JP2016093816A5 - - Google Patents
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- Publication number
- JP2016093816A5 JP2016093816A5 JP2014229886A JP2014229886A JP2016093816A5 JP 2016093816 A5 JP2016093816 A5 JP 2016093816A5 JP 2014229886 A JP2014229886 A JP 2014229886A JP 2014229886 A JP2014229886 A JP 2014229886A JP 2016093816 A5 JP2016093816 A5 JP 2016093816A5
- Authority
- JP
- Japan
- Prior art keywords
- addition amount
- halogen compound
- solder paste
- compound
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001412 amines Chemical class 0.000 claims description 19
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 17
- 150000002896 organic halogen compounds Chemical class 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 12
- -1 imidazole compound Chemical class 0.000 claims description 10
- 230000004907 flux Effects 0.000 claims description 8
- 150000002366 halogen compounds Chemical class 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 claims 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims 2
- MELXIJRBKWTTJH-ONEGZZNKSA-N (e)-2,3-dibromobut-2-ene-1,4-diol Chemical compound OC\C(Br)=C(/Br)CO MELXIJRBKWTTJH-ONEGZZNKSA-N 0.000 claims 1
- KIHQZLPHVZKELA-UHFFFAOYSA-N 1,3-dibromopropan-2-ol Chemical compound BrCC(O)CBr KIHQZLPHVZKELA-UHFFFAOYSA-N 0.000 claims 1
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 claims 1
- PSSRAPMBSMSACN-UHFFFAOYSA-N 1,4-dibromobutan-2-ol Chemical compound BrCC(O)CCBr PSSRAPMBSMSACN-UHFFFAOYSA-N 0.000 claims 1
- WEGOLYBUWCMMMY-UHFFFAOYSA-N 1-bromo-2-propanol Chemical compound CC(O)CBr WEGOLYBUWCMMMY-UHFFFAOYSA-N 0.000 claims 1
- DMRXISNUOWIOKV-UHFFFAOYSA-N 1-bromobutan-2-ol Chemical compound CCC(O)CBr DMRXISNUOWIOKV-UHFFFAOYSA-N 0.000 claims 1
- OXYNQEOLHRWEPE-UHFFFAOYSA-N 2,3-dibromobutane-1,4-diol Chemical compound OCC(Br)C(Br)CO OXYNQEOLHRWEPE-UHFFFAOYSA-N 0.000 claims 1
- QWVCIORZLNBIIC-UHFFFAOYSA-N 2,3-dibromopropan-1-ol Chemical compound OCC(Br)CBr QWVCIORZLNBIIC-UHFFFAOYSA-N 0.000 claims 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 claims 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims 1
- RQFUZUMFPRMVDX-UHFFFAOYSA-N 3-Bromo-1-propanol Chemical compound OCCCBr RQFUZUMFPRMVDX-UHFFFAOYSA-N 0.000 claims 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 claims 1
- SIBFQOUHOCRXDL-UHFFFAOYSA-N 3-bromopropane-1,2-diol Chemical compound OCC(O)CBr SIBFQOUHOCRXDL-UHFFFAOYSA-N 0.000 claims 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims 1
- 229940071870 hydroiodic acid Drugs 0.000 claims 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014229886A JP6405920B2 (ja) | 2014-11-12 | 2014-11-12 | ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 |
| MYPI2017000704A MY183244A (en) | 2014-11-12 | 2015-11-06 | Solder paste and solder joint |
| US15/526,051 US20170304961A1 (en) | 2014-11-12 | 2015-11-06 | Solder Paste and Solder Joint |
| CN201580061775.2A CN107000133A (zh) | 2014-11-12 | 2015-11-06 | 焊膏用助焊剂、焊膏及钎焊接合体 |
| PH1/2017/500879A PH12017500879B1 (en) | 2014-11-12 | 2015-11-06 | Solder paste and solder joint |
| EP15859026.5A EP3219433A4 (en) | 2014-11-12 | 2015-11-06 | Flux for solder paste, solder paste, and joined body |
| PCT/JP2015/081308 WO2016076220A1 (ja) | 2014-11-12 | 2015-11-06 | ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014229886A JP6405920B2 (ja) | 2014-11-12 | 2014-11-12 | ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016093816A JP2016093816A (ja) | 2016-05-26 |
| JP2016093816A5 true JP2016093816A5 (enExample) | 2017-11-30 |
| JP6405920B2 JP6405920B2 (ja) | 2018-10-17 |
Family
ID=55954307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014229886A Active JP6405920B2 (ja) | 2014-11-12 | 2014-11-12 | ソルダペースト用フラックス、ソルダペースト及びはんだ接合体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170304961A1 (enExample) |
| EP (1) | EP3219433A4 (enExample) |
| JP (1) | JP6405920B2 (enExample) |
| CN (1) | CN107000133A (enExample) |
| MY (1) | MY183244A (enExample) |
| PH (1) | PH12017500879B1 (enExample) |
| WO (1) | WO2016076220A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10319527B2 (en) | 2017-04-04 | 2019-06-11 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor |
| JP6528102B2 (ja) | 2017-07-03 | 2019-06-12 | 株式会社弘輝 | フラックス及びはんだ材料 |
| JP6390989B1 (ja) * | 2017-11-24 | 2018-09-19 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6617793B2 (ja) | 2018-06-01 | 2019-12-11 | 千住金属工業株式会社 | ソルダペースト用フラックス及びソルダペースト |
| JP6536730B1 (ja) * | 2018-08-10 | 2019-07-03 | 千住金属工業株式会社 | フラックス及びはんだペースト |
| JP6643744B1 (ja) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | はんだペースト及びはんだペースト用フラックス |
| JP7517669B2 (ja) * | 2019-06-27 | 2024-07-17 | 株式会社弘輝 | フラックス及びソルダペースト |
| CN111001965B (zh) * | 2019-10-28 | 2022-03-11 | 东莞市吉田焊接材料有限公司 | 一种有铅锡膏助焊剂及其制备方法与锡膏 |
| JP6795777B1 (ja) * | 2020-03-27 | 2020-12-02 | 千住金属工業株式会社 | 洗浄用フラックス及び洗浄用ソルダペースト |
| JP7161510B2 (ja) * | 2020-09-15 | 2022-10-26 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
| CN112951730B (zh) * | 2021-01-26 | 2024-03-29 | 北京遥感设备研究所 | 一种基板三维堆叠工艺方法 |
| KR102690728B1 (ko) * | 2021-03-12 | 2024-08-05 | 센주긴조쿠고교 가부시키가이샤 | 플럭스 및 전자 디바이스의 제조 방법 |
| JP7328310B2 (ja) * | 2021-03-12 | 2023-08-16 | 千住金属工業株式会社 | フラックスおよび電子デバイスの製造方法 |
| KR102745469B1 (ko) * | 2021-03-12 | 2024-12-20 | 센주긴조쿠고교 가부시키가이샤 | 플럭스 및 전자 디바이스의 제조 방법 |
| CN116981541B (zh) * | 2021-03-12 | 2024-11-19 | 千住金属工业株式会社 | 助焊剂和电子设备的制造方法 |
| CN117042914B (zh) * | 2021-03-12 | 2024-11-19 | 千住金属工业株式会社 | 助焊剂和电子设备的制造方法 |
| JP7054035B1 (ja) * | 2021-06-09 | 2022-04-13 | 千住金属工業株式会社 | フラックス及びソルダペースト |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05392A (ja) * | 1991-06-18 | 1993-01-08 | Metsuku Kk | はんだ付け用フラツクス及びクリームはんだ |
| JP3398025B2 (ja) * | 1997-10-01 | 2003-04-21 | 三洋電機株式会社 | 液晶表示装置 |
| US20010042779A1 (en) * | 2000-02-08 | 2001-11-22 | Hitoshi Amita | Solder paste |
| JP2002086292A (ja) * | 2000-02-08 | 2002-03-26 | Showa Denko Kk | ハンダペースト |
| JP2003225795A (ja) * | 2002-01-30 | 2003-08-12 | Showa Denko Kk | ハンダ付け用フラックスおよびハンダペースト |
| JP3797990B2 (ja) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | 熱硬化性フラックス及びはんだペースト |
| WO2005084877A1 (ja) * | 2004-03-09 | 2005-09-15 | Senju Metal Industry Co. Ltd. | ソルダペースト |
| JP5766668B2 (ja) * | 2012-08-16 | 2015-08-19 | 株式会社タムラ製作所 | はんだ組成物およびそれを用いたプリント配線基板 |
| JP6027426B2 (ja) * | 2012-12-18 | 2016-11-16 | ニホンハンダ株式会社 | ソルダペースト及びはんだ付け実装方法 |
| JP5731555B2 (ja) * | 2013-01-29 | 2015-06-10 | 株式会社タムラ製作所 | フラックスおよびソルダペースト |
-
2014
- 2014-11-12 JP JP2014229886A patent/JP6405920B2/ja active Active
-
2015
- 2015-11-06 US US15/526,051 patent/US20170304961A1/en not_active Abandoned
- 2015-11-06 WO PCT/JP2015/081308 patent/WO2016076220A1/ja not_active Ceased
- 2015-11-06 MY MYPI2017000704A patent/MY183244A/en unknown
- 2015-11-06 CN CN201580061775.2A patent/CN107000133A/zh active Pending
- 2015-11-06 EP EP15859026.5A patent/EP3219433A4/en not_active Withdrawn
- 2015-11-06 PH PH1/2017/500879A patent/PH12017500879B1/en unknown
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