JP6405920B2 - ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 - Google Patents

ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 Download PDF

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Publication number
JP6405920B2
JP6405920B2 JP2014229886A JP2014229886A JP6405920B2 JP 6405920 B2 JP6405920 B2 JP 6405920B2 JP 2014229886 A JP2014229886 A JP 2014229886A JP 2014229886 A JP2014229886 A JP 2014229886A JP 6405920 B2 JP6405920 B2 JP 6405920B2
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Japan
Prior art keywords
solder paste
addition amount
flux
solder
compound
Prior art date
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Active
Application number
JP2014229886A
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English (en)
Japanese (ja)
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JP2016093816A (ja
JP2016093816A5 (enExample
Inventor
和順 高木
和順 高木
達 林田
達 林田
裕 橋本
裕 橋本
哲 竹政
哲 竹政
奈菜子 宮城
奈菜子 宮城
耕 稲葉
耕 稲葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014229886A priority Critical patent/JP6405920B2/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to PH1/2017/500879A priority patent/PH12017500879B1/en
Priority to MYPI2017000704A priority patent/MY183244A/en
Priority to US15/526,051 priority patent/US20170304961A1/en
Priority to CN201580061775.2A priority patent/CN107000133A/zh
Priority to EP15859026.5A priority patent/EP3219433A4/en
Priority to PCT/JP2015/081308 priority patent/WO2016076220A1/ja
Publication of JP2016093816A publication Critical patent/JP2016093816A/ja
Publication of JP2016093816A5 publication Critical patent/JP2016093816A5/ja
Application granted granted Critical
Publication of JP6405920B2 publication Critical patent/JP6405920B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/08—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of welds or the like

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2014229886A 2014-11-12 2014-11-12 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 Active JP6405920B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014229886A JP6405920B2 (ja) 2014-11-12 2014-11-12 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
MYPI2017000704A MY183244A (en) 2014-11-12 2015-11-06 Solder paste and solder joint
US15/526,051 US20170304961A1 (en) 2014-11-12 2015-11-06 Solder Paste and Solder Joint
CN201580061775.2A CN107000133A (zh) 2014-11-12 2015-11-06 焊膏用助焊剂、焊膏及钎焊接合体
PH1/2017/500879A PH12017500879B1 (en) 2014-11-12 2015-11-06 Solder paste and solder joint
EP15859026.5A EP3219433A4 (en) 2014-11-12 2015-11-06 Flux for solder paste, solder paste, and joined body
PCT/JP2015/081308 WO2016076220A1 (ja) 2014-11-12 2015-11-06 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014229886A JP6405920B2 (ja) 2014-11-12 2014-11-12 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体

Publications (3)

Publication Number Publication Date
JP2016093816A JP2016093816A (ja) 2016-05-26
JP2016093816A5 JP2016093816A5 (enExample) 2017-11-30
JP6405920B2 true JP6405920B2 (ja) 2018-10-17

Family

ID=55954307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014229886A Active JP6405920B2 (ja) 2014-11-12 2014-11-12 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体

Country Status (7)

Country Link
US (1) US20170304961A1 (enExample)
EP (1) EP3219433A4 (enExample)
JP (1) JP6405920B2 (enExample)
CN (1) CN107000133A (enExample)
MY (1) MY183244A (enExample)
PH (1) PH12017500879B1 (enExample)
WO (1) WO2016076220A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10319527B2 (en) 2017-04-04 2019-06-11 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor
JP6528102B2 (ja) 2017-07-03 2019-06-12 株式会社弘輝 フラックス及びはんだ材料
JP6390989B1 (ja) * 2017-11-24 2018-09-19 千住金属工業株式会社 フラックス及びソルダペースト
JP6617793B2 (ja) 2018-06-01 2019-12-11 千住金属工業株式会社 ソルダペースト用フラックス及びソルダペースト
JP6536730B1 (ja) * 2018-08-10 2019-07-03 千住金属工業株式会社 フラックス及びはんだペースト
JP6643744B1 (ja) * 2019-05-27 2020-02-12 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス
JP7517669B2 (ja) * 2019-06-27 2024-07-17 株式会社弘輝 フラックス及びソルダペースト
CN111001965B (zh) * 2019-10-28 2022-03-11 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏
JP6795777B1 (ja) * 2020-03-27 2020-12-02 千住金属工業株式会社 洗浄用フラックス及び洗浄用ソルダペースト
JP7161510B2 (ja) * 2020-09-15 2022-10-26 株式会社タムラ製作所 はんだ組成物および電子基板
CN112951730B (zh) * 2021-01-26 2024-03-29 北京遥感设备研究所 一种基板三维堆叠工艺方法
KR102690728B1 (ko) * 2021-03-12 2024-08-05 센주긴조쿠고교 가부시키가이샤 플럭스 및 전자 디바이스의 제조 방법
JP7328310B2 (ja) * 2021-03-12 2023-08-16 千住金属工業株式会社 フラックスおよび電子デバイスの製造方法
KR102745469B1 (ko) * 2021-03-12 2024-12-20 센주긴조쿠고교 가부시키가이샤 플럭스 및 전자 디바이스의 제조 방법
CN116981541B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法
CN117042914B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法
JP7054035B1 (ja) * 2021-06-09 2022-04-13 千住金属工業株式会社 フラックス及びソルダペースト

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05392A (ja) * 1991-06-18 1993-01-08 Metsuku Kk はんだ付け用フラツクス及びクリームはんだ
JP3398025B2 (ja) * 1997-10-01 2003-04-21 三洋電機株式会社 液晶表示装置
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP2002086292A (ja) * 2000-02-08 2002-03-26 Showa Denko Kk ハンダペースト
JP2003225795A (ja) * 2002-01-30 2003-08-12 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
WO2005084877A1 (ja) * 2004-03-09 2005-09-15 Senju Metal Industry Co. Ltd. ソルダペースト
JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
JP6027426B2 (ja) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 ソルダペースト及びはんだ付け実装方法
JP5731555B2 (ja) * 2013-01-29 2015-06-10 株式会社タムラ製作所 フラックスおよびソルダペースト

Also Published As

Publication number Publication date
EP3219433A4 (en) 2018-06-13
US20170304961A1 (en) 2017-10-26
JP2016093816A (ja) 2016-05-26
EP3219433A1 (en) 2017-09-20
WO2016076220A1 (ja) 2016-05-19
MY183244A (en) 2021-02-18
CN107000133A (zh) 2017-08-01
PH12017500879B1 (en) 2023-07-05
PH12017500879A1 (en) 2017-11-06

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