CN107000133A - 焊膏用助焊剂、焊膏及钎焊接合体 - Google Patents

焊膏用助焊剂、焊膏及钎焊接合体 Download PDF

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Publication number
CN107000133A
CN107000133A CN201580061775.2A CN201580061775A CN107000133A CN 107000133 A CN107000133 A CN 107000133A CN 201580061775 A CN201580061775 A CN 201580061775A CN 107000133 A CN107000133 A CN 107000133A
Authority
CN
China
Prior art keywords
weight
addition
amine
bromo
soldering paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580061775.2A
Other languages
English (en)
Chinese (zh)
Inventor
高木和顺
林田达
桥本裕
竹政哲
宫城奈菜子
稻叶耕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN107000133A publication Critical patent/CN107000133A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/08—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of welds or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201580061775.2A 2014-11-12 2015-11-06 焊膏用助焊剂、焊膏及钎焊接合体 Pending CN107000133A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-229886 2014-11-12
JP2014229886A JP6405920B2 (ja) 2014-11-12 2014-11-12 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
PCT/JP2015/081308 WO2016076220A1 (ja) 2014-11-12 2015-11-06 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体

Publications (1)

Publication Number Publication Date
CN107000133A true CN107000133A (zh) 2017-08-01

Family

ID=55954307

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580061775.2A Pending CN107000133A (zh) 2014-11-12 2015-11-06 焊膏用助焊剂、焊膏及钎焊接合体

Country Status (7)

Country Link
US (1) US20170304961A1 (enExample)
EP (1) EP3219433A4 (enExample)
JP (1) JP6405920B2 (enExample)
CN (1) CN107000133A (enExample)
MY (1) MY183244A (enExample)
PH (1) PH12017500879B1 (enExample)
WO (1) WO2016076220A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110814576A (zh) * 2018-08-10 2020-02-21 千住金属工业株式会社 助焊剂和焊膏
CN111001965A (zh) * 2019-10-28 2020-04-14 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏
CN116981541A (zh) * 2021-03-12 2023-10-31 千住金属工业株式会社 助焊剂和电子设备的制造方法
CN117042914A (zh) * 2021-03-12 2023-11-10 千住金属工业株式会社 助焊剂和电子设备的制造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10319527B2 (en) 2017-04-04 2019-06-11 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor
JP6528102B2 (ja) 2017-07-03 2019-06-12 株式会社弘輝 フラックス及びはんだ材料
JP6390989B1 (ja) * 2017-11-24 2018-09-19 千住金属工業株式会社 フラックス及びソルダペースト
JP6617793B2 (ja) 2018-06-01 2019-12-11 千住金属工業株式会社 ソルダペースト用フラックス及びソルダペースト
JP6643744B1 (ja) * 2019-05-27 2020-02-12 千住金属工業株式会社 はんだペースト及びはんだペースト用フラックス
JP7517669B2 (ja) * 2019-06-27 2024-07-17 株式会社弘輝 フラックス及びソルダペースト
JP6795777B1 (ja) * 2020-03-27 2020-12-02 千住金属工業株式会社 洗浄用フラックス及び洗浄用ソルダペースト
JP7161510B2 (ja) * 2020-09-15 2022-10-26 株式会社タムラ製作所 はんだ組成物および電子基板
CN112951730B (zh) * 2021-01-26 2024-03-29 北京遥感设备研究所 一种基板三维堆叠工艺方法
KR102745469B1 (ko) * 2021-03-12 2024-12-20 센주긴조쿠고교 가부시키가이샤 플럭스 및 전자 디바이스의 제조 방법
JP7328311B2 (ja) * 2021-03-12 2023-08-16 千住金属工業株式会社 フラックスおよび電子デバイスの製造方法
WO2022191227A1 (ja) * 2021-03-12 2022-09-15 千住金属工業株式会社 フラックスおよび電子デバイスの製造方法
JP7054035B1 (ja) * 2021-06-09 2022-04-13 千住金属工業株式会社 フラックス及びソルダペースト

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP2003225795A (ja) * 2002-01-30 2003-08-12 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
JP2005059028A (ja) * 2003-08-08 2005-03-10 Toshiba Corp 熱硬化性フラックス及びはんだペースト
CN1925946A (zh) * 2004-03-09 2007-03-07 千住金属工业株式会社 焊膏
JP2014036985A (ja) * 2012-08-16 2014-02-27 Tamura Seisakusho Co Ltd はんだ組成物およびそれを用いたプリント配線基板
JP2014117737A (ja) * 2012-12-18 2014-06-30 Nippon Handa Kk ソルダペースト及びはんだ付け実装方法
JP2014144473A (ja) * 2013-01-29 2014-08-14 Tamura Seisakusho Co Ltd フラックスおよびソルダペースト

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05392A (ja) * 1991-06-18 1993-01-08 Metsuku Kk はんだ付け用フラツクス及びクリームはんだ
JP3398025B2 (ja) * 1997-10-01 2003-04-21 三洋電機株式会社 液晶表示装置
JP2002086292A (ja) * 2000-02-08 2002-03-26 Showa Denko Kk ハンダペースト

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste
JP2003225795A (ja) * 2002-01-30 2003-08-12 Showa Denko Kk ハンダ付け用フラックスおよびハンダペースト
JP2005059028A (ja) * 2003-08-08 2005-03-10 Toshiba Corp 熱硬化性フラックス及びはんだペースト
CN1925946A (zh) * 2004-03-09 2007-03-07 千住金属工业株式会社 焊膏
JP2014036985A (ja) * 2012-08-16 2014-02-27 Tamura Seisakusho Co Ltd はんだ組成物およびそれを用いたプリント配線基板
JP2014117737A (ja) * 2012-12-18 2014-06-30 Nippon Handa Kk ソルダペースト及びはんだ付け実装方法
JP2014144473A (ja) * 2013-01-29 2014-08-14 Tamura Seisakusho Co Ltd フラックスおよびソルダペースト

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110814576A (zh) * 2018-08-10 2020-02-21 千住金属工业株式会社 助焊剂和焊膏
CN111001965A (zh) * 2019-10-28 2020-04-14 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏
CN111001965B (zh) * 2019-10-28 2022-03-11 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏
CN116981541A (zh) * 2021-03-12 2023-10-31 千住金属工业株式会社 助焊剂和电子设备的制造方法
CN117042914A (zh) * 2021-03-12 2023-11-10 千住金属工业株式会社 助焊剂和电子设备的制造方法
CN117042914B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法
CN116981541B (zh) * 2021-03-12 2024-11-19 千住金属工业株式会社 助焊剂和电子设备的制造方法

Also Published As

Publication number Publication date
JP2016093816A (ja) 2016-05-26
MY183244A (en) 2021-02-18
JP6405920B2 (ja) 2018-10-17
PH12017500879A1 (en) 2017-11-06
EP3219433A4 (en) 2018-06-13
PH12017500879B1 (en) 2023-07-05
US20170304961A1 (en) 2017-10-26
EP3219433A1 (en) 2017-09-20
WO2016076220A1 (ja) 2016-05-19

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170801

RJ01 Rejection of invention patent application after publication