CN107023760A - 发光器件 - Google Patents

发光器件 Download PDF

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Publication number
CN107023760A
CN107023760A CN201710194634.9A CN201710194634A CN107023760A CN 107023760 A CN107023760 A CN 107023760A CN 201710194634 A CN201710194634 A CN 201710194634A CN 107023760 A CN107023760 A CN 107023760A
Authority
CN
China
Prior art keywords
hole
disposed
ceramic substrate
light emitting
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710194634.9A
Other languages
English (en)
Chinese (zh)
Inventor
金炳穆
小平洋
郑粹正
姜宝姬
鲁永珍
反田祐郎
反田祐一郎
大关聪司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN107023760A publication Critical patent/CN107023760A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN201710194634.9A 2012-08-09 2013-08-09 发光器件 Pending CN107023760A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020120087167A KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈
KR10-2012-0087167 2012-08-09
CN201310346581.XA CN103574354B (zh) 2012-08-09 2013-08-09 发光器件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201310346581.XA Division CN103574354B (zh) 2012-08-09 2013-08-09 发光器件

Publications (1)

Publication Number Publication Date
CN107023760A true CN107023760A (zh) 2017-08-08

Family

ID=48874869

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310346581.XA Active CN103574354B (zh) 2012-08-09 2013-08-09 发光器件
CN201710194634.9A Pending CN107023760A (zh) 2012-08-09 2013-08-09 发光器件

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201310346581.XA Active CN103574354B (zh) 2012-08-09 2013-08-09 发光器件

Country Status (5)

Country Link
US (2) US9893259B2 (enExample)
EP (2) EP2696379B1 (enExample)
JP (1) JP6401435B2 (enExample)
KR (1) KR101973395B1 (enExample)
CN (2) CN103574354B (enExample)

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US9481572B2 (en) 2014-07-17 2016-11-01 Texas Instruments Incorporated Optical electronic device and method of fabrication
DE112015006331T5 (de) * 2015-03-19 2017-12-14 Osram Opto Semiconductors Gmbh Fenster zum Bedecken eines optoelektronischen Halbleiterchips, mehrere Fenster umfassende Scheibe, Verfahren zur Herstellung von Fenstern und optoelektronisches Halbleiterbauelement
US10217683B2 (en) * 2015-05-13 2019-02-26 Mitsubishi Electric Corporation Mounted semiconductor module with a mold resin portion
WO2017039198A1 (ko) * 2015-09-01 2017-03-09 엘지이노텍(주) 조명 장치
JP2017073489A (ja) * 2015-10-08 2017-04-13 エヌイーシー ショット コンポーネンツ株式会社 メタル−ガラスリッドおよびそれを利用したｄｕｖ−ｌｅｄ装置
JP6889533B2 (ja) * 2015-10-21 2021-06-18 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
JP6712855B2 (ja) * 2015-12-02 2020-06-24 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
CN108633317B (zh) * 2016-02-12 2021-07-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备
US10207116B2 (en) 2016-12-01 2019-02-19 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
US10864377B2 (en) 2016-12-01 2020-12-15 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JP6687008B2 (ja) * 2017-11-30 2020-04-22 日亜化学工業株式会社 発光装置
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
JP7109930B2 (ja) * 2018-02-05 2022-08-01 日機装株式会社 流体殺菌装置
US10438975B1 (en) * 2018-03-13 2019-10-08 Innolux Corporation Display device and method for preparing the same
JP7356983B2 (ja) * 2018-08-22 2023-10-05 エーディーワイ株式会社 紫外線素子パッケージ
JP7405031B2 (ja) * 2020-07-16 2023-12-26 日本電気硝子株式会社 電子装置及び電子装置の製造方法
CN113707616A (zh) * 2021-07-19 2021-11-26 中国电子科技集团公司第十三研究所 盖板及陶瓷封装结构
WO2023042792A1 (ja) * 2021-09-16 2023-03-23 旭化成株式会社 紫外線照射装置
JP2025041057A (ja) * 2023-09-13 2025-03-26 ウシオ電機株式会社 光源モジュール、光源モジュールの製造方法

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JPS59107145U (ja) * 1983-01-07 1984-07-19 日本電気株式会社 改良された蓋を有する半導体装置
JP2001237335A (ja) * 2000-02-24 2001-08-31 Kyocera Corp 半導体素子収納用パッケージおよびその製造方法
US7059040B1 (en) * 2001-01-16 2006-06-13 Amkor Technology, Inc. Optical module with lens integral holder fabrication method
JP2005235864A (ja) * 2004-02-17 2005-09-02 Hamamatsu Photonics Kk 光半導体装置
US20080043444A1 (en) * 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
WO2006080729A1 (en) * 2004-10-07 2006-08-03 Seoul Semiconductor Co., Ltd. Side illumination lens and luminescent device using the same
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US20070176188A1 (en) * 2005-12-01 2007-08-02 Shinichi Tanaka Semiconductor light emitting device and its manufacture method
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JP2009071265A (ja) * 2007-08-18 2009-04-02 Nichia Corp 半導体発光装置
US20120037939A1 (en) * 2009-04-13 2012-02-16 Youji Urano Light emitting diode
US20110024785A1 (en) * 2009-07-28 2011-02-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light Emitting Diode Device
CN102473813A (zh) * 2009-07-30 2012-05-23 日亚化学工业株式会社 发光装置及其制造方法
CN102201524A (zh) * 2010-03-24 2011-09-28 旭硝子株式会社 发光元件用基板及发光装置
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Also Published As

Publication number Publication date
US10388841B2 (en) 2019-08-20
KR101973395B1 (ko) 2019-04-29
CN103574354B (zh) 2018-06-01
JP2014036226A (ja) 2014-02-24
US20140042482A1 (en) 2014-02-13
EP2696379B1 (en) 2022-05-18
KR20140020529A (ko) 2014-02-19
CN103574354A (zh) 2014-02-12
JP6401435B2 (ja) 2018-10-10
US20180130934A1 (en) 2018-05-10
EP2696379A3 (en) 2016-01-20
EP4040518A1 (en) 2022-08-10
US9893259B2 (en) 2018-02-13
EP2696379A2 (en) 2014-02-12

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Application publication date: 20170808