MX2015016483A - Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante. - Google Patents

Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Info

Publication number
MX2015016483A
MX2015016483A MX2015016483A MX2015016483A MX2015016483A MX 2015016483 A MX2015016483 A MX 2015016483A MX 2015016483 A MX2015016483 A MX 2015016483A MX 2015016483 A MX2015016483 A MX 2015016483A MX 2015016483 A MX2015016483 A MX 2015016483A
Authority
MX
Mexico
Prior art keywords
mils
flood
assembly
electronic circuit
circuit assemblies
Prior art date
Application number
MX2015016483A
Other languages
English (en)
Inventor
Richard David Jordan Jr
C Scanlon Thomas Iv
Original Assignee
Cytec Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Ind Inc filed Critical Cytec Ind Inc
Priority claimed from PCT/US2014/067837 external-priority patent/WO2015183339A1/en
Publication of MX2015016483A publication Critical patent/MX2015016483A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/24—Catalysts containing metal compounds of tin
    • C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Se proporcionan montajes de circuitos electrónicos recubiertos con composiciones poliméricas de recubrimiento aglutinante como se describe o ejemplifica en la presente. La composición de recubrimiento aglutinante se caracteriza por tener suficiente tiempo de gel e índice tixotrópico como para recubrir o encapsular sustancialmente el montaje de circuito eléctrico como una masa fija luego del curado de manera que espesor en superficies horizontales al montaje sea de (0.508 mm) 20 mils a (1.905 mm) 75 mils, y el espesor en superficies de componentes verticales al montaje sea de (0.1016 mm) 4 mils a (0.508 mm) 20 mils. Los montajes recubiertos y los dispositivos que los contienen son ventajosos en comparación con otros materiales de relleno o recubrimientos aislantes ya que requieren menos material y por lo tanto reducen el peso y el costo, y son capaces de soportar condiciones ambientales extremas, ya sean de temperatura y/o vibración.
MX2015016483A 2013-05-31 2014-11-29 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante. MX2015016483A (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361829681P 2013-05-31 2013-05-31
US14/292,876 US9699917B2 (en) 2013-05-31 2014-05-31 Formulated resin compositions for flood coating electronic circuit assemblies
PCT/US2014/040421 WO2014194303A1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies
PCT/US2014/067837 WO2015183339A1 (en) 2014-05-31 2014-11-29 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Publications (1)

Publication Number Publication Date
MX2015016483A true MX2015016483A (es) 2016-07-07

Family

ID=51014655

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2015016482A MX2015016482A (es) 2013-05-31 2014-05-31 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.
MX2015016483A MX2015016483A (es) 2013-05-31 2014-11-29 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MX2015016482A MX2015016482A (es) 2013-05-31 2014-05-31 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Country Status (13)

Country Link
US (1) US9699917B2 (es)
EP (1) EP2997099B1 (es)
JP (3) JP6574413B2 (es)
KR (1) KR102355209B1 (es)
CN (2) CN105358638B (es)
CA (2) CA2913996C (es)
ES (1) ES2839083T3 (es)
HU (1) HUE053002T2 (es)
MX (2) MX2015016482A (es)
PL (1) PL2997099T3 (es)
PT (1) PT2997099T (es)
SI (1) SI2997099T1 (es)
WO (1) WO2014194303A1 (es)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUE053002T2 (hu) 2013-05-31 2021-06-28 Elantas Pdg Inc Formált poliuretángyanta készítmények elektronikai áramkör összeállítások felületi bevonására
US9832902B2 (en) 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
CN106471087B (zh) 2014-03-12 2020-07-07 艾伦塔斯Pdg有限公司 用于反渗透组件的聚氨酯粘合剂
JP2017536459A (ja) 2014-11-26 2017-12-07 サイテク・インダストリーズ・インコーポレーテツド 多液型ポリウレタン組成物、その物品、及び製造方法
PL3280516T3 (pl) * 2015-04-09 2020-06-01 Elantas Pdg, Inc. Kleje poliuretanowe do modułów do odwróconej osmozy
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CN116888206A (zh) * 2021-02-10 2023-10-13 卡博特公司 生产热塑性弹性体的方法和由此获得的聚合物复合材料
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Also Published As

Publication number Publication date
JP6600681B2 (ja) 2019-11-06
KR20160014677A (ko) 2016-02-11
CA2913565A1 (en) 2015-11-30
CN105358638B (zh) 2018-08-07
CN105358638A (zh) 2016-02-24
CA2913996A1 (en) 2014-12-04
CN105683316A (zh) 2016-06-15
CN105683316B (zh) 2019-12-31
CA2913996C (en) 2021-08-31
EP2997099B1 (en) 2020-10-14
HUE053002T2 (hu) 2021-06-28
SI2997099T1 (sl) 2021-03-31
PT2997099T (pt) 2021-01-11
JP6574413B2 (ja) 2019-09-11
EP2997099A1 (en) 2016-03-23
WO2014194303A1 (en) 2014-12-04
JP6811818B2 (ja) 2021-01-13
JP2017524794A (ja) 2017-08-31
JP2016529333A (ja) 2016-09-23
ES2839083T3 (es) 2021-07-05
US9699917B2 (en) 2017-07-04
MX2015016482A (es) 2016-06-21
US20140355225A1 (en) 2014-12-04
KR102355209B1 (ko) 2022-01-25
JP2020077847A (ja) 2020-05-21
PL2997099T3 (pl) 2021-04-19

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