JP6401435B2 - 発光パッケージ - Google Patents

発光パッケージ Download PDF

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Publication number
JP6401435B2
JP6401435B2 JP2013098976A JP2013098976A JP6401435B2 JP 6401435 B2 JP6401435 B2 JP 6401435B2 JP 2013098976 A JP2013098976 A JP 2013098976A JP 2013098976 A JP2013098976 A JP 2013098976A JP 6401435 B2 JP6401435 B2 JP 6401435B2
Authority
JP
Japan
Prior art keywords
light emitting
hole
ceramic substrate
disposed
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013098976A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014036226A5 (enExample
JP2014036226A (ja
Inventor
キム・ビョンモク
洋 小平
洋 小平
ジョン・スジョン
カン・ボヒ
ノ・ヨンジン
祐一郎 反田
祐一郎 反田
聡司 大関
聡司 大関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2014036226A publication Critical patent/JP2014036226A/ja
Publication of JP2014036226A5 publication Critical patent/JP2014036226A5/ja
Application granted granted Critical
Publication of JP6401435B2 publication Critical patent/JP6401435B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
JP2013098976A 2012-08-09 2013-05-09 発光パッケージ Expired - Fee Related JP6401435B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120087167A KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈
KR10-2012-0087167 2012-08-09

Publications (3)

Publication Number Publication Date
JP2014036226A JP2014036226A (ja) 2014-02-24
JP2014036226A5 JP2014036226A5 (enExample) 2016-06-23
JP6401435B2 true JP6401435B2 (ja) 2018-10-10

Family

ID=48874869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013098976A Expired - Fee Related JP6401435B2 (ja) 2012-08-09 2013-05-09 発光パッケージ

Country Status (5)

Country Link
US (2) US9893259B2 (enExample)
EP (2) EP2696379B1 (enExample)
JP (1) JP6401435B2 (enExample)
KR (1) KR101973395B1 (enExample)
CN (2) CN107023760A (enExample)

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KR101973395B1 (ko) * 2012-08-09 2019-04-29 엘지이노텍 주식회사 발광 모듈
EP2919284B1 (en) * 2014-03-14 2019-07-03 Citizen Electronics Co., Ltd. Light emitting apparatus
KR102252156B1 (ko) * 2014-07-08 2021-05-17 엘지이노텍 주식회사 발광 소자 패키지
US9481572B2 (en) 2014-07-17 2016-11-01 Texas Instruments Incorporated Optical electronic device and method of fabrication
US20180301605A1 (en) * 2015-03-19 2018-10-18 Osram Opto Semiconductors Gmbh A window that covers an optoelectronic semiconductor chip, a panel comprising a plurality of windows, a method of producing windows and an optoelectronic semiconductor device
WO2016181516A1 (ja) * 2015-05-13 2016-11-17 三菱電機株式会社 半導体モジュール
US10317018B2 (en) * 2015-09-01 2019-06-11 Lg Innotek Co., Ltd. Lighting device
JP2017073489A (ja) * 2015-10-08 2017-04-13 エヌイーシー ショット コンポーネンツ株式会社 メタル−ガラスリッドおよびそれを利用したｄｕｖ−ｌｅｄ装置
JP6889533B2 (ja) * 2015-10-21 2021-06-18 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
JP6712855B2 (ja) * 2015-12-02 2020-06-24 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
EP3416202B1 (en) * 2016-02-12 2021-04-07 LG Innotek Co., Ltd. Light emitting device package and lighting apparatus comprising same
US10864377B2 (en) 2016-12-01 2020-12-15 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
US10207116B2 (en) 2016-12-01 2019-02-19 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JP6687008B2 (ja) * 2017-11-30 2020-04-22 日亜化学工業株式会社 発光装置
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
JP7109930B2 (ja) * 2018-02-05 2022-08-01 日機装株式会社 流体殺菌装置
US10438975B1 (en) * 2018-03-13 2019-10-08 Innolux Corporation Display device and method for preparing the same
WO2020040143A1 (ja) * 2018-08-22 2020-02-27 エーディーワイ株式会社 紫外線素子パッケージ
JP7405031B2 (ja) * 2020-07-16 2023-12-26 日本電気硝子株式会社 電子装置及び電子装置の製造方法
CN113707616A (zh) * 2021-07-19 2021-11-26 中国电子科技集团公司第十三研究所 盖板及陶瓷封装结构
WO2023042792A1 (ja) * 2021-09-16 2023-03-23 旭化成株式会社 紫外線照射装置
JP2025041057A (ja) * 2023-09-13 2025-03-26 ウシオ電機株式会社 光源モジュール、光源モジュールの製造方法

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JPS59107145U (ja) * 1983-01-07 1984-07-19 日本電気株式会社 改良された蓋を有する半導体装置
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Also Published As

Publication number Publication date
CN107023760A (zh) 2017-08-08
CN103574354B (zh) 2018-06-01
EP2696379B1 (en) 2022-05-18
CN103574354A (zh) 2014-02-12
US20180130934A1 (en) 2018-05-10
EP2696379A2 (en) 2014-02-12
EP4040518A1 (en) 2022-08-10
JP2014036226A (ja) 2014-02-24
KR20140020529A (ko) 2014-02-19
KR101973395B1 (ko) 2019-04-29
US20140042482A1 (en) 2014-02-13
EP2696379A3 (en) 2016-01-20
US10388841B2 (en) 2019-08-20
US9893259B2 (en) 2018-02-13

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