JP6811818B2 - フラッドコーティング電子回路アセンブリのための配合された樹脂組成物 - Google Patents
フラッドコーティング電子回路アセンブリのための配合された樹脂組成物 Download PDFInfo
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- JP6811818B2 JP6811818B2 JP2019162154A JP2019162154A JP6811818B2 JP 6811818 B2 JP6811818 B2 JP 6811818B2 JP 2019162154 A JP2019162154 A JP 2019162154A JP 2019162154 A JP2019162154 A JP 2019162154A JP 6811818 B2 JP6811818 B2 JP 6811818B2
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- KHLCTMQBMINUNT-UHFFFAOYSA-N octadecane-1,12-diol Chemical compound CCCCCCC(O)CCCCCCCCCCCO KHLCTMQBMINUNT-UHFFFAOYSA-N 0.000 description 1
- AEIJTFQOBWATKX-UHFFFAOYSA-N octane-1,2-diol Chemical compound CCCCCCC(O)CO AEIJTFQOBWATKX-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- UDKSLGIUCGAZTK-UHFFFAOYSA-N phenyl pentadecane-1-sulfonate Chemical compound CCCCCCCCCCCCCCCS(=O)(=O)OC1=CC=CC=C1 UDKSLGIUCGAZTK-UHFFFAOYSA-N 0.000 description 1
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- WEAPVABOECTMGR-UHFFFAOYSA-N triethyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCOC(=O)CC(C(=O)OCC)(OC(C)=O)CC(=O)OCC WEAPVABOECTMGR-UHFFFAOYSA-N 0.000 description 1
- 239000001069 triethyl citrate Substances 0.000 description 1
- VMYFZRTXGLUXMZ-UHFFFAOYSA-N triethyl citrate Natural products CCOC(=O)C(O)(C(=O)OCC)C(=O)OCC VMYFZRTXGLUXMZ-UHFFFAOYSA-N 0.000 description 1
- 235000013769 triethyl citrate Nutrition 0.000 description 1
- TUUQISRYLMFKOG-UHFFFAOYSA-N trihexyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCCCCCOC(=O)CC(C(=O)OCCCCCC)(OC(C)=O)CC(=O)OCCCCCC TUUQISRYLMFKOG-UHFFFAOYSA-N 0.000 description 1
- AMMPRZCMKXDUNE-UHFFFAOYSA-N trihexyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound CCCCCCOC(=O)CC(O)(C(=O)OCCCCCC)CC(=O)OCCCCCC AMMPRZCMKXDUNE-UHFFFAOYSA-N 0.000 description 1
- APVVRLGIFCYZHJ-UHFFFAOYSA-N trioctyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound CCCCCCCCOC(=O)CC(O)(C(=O)OCCCCCCCC)CC(=O)OCCCCCCCC APVVRLGIFCYZHJ-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-VBJOUPRGSA-N triricinolein Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/C[C@H](O)CCCCCC)COC(=O)CCCCCCC\C=C/C[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-VBJOUPRGSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- VNTDZUDTQCZFKN-UHFFFAOYSA-L zinc 2,2-dimethyloctanoate Chemical compound [Zn++].CCCCCCC(C)(C)C([O-])=O.CCCCCCC(C)(C)C([O-])=O VNTDZUDTQCZFKN-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/22—Catalysts containing metal compounds
- C08G18/24—Catalysts containing metal compounds of tin
- C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
- C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
- C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Paints Or Removers (AREA)
- Polyurethanes Or Polyureas (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
フォーマルコーティングとの間のギャップを埋める試みにおいて、振動を減衰し、従来の注封されたアセンブリで使用される全体的な樹脂の重量及び費用を下げつつ、機械的な構造支持を与えることができる、低硬度、低弾性の配合された樹脂系は、当該技術分野における有用な進化になるであろうし、注封する及び/またはコンフォーマルコーティング系の使用が必要な産業における迅速な容認を見いだすことができるであろう。
一の参照番号が使用される。図面は、縮尺通りに描かれず、または示されず、明確にするために単純化されていてもよい。さらに、一実施形態の要素及び特徴を、さらに引用することなく他の実施形態に有利に組み込んでもよいことが想定される。
シルメタン−4,4’−ジイソシアネート、1,3−ビス(イソシアナトメチル)シクロヘキサン、メチル−シクロヘキサンジイソシアネート、m−テトラメチルキシリレンジイソシアネート、2,4,6−トリイソプロピルベンゼンジイソシアネート、イソプロピリデンビス(4−シクロヘキシルイソシアネート)及びこれらの混合物によって例示することができる。ジイソシアネートの例示的な混合物としては、4,4’−MDIと2,4−MDIの混合物が挙げられる。
Products(アレンタウン、PA、USA)から市販されるジブチルスズジアセテート;BiCAT(登録商標)8としてShepherd Chemical Company(ノーウッド、OH、USA)から市販される、亜鉛ネオデカノエート、ビスマスデカノエート及びネオデカン酸のブレンド;AMSPEC(登録商標)GCR−56としてAmspec Chemical Corporation(ベア、DE、USA)から市販される鉄アセチルアセトネート;オレイン酸105としてAcme−Hardesty Company(ブルーベル、PA、USA)から市販されるオレイン酸が挙げられる。
ポリマー樹脂系のA部分は、エポキシド当量(EEW)が174g/mol〜250g/mol、好ましくは、185g/mol〜195g/molのビスフェノール−A(DGEBA)のジグリシジルエーテルを含んでいてもよい。
アミン);N,N’−1,2−エタンジイルビス−1,3−プロパンジアミン(N4−ア
ミン)、またはジプロピレントリアミン;アリール脂肪族ポリアミン、例えば、m−キシリレンジアミン(mXDA)、またはp−キシリレンジアミン;脂環式ポリアミン、例えば、1,3−ビスアミノシクロヘキシルアミン(1,3−BAC)、イソホロンジアミン(IPDA)、または4,4’−メチレンビスシクロヘキサンアミン(PACM)、4,4’−メチレンビス−(2−メチル−シクロヘキサンアミン);芳香族ポリアミン、例え
ば、m−フェニレンジアミン、ジアミノジフェニルメタン(DDM)、またはジアミノジフェニルスルホン(DDS);ヘテロ環ポリアミン、例えば、N−アミノエチルピペラジン(NAEP)、または3,9−ビス(3−アミノプロピル)2,4,8,10−テトラオキサスピロ(5,5)ウンデカン;アルコキシ基がオキシエチレン、オキシプロピレン、オキシ−1,2−ブチレン、オキシ−1,4−ブチレンであってもよいポリアルコキシポリアミン、またはこれらのコポリマー、例えば、4,7−ジオキサデカン−1,10−ジアミン、1−プロパンアミン、3,3’−(オキシビス(2,1−エタンジイルオキシ))ビス(ジアミノプロピル化ジエチレングリコールANCAMINE(登録商標)1922A)、ポリ(オキシ(メチル−1,2−エタンジイル))、α−(2−アミノメチルエチル)ω−(2−アミノメチルエトキシ)(JEFFAMINE(登録商標)D 230、D−400)、トリエチレングリコールジアミン及びオリゴマー(JEFFAMINE(登録商標)XTJ−504、JEFFAMINE(登録商標)XTJ−512)、ポリ(オキシ(メチル−1,2−エタンジイル))、α,α’−(オキシジ−2,1−エタンジイル)ビス(ω−(アミノメチルエトキシ))(JEFFAMINE(登録商標)XTJ−511)、ビス(3−アミノプロピル)ポリテトラヒドロフラン350、ビス(3−アミノプロピル)ポリテトラヒドロフラン750、ポリ(オキシ(メチル−1,2−エタンジイル))、α−ヒドロ−ω−(2−アミノメチルエトキシ)エーテルと2−エチル−2−(ヒドロキシメチル)−1,3−プロパンジオール(3:1)(JEFFAMINE(登録商標)T−403)及びジアミノプロピルジプロピレングリコールが挙げられる。JEFFAMINE(登録商標)は、Huntsman Petrochemical
LLC.の登録商標である。
アミンのポリエーテルは、Huntsman Corporation(ソルトレークシティー、UT)からJEFFAMINE(登録商標)の名称で製造販売される。特に好ましいのはJEFFAMINE(登録商標)D−230であり、末端に一級アミンを有し、アミン官能基が2であり、分子量が約230のポリオキシプロピレングリコールである。接着剤組成物中での架橋は、ヒドロキシルを含有する三級アミン、例えば、QUADROL(登録商標)としてBASF Corp.(ドイツ)によって市販されるジイソプロパノールアミンを加えることによってさらに促進することができる。樹脂系の2つ以上の部分をこのようなアミン存在下で混合すると、チキソトロピーは、すばやく成長する。レオロジー剤(またはチキソトロピー剤)としては、限定されないが、無機添加剤も挙げられ、例えば、フュームドシリカ、アモルファス二酸化ケイ素、クレイ、ベントナイト、タルクなど、及びこれらの組合せも挙げられる。
ロヘキサンジカルボン酸ジイソノニルエステル、エポキシ化植物油、アルキルスルホン酸フェニルエステル、N−エチルトルエンスルホンアミド(オルト異性体及びパラ異性体)、N−(2−ヒドロキシプロピル)ベンゼンスルホンアミド、N−(n−ブチル)ベンゼンスルホンアミド、トリクレシルホスフェート、トリブチルホスフェート、グリコール/ポリエーテル、有機ホスフェート、トリエチレングリコールジヘキサノエート、テトラエチレングリコールジヘプタノエート、ポリマー可塑剤、ポリブテン、アセチル化されたモノグリセリド、クエン酸アルキル、クエン酸トリエチル、アセチルトリエチルシトレート、クエン酸トリブチル、アセチルトリブチルシトレート、クエン酸トリオクチル、アセチルトリオクチルシトレート、クエン酸トリヘキシル、アセチルトリヘキシルシトレート、ブチリルトリヘキシルシトレート及びトリメチルシトレートが挙げられる。
Mobil Chemical(ヒューストン、TX、USA)製の他のJAYFLEX(商標)可塑剤(例えば、JAYFLEX DOP)、Monsanto(セントルイス、ミズーリ、USA)から市販されるDIOCTYL(商標)、SANTICIZER(登録商標)及びDIBUTYL(商標)可塑剤、Bayer Corporation(ドイツ)から市販されるADIMOLL(登録商標)、DISFLAMOLL(登録商標)、MESAMOLL(登録商標)、UNIMOLL(登録商標)、TEGDA(商標)、TRIACETIN(商標)及びULTRAMOLL(商標)可塑剤も挙げられる。好ましい可塑剤は、低揮発性であり、例えば、長鎖の分岐したフタレート(例えば、ジトリデシルフタレート、ジ−L−ノニルフタレート及びジ−L−ウンデシルフタレート)である。有用なジベンゾエートは、Velsicol Chemical Corporation(ローズモント、IL、USA)から市販されるBENZOFLEX(登録商標)988、BENZOFLEX(登録商標)50及びBENZOFLEX(登録商標)400として入手可能である。大豆油は、商標名FLEXOL(商標)EPOでDow Chemicals(DE、USA)から市販される。
(「thou」としても知られる)、インペリアル長さ単位を指し、インチの1/1000に等しい。本明細書で使用される場合、「実質的に覆うか、及び/または包み込む」という用語は、電子回路アセンブリ及び/または電子回路要素の大部分、例えば、80%より多く、さらに好ましくは、90%より多く、さらに好ましくは、100%がフラッドコート組成物によって覆われていることを意味する。
ト組成物。
要素表面上のフラッドコート組成物の厚みが20mil〜75mil、基部支持材に対して鉛直方向の要素表面上のフラッドコート組成物の厚みが4mil〜20milであるように十分なゲル化時間及びチキソトロピー指数を有する、電子回路アセンブリ。
ロインバーターの重量は、2,200.00グラムである(すなわち、347.96グラムのポリマー樹脂材料を使用する)。
+20℃から開始し、HALTチャンバの温度を50℃/分の速度で−40℃まで下げ、安定化の後、DUTをこの温度に10分間維持する。次いで、このチャンバを50℃/分で+120℃まで上げ、安定化の後、DUTをこの温度に10分間維持する。このプロセスを2回繰り返し、合計で3回の完全なサイクルを行う。
Claims (14)
- 電子回路アセンブリであって、基部支持材と、前記電子回路アセンブリに接続する前記基部支持材表面から外側に延び、前記電子回路に電気的に接続する複数の電子回路要素とを含み、前記電子回路アセンブリは、所定体積の組成物であって、エポキシ、エポキシ−ポリウレタンハイブリッド、シリコーン、アクリル及びこれらの混合物からなる群から選択される多成分ポリマー樹脂系を含む組成物でフラッドコーティングされており、前記組成物は、硬化すると、固定された塊として、前記電子回路アセンブリを実質的に覆うか、または包み込み、かつ、前記基部支持材に対して水平方向の要素表面上の前記組成物の厚みが20mil〜75mil、前記基部支持材に対して鉛直方向の要素表面上の前記組成物の厚みが4mil〜20milであるように十分なゲル化時間及びチキソトロピー指数を有する、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記基部支持材に対して水平方向の要素表面上の前記組成物の厚みが20milより大きく、70mil未満であることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記基部支持材に対して鉛直方向の要素表面上の前記組成物の厚みが4milより大きく、20mil未満であることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記組成物が、硬化すると、ショアー(Shore)硬度が15A〜85Dであることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記組成物が、ゲル化時間5分〜15分をもつことを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記組成物のチキソトロピー指数が1〜1.5であることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記多成分ポリマー樹脂系がエポキシ−ポリウレタンハイブリッドを含み、エポキシ−ポリウレタンハイブリッドがヒマシ油を含むことを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記ポリマー樹脂がシリコーンを含み、チキソトロピー指数が1〜5であることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、ショアー硬度が30A〜90Aであることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記ポリマー樹脂系がエポキシ官能基を含み、チキソトロピー指数が3〜5であることを特徴とする、前記電子回路アセンブリ。
- 請求項10に記載の電子回路アセンブリであって、ショアー硬度が40A〜85Dであることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、前記組成物が、重量が60グラム〜150グラムであることを特徴とする、前記電子回路アセンブリ。
- 請求項12に記載の電子回路アセンブリであって、前記重量が60グラムより大きく、100グラム未満であることを特徴とする、前記電子回路アセンブリ。
- 請求項1に記載の電子回路アセンブリであって、極端な温度及び/または振動にさらされたとき、改良された機械的な支持及び環境からの保護を有することをさらに特徴とする、前記電子回路アセンブリ。
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US201361829681P | 2013-05-31 | 2013-05-31 | |
US14/292,876 US9699917B2 (en) | 2013-05-31 | 2014-05-31 | Formulated resin compositions for flood coating electronic circuit assemblies |
USPCT/US2014/040421 | 2014-05-31 | ||
US14/292,876 | 2014-05-31 | ||
PCT/US2014/040421 WO2014194303A1 (en) | 2013-05-31 | 2014-05-31 | Formulated polyurethane resin compositions for flood coating electronic circuit assemblies |
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EP (1) | EP2997099B1 (ja) |
JP (3) | JP6574413B2 (ja) |
KR (1) | KR102355209B1 (ja) |
CN (2) | CN105358638B (ja) |
CA (2) | CA2913996C (ja) |
ES (1) | ES2839083T3 (ja) |
HU (1) | HUE053002T2 (ja) |
MX (2) | MX2015016482A (ja) |
PL (1) | PL2997099T3 (ja) |
PT (1) | PT2997099T (ja) |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9699917B2 (en) * | 2013-05-31 | 2017-07-04 | Cytec Industries Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
US9832902B2 (en) | 2013-05-31 | 2017-11-28 | Elantas Pdg, Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
CN106471087B (zh) | 2014-03-12 | 2020-07-07 | 艾伦塔斯Pdg有限公司 | 用于反渗透组件的聚氨酯粘合剂 |
US10590318B2 (en) | 2014-11-26 | 2020-03-17 | Elantas Pdg, Inc. | Multi-part polyurethane compositions, articles thereof, and method of making |
EP3280516B1 (en) | 2015-04-09 | 2019-12-18 | Elantas Pdg, Inc. | Polyurethane adhesives for reverse osmosis modules |
JP2017147388A (ja) * | 2016-02-19 | 2017-08-24 | 株式会社デンソー | 電子装置の製造方法 |
CN112996833B (zh) * | 2018-09-10 | 2022-11-01 | 亨茨曼国际有限公司 | 噁唑烷二酮封端的预聚物 |
WO2020053062A1 (en) * | 2018-09-10 | 2020-03-19 | Huntsman International Llc | Oxazolidinedione-terminated prepolymer |
JP7391101B2 (ja) | 2018-10-31 | 2023-12-04 | エイチ.ビー.フラー カンパニー | 液体塗布型制振材用の2成分ポリウレタン系 |
EP4291607A1 (en) * | 2021-02-10 | 2023-12-20 | Cabot Corporation | Method of producing thermoplastic elastomers and polymer composite obtained thereby |
GB2613561A (en) | 2021-12-03 | 2023-06-14 | H K Wentworth Ltd | Expandable protective coating |
Family Cites Families (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3747037A (en) * | 1968-01-11 | 1973-07-17 | Gen Electric | Petroleum based oil modified castor oil-urethane composition for electrical potting |
BE792621A (fr) | 1971-12-15 | 1973-03-30 | Western Electric Co | Procede et produit pour chasser l'eau infiltree dans des cablestelephoniques et analogues |
US3962094A (en) | 1973-09-18 | 1976-06-08 | The Dow Chemical Company | Hollow fiber separatory device |
US4008197A (en) | 1974-01-11 | 1977-02-15 | N L Industries, Inc. | Mineral oil extended polyurethane system containing a coupling agent for decontaminating and sealing the interior spaces of an insulated electrical device |
US4170559A (en) | 1976-11-05 | 1979-10-09 | N L Industries, Inc. | Hollow fiber separatory device |
US4224164A (en) | 1978-10-20 | 1980-09-23 | Nl Industries, Inc. | Non-wicking polyurethane casting systems |
JPS5489269A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Coating method of printed board |
US4168258A (en) | 1978-02-15 | 1979-09-18 | N L Industries, Inc. | Grease compatible, mineral oil extended polyurethane |
US4267044A (en) | 1978-04-10 | 1981-05-12 | Nl Industries, Inc. | Thixotropic polyurethane compositions as sealants for membrane separatory devices |
US4300184A (en) * | 1979-07-11 | 1981-11-10 | Johnson Controls, Inc. | Conformal coating for electrical circuit assemblies |
US4256617A (en) | 1979-11-01 | 1981-03-17 | Nl Industries, Inc. | Catalyzed non-toxic polyurethane forming compositions and separatory devices employing the same |
US4284506A (en) | 1979-12-26 | 1981-08-18 | Nl Industries, Inc. | Biomedical devices |
US4395530A (en) | 1980-10-24 | 1983-07-26 | Colamco, Inc. | Catalyst initiated prepolymer systems |
DE3046409A1 (de) * | 1980-12-10 | 1982-07-15 | Bayer Ag, 5090 Leverkusen | Beschichtungsmittel und ein verfahren zur herstellung von ueberzuegen |
US4375521A (en) | 1981-06-01 | 1983-03-01 | Communications Technology Corporation | Vegetable oil extended polyurethane systems |
US4454176A (en) | 1981-10-21 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Supported reverse osmosis membranes |
JPS5933605A (ja) * | 1982-08-17 | 1984-02-23 | Fuji Photo Film Co Ltd | 電子スチルカメラの音声記録方式 |
US4444976A (en) * | 1982-12-20 | 1984-04-24 | The Goodyear Tire & Rubber Company | Sag resistant two component adhesive and sealant |
JPS6027441U (ja) * | 1983-08-01 | 1985-02-25 | 日本電気株式会社 | 混成集積回路装置 |
US4518631A (en) | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
US4879032A (en) | 1984-06-04 | 1989-11-07 | Allied Resin Corporation | Fluid separatory devices having improved potting and adhesive compositions |
US4876303A (en) | 1984-06-15 | 1989-10-24 | American Telephone And Telegraph Company, At&T Bell Laboratories | Mineral-oil-free encapsulant composition |
US4603188A (en) | 1985-07-10 | 1986-07-29 | Itoh Seiyu Kabushiki Kaisha | Curable urethane composition |
US5266145A (en) | 1986-03-05 | 1993-11-30 | Teroson Gmbh | Sealant and adhesive |
US4826894A (en) * | 1987-05-19 | 1989-05-02 | Mobay Corporation | Aqueous polyurethane-ureas dispersions and their use for the production of coatings having improved humidity resistance |
US4923756A (en) | 1987-08-20 | 1990-05-08 | Ashland Oil, Inc. | Primerless adhesive for fiberglass reinforced polyester substrates |
US4886600A (en) | 1988-02-18 | 1989-12-12 | Caschem, Inc. | Moisture and glycerine resistant polyurethane compositions for separatory devices |
US4865735A (en) | 1988-02-18 | 1989-09-12 | Caschem, Inc. | Amine containing polyurethane compositions for separatory devices |
US4842736A (en) | 1988-09-06 | 1989-06-27 | Desalination Systems, Inc. | Spiral wound membrane |
JPH03217473A (ja) | 1990-01-23 | 1991-09-25 | Toyobo Co Ltd | 被覆剤組成物およびそれを用いた印刷配線板 |
CA2041532C (en) | 1991-04-30 | 2002-01-01 | Hamdy Khalil | Urethane sealant having improved sag properties |
DE4134693A1 (de) * | 1991-10-21 | 1993-04-22 | Basf Ag | Transparente, heissdampfsterilisierbare, nicht zytotoxische, im wesentlichen kompakte polyurethan-vergussmassen, verfahren zu ihrer herstellung und ihre verwendung, insbesondere fuer medizinisch-technische artikel |
US5360543A (en) | 1992-06-05 | 1994-11-01 | Caschem, Inc. | Polyurethane compositions |
JP3340762B2 (ja) | 1992-08-11 | 2002-11-05 | 横浜ゴム株式会社 | ケーブル接続部密封用混和物 |
US5556934A (en) | 1993-09-03 | 1996-09-17 | H. B. Fuller Licensing & Financing Inc. | Isocyanurate embedment compound |
US5863597A (en) | 1996-01-23 | 1999-01-26 | Sundstrand Corporation | Polyurethane conformal coating process for a printed wiring board |
JPH101607A (ja) * | 1996-06-14 | 1998-01-06 | M C Kogyo Kk | 多成分形揺変性ポリウレタン樹脂組成物 |
US5871822A (en) | 1996-09-26 | 1999-02-16 | Honeywell Inc. | Low emissions method for spray application of conformal coating to electronic assemblies |
US6130268A (en) | 1997-06-23 | 2000-10-10 | Polyfoam Products, Inc. | Two component polyurethane construction adhesive |
DE10108025A1 (de) | 2001-02-19 | 2002-09-05 | Henkel Kgaa | Zweikomponentiger Polyurethan-Klebstoff für Holzwerkstoffe |
WO2002086977A1 (en) * | 2001-04-23 | 2002-10-31 | Carmanah Technologies Inc. | Potted domed solar panel capsule and traffic warning lamps incorporating same |
KR100442843B1 (ko) * | 2002-03-13 | 2004-08-02 | 삼성에스디아이 주식회사 | 연료전지 단위체, 그 제조 방법 및 이를 채용한 연료전지 |
AU2003245611B2 (en) | 2002-06-21 | 2009-05-07 | Ge Osmonics, Inc. | Blister protection for spiral wound elements |
US20040012936A1 (en) * | 2002-07-18 | 2004-01-22 | Gravelin Pascal A. | Device and method for enclosure of electronic printed circuit board based products |
US20040072953A1 (en) | 2002-10-15 | 2004-04-15 | Ju-Ming Hung | Reactive hot melt adhesive with non-polymeric aliphatic difunctionals |
US6992134B2 (en) * | 2002-10-29 | 2006-01-31 | Tim Croley | Polyurethane system and application thereof |
US6797799B1 (en) * | 2003-04-02 | 2004-09-28 | Bayer Materialscience Llc | High 2,4′-diphenylmethane diisocyanate content prepolymers |
JP2005161191A (ja) * | 2003-12-02 | 2005-06-23 | Mitsui Kagaku Sanshi Kk | 防水性2液型ポリウレタン塗膜 |
JP4328645B2 (ja) * | 2004-02-26 | 2009-09-09 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
JP4548072B2 (ja) | 2004-09-30 | 2010-09-22 | 横浜ゴム株式会社 | 2液硬化型ポリウレタン樹脂組成物 |
DE102004062551A1 (de) * | 2004-12-24 | 2006-07-06 | Rhein Chemie Rheinau Gmbh | Mikrogel-enthaltende duroplastische Zusammensetzung |
EP2097465B1 (en) * | 2006-12-21 | 2010-11-03 | Dow Global Technologies Inc. | Composition useful as an adhesive for installing vehicle windows |
JP2007227981A (ja) * | 2007-06-11 | 2007-09-06 | Hitachi Chem Co Ltd | 樹脂ペースト及びこれを用いたフレキシブル配線板 |
BRPI0813611A2 (pt) | 2007-08-06 | 2019-09-24 | Dow Global Technologies Inc | "composição, polímero, processo para preparar um polímero e artigo" |
BRPI0815869A2 (pt) | 2007-09-21 | 2019-02-26 | Dow Global Technologies Inc | elastômero e processo para apreparação de polímeros não celulares baseados em isocianato |
TWI453253B (zh) * | 2007-10-18 | 2014-09-21 | Ajinomoto Kk | Resin composition |
US7781513B2 (en) | 2007-11-14 | 2010-08-24 | Momentive Performance Materials Inc. | Two-part moisture-curable resin composition and adhesive, sealant and coating compositions based thereon |
US8349123B2 (en) | 2008-04-01 | 2013-01-08 | Henkel Corporation | High heat resistant adhesive and sealant compositions |
DE102008021980A1 (de) * | 2008-05-02 | 2009-11-05 | Bayer Materialscience Ag | Neue Katalysatoren und deren Einsatz bei der Herstellung von Polyurethanen |
US20090294015A1 (en) * | 2008-06-02 | 2009-12-03 | Larry Gluck | Weather-resistant illuminated ornamental stepping stones and method of manufacture thereof |
DE112009001730T5 (de) * | 2008-07-18 | 2012-11-22 | World Properties, Inc. | Schaltungsmaterialien, Schaltungslaminate und Herstellungsverfahren hiervon |
CN101412860B (zh) * | 2008-12-04 | 2011-02-16 | 中国科学院长春应用化学研究所 | 一种抗氧阻效应的紫外光-热双固化涂料组合物及其制备方法 |
US8360390B2 (en) | 2009-01-13 | 2013-01-29 | Enphase Energy, Inc. | Method and apparatus for potting an electronic device |
WO2012010559A1 (en) | 2010-07-22 | 2012-01-26 | Construction Research & Technology Gmbh | Sealant&adhesive using green prepolymer |
US8822844B1 (en) * | 2010-09-27 | 2014-09-02 | Rockwell Collins, Inc. | Shielding and potting for electrical circuits |
US8697188B2 (en) | 2011-09-02 | 2014-04-15 | Construction Research & Technology Gmbh | Polyurethane systems having non-sag and paintability |
CN102757722B (zh) * | 2012-07-13 | 2014-12-10 | 江苏苏博特新材料股份有限公司 | 一种双组份聚氨酯涂料及其制备方法 |
CN102911636B (zh) | 2012-09-26 | 2013-12-18 | 贵阳时代沃顿科技有限公司 | 一种双组分聚氨酯胶粘剂及其制备方法和应用 |
CN102850989B (zh) | 2012-09-26 | 2014-04-09 | 贵阳时代沃顿科技有限公司 | 一种双组分聚氨酯胶粘剂及其制备方法 |
JP2014187287A (ja) * | 2013-03-25 | 2014-10-02 | Mitsubishi Heavy Ind Ltd | 回路基板の製造方法 |
US9699917B2 (en) * | 2013-05-31 | 2017-07-04 | Cytec Industries Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
US9832902B2 (en) * | 2013-05-31 | 2017-11-28 | Elantas Pdg, Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
CN106471087B (zh) | 2014-03-12 | 2020-07-07 | 艾伦塔斯Pdg有限公司 | 用于反渗透组件的聚氨酯粘合剂 |
US10590318B2 (en) | 2014-11-26 | 2020-03-17 | Elantas Pdg, Inc. | Multi-part polyurethane compositions, articles thereof, and method of making |
EP3280516B1 (en) | 2015-04-09 | 2019-12-18 | Elantas Pdg, Inc. | Polyurethane adhesives for reverse osmosis modules |
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2014
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ES2839083T3 (es) | 2021-07-05 |
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JP2016529333A (ja) | 2016-09-23 |
JP2017524794A (ja) | 2017-08-31 |
JP6574413B2 (ja) | 2019-09-11 |
WO2014194303A1 (en) | 2014-12-04 |
JP6600681B2 (ja) | 2019-11-06 |
KR20160014677A (ko) | 2016-02-11 |
US9699917B2 (en) | 2017-07-04 |
US20140355225A1 (en) | 2014-12-04 |
CN105358638B (zh) | 2018-08-07 |
CA2913996A1 (en) | 2014-12-04 |
MX2015016483A (es) | 2016-07-07 |
KR102355209B1 (ko) | 2022-01-25 |
HUE053002T2 (hu) | 2021-06-28 |
CN105358638A (zh) | 2016-02-24 |
EP2997099B1 (en) | 2020-10-14 |
CN105683316A (zh) | 2016-06-15 |
CN105683316B (zh) | 2019-12-31 |
PT2997099T (pt) | 2021-01-11 |
JP2020077847A (ja) | 2020-05-21 |
CA2913996C (en) | 2021-08-31 |
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