues
US3962094A (en) 1973-09-18 1976-06-08 The Dow Chemical Company Hollow fiber separatory device
US4008197A (en) 1974-01-11 1977-02-15 N L Industries, Inc. Mineral oil extended polyurethane system containing a coupling agent for decontaminating and sealing the interior spaces of an insulated electrical device
US4170559A (en) 1976-11-05 1979-10-09 N L Industries, Inc. Hollow fiber separatory device
US4224164A (en) 1978-10-20 1980-09-23 Nl Industries, Inc. Non-wicking polyurethane casting systems
JPS5489269A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Coating method of printed board
US4168258A (en) 1978-02-15 1979-09-18 N L Industries, Inc. Grease compatible, mineral oil extended polyurethane
US4267044A (en) 1978-04-10 1981-05-12 Nl Industries, Inc. Thixotropic polyurethane compositions as sealants for membrane separatory devices
US4300184A (en) 1979-07-11 1981-11-10 Johnson Controls, Inc. Conformal coating for electrical circuit assemblies
US4256617A (en) 1979-11-01 1981-03-17 Nl Industries, Inc. Catalyzed non-toxic polyurethane forming compositions and separatory devices employing the same
US4284506A (en) 1979-12-26 1981-08-18 Nl Industries, Inc. Biomedical devices
US4395530A (en) 1980-10-24 1983-07-26 Colamco, Inc. Catalyst initiated prepolymer systems
DE3046409A1 (de) * 1980-12-10 1982-07-15 Bayer Ag, 5090 Leverkusen Beschichtungsmittel und ein verfahren zur herstellung von ueberzuegen
US4375521A (en) 1981-06-01 1983-03-01 Communications Technology Corporation Vegetable oil extended polyurethane systems
US4454176A (en) 1981-10-21 1984-06-12 E. I. Du Pont De Nemours And Company Supported reverse osmosis membranes
JPS5933605A (ja) * 1982-08-17 1984-02-23 Fuji Photo Film Co Ltd 電子スチルカメラの音声記録方式
US4444976A (en) * 1982-12-20 1984-04-24 The Goodyear Tire & Rubber Company Sag resistant two component adhesive and sealant
JPS6027441U (ja) * 1983-08-01 1985-02-25 日本電気株式会社 混成集積回路装置
US4518631A (en) 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
US4879032A (en) 1984-06-04 1989-11-07 Allied Resin Corporation Fluid separatory devices having improved potting and adhesive compositions
US4876303A (en) 1984-06-15 1989-10-24 American Telephone And Telegraph Company, At&T Bell Laboratories Mineral-oil-free encapsulant composition
US4603188A (en) 1985-07-10 1986-07-29 Itoh Seiyu Kabushiki Kaisha Curable urethane composition
US5266145A (en) 1986-03-05 1993-11-30 Teroson Gmbh Sealant and adhesive
US4826894A (en) * 1987-05-19 1989-05-02 Mobay Corporation Aqueous polyurethane-ureas dispersions and their use for the production of coatings having improved humidity resistance
US4923756A (en) 1987-08-20 1990-05-08 Ashland Oil, Inc. Primerless adhesive for fiberglass reinforced polyester substrates
US4865735A (en) 1988-02-18 1989-09-12 Caschem, Inc. Amine containing polyurethane compositions for separatory devices
US4886600A (en) 1988-02-18 1989-12-12 Caschem, Inc. Moisture and glycerine resistant polyurethane compositions for separatory devices
US4842736A (en) 1988-09-06 1989-06-27 Desalination Systems, Inc. Spiral wound membrane
JPH03217473A (ja) 1990-01-23 1991-09-25 Toyobo Co Ltd 被覆剤組成物およびそれを用いた印刷配線板
CA2041532C (en) 1991-04-30 2002-01-01 Hamdy Khalil Urethane sealant having improved sag properties
DE4134693A1 (de) * 1991-10-21 1993-04-22 Basf Ag Transparente, heissdampfsterilisierbare, nicht zytotoxische, im wesentlichen kompakte polyurethan-vergussmassen, verfahren zu ihrer herstellung und ihre verwendung, insbesondere fuer medizinisch-technische artikel
US5360543A (en) 1992-06-05 1994-11-01 Caschem, Inc. Polyurethane compositions
JP3340762B2 (ja) 1992-08-11 2002-11-05 横浜ゴム株式会社 ケーブル接続部密封用混和物
US5556934A (en) 1993-09-03 1996-09-17 H. B. Fuller Licensing & Financing Inc. Isocyanurate embedment compound
US5863597A (en) 1996-01-23 1999-01-26 Sundstrand Corporation Polyurethane conformal coating process for a printed wiring board
JPH101607A (ja) * 1996-06-14 1998-01-06 M C Kogyo Kk 多成分形揺変性ポリウレタン樹脂組成物
US5871822A (en) * 1996-09-26 1999-02-16 Honeywell Inc. Low emissions method for spray application of conformal coating to electronic assemblies
US6130268A (en) 1997-06-23 2000-10-10 Polyfoam Products, Inc. Two component polyurethane construction adhesive
DE10108025A1 (de) 2001-02-19 2002-09-05 Henkel Kgaa Zweikomponentiger Polyurethan-Klebstoff für Holzwerkstoffe
US20060076047A1 (en) 2001-04-23 2006-04-13 Green David R Potted domed solar panel capsule and traffic warning lamps incorporating same
KR100442843B1 (ko) * 2002-03-13 2004-08-02 삼성에스디아이 주식회사 연료전지 단위체, 그 제조 방법 및 이를 채용한 연료전지
AU2003245611B2 (en) 2002-06-21 2009-05-07 Ge Osmonics, Inc. Blister protection for spiral wound elements
US20040012936A1 (en) * 2002-07-18 2004-01-22 Gravelin Pascal A. Device and method for enclosure of electronic printed circuit board based products
US20040072953A1 (en) 2002-10-15 2004-04-15 Ju-Ming Hung Reactive hot melt adhesive with non-polymeric aliphatic difunctionals
US6992134B2 (en) * 2002-10-29 2006-01-31 Tim Croley Polyurethane system and application thereof
US6797799B1 (en) * 2003-04-02 2004-09-28 Bayer Materialscience Llc High 2,4′-diphenylmethane diisocyanate content prepolymers
JP2005161191A (ja) * 2003-12-02 2005-06-23 Mitsui Kagaku Sanshi Kk 防水性２液型ポリウレタン塗膜
JP4328645B2 (ja) * 2004-02-26 2009-09-09 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP4548072B2 (ja) 2004-09-30 2010-09-22 横浜ゴム株式会社 ２液硬化型ポリウレタン樹脂組成物
DE102004062551A1 (de) * 2004-12-24 2006-07-06 Rhein Chemie Rheinau Gmbh Mikrogel-enthaltende duroplastische Zusammensetzung
WO2008076146A1 (en) * 2006-12-21 2008-06-26 Dow Global Technologies Inc. Composition useful as an adhesive for installing vehicle windows
JP2007227981A (ja) * 2007-06-11 2007-09-06 Hitachi Chem Co Ltd 樹脂ペースト及びこれを用いたフレキシブル配線板
WO2009020774A1 (en) 2007-08-06 2009-02-12 Dow Global Technologies Inc. Polyol blends and their use in making polymers
CN101868487A (zh) 2007-09-21 2010-10-20 陶氏环球技术公司 聚氨酯聚合物体系
TWI453253B (zh) * 2007-10-18 2014-09-21 Ajinomoto Kk Resin composition
US7781513B2 (en) 2007-11-14 2010-08-24 Momentive Performance Materials Inc. Two-part moisture-curable resin composition and adhesive, sealant and coating compositions based thereon
US8349123B2 (en) 2008-04-01 2013-01-08 Henkel Corporation High heat resistant adhesive and sealant compositions
DE102008021980A1 (de) * 2008-05-02 2009-11-05 Bayer Materialscience Ag Neue Katalysatoren und deren Einsatz bei der Herstellung von Polyurethanen
US20090294015A1 (en) * 2008-06-02 2009-12-03 Larry Gluck Weather-resistant illuminated ornamental stepping stones and method of manufacture thereof
GB2473982B (en) * 2008-07-18 2013-01-23 World Properties Inc Circuit materials, circuits laminates and method of manufacture thereof
CN101412860B (zh) * 2008-12-04 2011-02-16 中国科学院长春应用化学研究所 一种抗氧阻效应的紫外光-热双固化涂料组合物及其制备方法
US8360390B2 (en) 2009-01-13 2013-01-29 Enphase Energy, Inc. Method and apparatus for potting an electronic device
US9309439B2 (en) 2010-07-22 2016-04-12 Construction Research & Technology Gmbh Sealant and adhesive using green prepolymer
US8822844B1 (en) * 2010-09-27 2014-09-02 Rockwell Collins, Inc. Shielding and potting for electrical circuits
US8697188B2 (en) 2011-09-02 2014-04-15 Construction Research & Technology Gmbh Polyurethane systems having non-sag and paintability
CN102757722B (zh) * 2012-07-13 2014-12-10 江苏苏博特新材料股份有限公司 一种双组份聚氨酯涂料及其制备方法
CN102850989B (zh) 2012-09-26 2014-04-09 贵阳时代沃顿科技有限公司 一种双组分聚氨酯胶粘剂及其制备方法
CN102911636B (zh) 2012-09-26 2013-12-18 贵阳时代沃顿科技有限公司 一种双组分聚氨酯胶粘剂及其制备方法和应用
JP2014187287A (ja) * 2013-03-25 2014-10-02 Mitsubishi Heavy Ind Ltd 回路基板の製造方法
US9832902B2 (en) * 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
SI2997099T1 (sl) * 2013-05-31 2021-03-31 Elantas Pdg Inc. Formulirani poliuretanski smolni sestavki za prelivno prevlečenje elektronskih tokokrožnih sestavov
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
US10590318B2 (en) 2014-11-26 2020-03-17 Elantas Pdg, Inc. Multi-part polyurethane compositions, articles thereof, and method of making
US10865333B2 (en) 2015-04-09 2020-12-15 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules

Also Published As

Publication number Publication date
KR102355209B1 (ko) 2022-01-25
CN105358638A (zh) 2016-02-24
US20140355225A1 (en) 2014-12-04
JP2017524794A (ja) 2017-08-31
HUE053002T2 (hu) 2021-06-28
KR20160014677A (ko) 2016-02-11
CN105683316A (zh) 2016-06-15
CN105683316B (zh) 2019-12-31
JP6574413B2 (ja) 2019-09-11
CA2913996A1 (en) 2014-12-04
JP2016529333A (ja) 2016-09-23
CA2913996C (en) 2021-08-31
JP6811818B2 (ja) 2021-01-13
WO2014194303A1 (en) 2014-12-04
ES2839083T3 (es) 2021-07-05
JP2020077847A (ja) 2020-05-21
CA2913565A1 (en) 2015-11-30
EP2997099B1 (en) 2020-10-14
CN105358638B (zh) 2018-08-07
PT2997099T (pt) 2021-01-11
PL2997099T3 (pl) 2021-04-19
EP2997099A1 (en) 2016-03-23
SI2997099T1 (sl) 2021-03-31
MX2015016483A (es) 2016-07-07
US9699917B2 (en) 2017-07-04
JP6600681B2 (ja) 2019-11-06

Similar Documents

Publication Publication Date Title
MX2015016482A (es) Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.
EP3529317A4 (en) ALKALI-SOLUBLE RESIN ADDITIVES AND COATING COMPOSITIONS WITH SUCH ADDITIVES
EP3508533A4 (en) CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND PROTECTIVE OR ADHESIVE AGENT COMPOSITION FOR ELECTRICAL / ELECTRONIC COMPONENTS
MY168405A (en) Elastomeric film-forming compositions and articles made from the elastomeric film
MX352849B (es) Composiciones de revestimiento a base de agua, de un componente, curables a temperatura ambiente, metodos relacionados y sustratos revestidos.
MY178718A (en) Powder coating composition
EP3039707A4 (en) Curable composition for photoimprint and method of producing film, optical component, circuit board, or electronic component using the composition
TW201129614A (en) Epoxy-containing polymer compound, photocurable resin composition comprising the same, method for forming pattern, and film for protecting electric/electronic part
SA516370453B1 (ar) أغلفة مضادة للتآكل
TW201612225A (en) Additive for LDS plastics
SG11201807157QA (en) Anticorrosion coating composition, anticorrosion coating film, substrate with anticorrosion coating film, and method of manufacturing same
EP3067371A4 (en) Curable composition for printed wiring board, and cured coating and printed wiring board using same
EP3252102A4 (en) Flame-retardant epoxy resin composition, prepreg formed using this, and laminate plate
EP3239246A4 (en) Halogen-free phosphorus-free silicon resin composition, and prepreg, laminated board, copper-clad plate using same, and printed circuit board
SG10201808741RA (en) An erodible antifouling coating composition
SG11201606713QA (en) Curable composition for photoimprint, cured product, and method of producing film having pattern, optical component, circuit board, or electronic component using the composition
MX2017009291A (es) Dispositivos y componentes electricos utilizados en sistemas electricos fabricados con materiales autorreparables.
EP3597703A4 (en) COMPOSITION OF CYANATE ESTER RESIN AND PRE-IMPREGNATE
GB2557043A (en) Coating
SG11201908559XA (en) Photosensitive resin composition, photosensitive resin composition film, insulating film and electronic component
BR112017007731A2 (pt) artigo revestido, métodos para produzir o artigo revestido e para preparar uma composição de revestimento por eletrodeposição.
EP3858919A4 (en) FIRE-RESISTANT COMPOSITION OF POLYCARBONATE RESIN
EP3680310A4 (en) COMPOSITION AND FLAME RETARDANT RESIN COMPOSITION
NZ719888A (en) Curable film-forming compositions comprising catalyst associated with a carrier and methods for coating a substrate
MX2017013720A (es) Aditivos sin silicona en materiales de revestimiento de liberacion.