KR101973395B1 - 발광 모듈 - Google Patents

발광 모듈 Download PDF

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Publication number
KR101973395B1
KR101973395B1 KR1020120087167A KR20120087167A KR101973395B1 KR 101973395 B1 KR101973395 B1 KR 101973395B1 KR 1020120087167 A KR1020120087167 A KR 1020120087167A KR 20120087167 A KR20120087167 A KR 20120087167A KR 101973395 B1 KR101973395 B1 KR 101973395B1
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KR
South Korea
Prior art keywords
light emitting
ceramic substrate
heat dissipation
hole
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020120087167A
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English (en)
Korean (ko)
Other versions
KR20140020529A (ko
Inventor
김병목
노영진
정수정
강보희
히로시 코다이라
유이치로 탄다
사토시 오제키
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120087167A priority Critical patent/KR101973395B1/ko
Priority to JP2013098976A priority patent/JP6401435B2/ja
Priority to US13/924,167 priority patent/US9893259B2/en
Priority to EP22165623.4A priority patent/EP4040518A1/en
Priority to EP13177955.5A priority patent/EP2696379B1/en
Priority to CN201710194634.9A priority patent/CN107023760A/zh
Priority to CN201310346581.XA priority patent/CN103574354B/zh
Publication of KR20140020529A publication Critical patent/KR20140020529A/ko
Priority to US15/863,146 priority patent/US10388841B2/en
Application granted granted Critical
Publication of KR101973395B1 publication Critical patent/KR101973395B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
KR1020120087167A 2012-08-09 2012-08-09 발광 모듈 Expired - Fee Related KR101973395B1 (ko)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020120087167A KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈
JP2013098976A JP6401435B2 (ja) 2012-08-09 2013-05-09 発光パッケージ
US13/924,167 US9893259B2 (en) 2012-08-09 2013-06-21 Light emitting package
EP13177955.5A EP2696379B1 (en) 2012-08-09 2013-07-25 Light emitting device
EP22165623.4A EP4040518A1 (en) 2012-08-09 2013-07-25 Light emitting device
CN201710194634.9A CN107023760A (zh) 2012-08-09 2013-08-09 发光器件
CN201310346581.XA CN103574354B (zh) 2012-08-09 2013-08-09 发光器件
US15/863,146 US10388841B2 (en) 2012-08-09 2018-01-05 Light emitting package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120087167A KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈

Publications (2)

Publication Number Publication Date
KR20140020529A KR20140020529A (ko) 2014-02-19
KR101973395B1 true KR101973395B1 (ko) 2019-04-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120087167A Expired - Fee Related KR101973395B1 (ko) 2012-08-09 2012-08-09 발광 모듈

Country Status (5)

Country Link
US (2) US9893259B2 (enExample)
EP (2) EP4040518A1 (enExample)
JP (1) JP6401435B2 (enExample)
KR (1) KR101973395B1 (enExample)
CN (2) CN103574354B (enExample)

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KR101973395B1 (ko) * 2012-08-09 2019-04-29 엘지이노텍 주식회사 발광 모듈
EP3547379A1 (en) * 2014-03-14 2019-10-02 Citizen Electronics Co., Ltd. Light emitting apparatus
KR102252156B1 (ko) * 2014-07-08 2021-05-17 엘지이노텍 주식회사 발광 소자 패키지
US9481572B2 (en) * 2014-07-17 2016-11-01 Texas Instruments Incorporated Optical electronic device and method of fabrication
DE112015006331T5 (de) * 2015-03-19 2017-12-14 Osram Opto Semiconductors Gmbh Fenster zum Bedecken eines optoelektronischen Halbleiterchips, mehrere Fenster umfassende Scheibe, Verfahren zur Herstellung von Fenstern und optoelektronisches Halbleiterbauelement
CN107615478A (zh) * 2015-05-13 2018-01-19 三菱电机株式会社 半导体模块
CN108027110B (zh) * 2015-09-01 2020-07-10 Lg 伊诺特有限公司 照明装置
JP2017073489A (ja) * 2015-10-08 2017-04-13 エヌイーシー ショット コンポーネンツ株式会社 メタル−ガラスリッドおよびそれを利用したｄｕｖ−ｌｅｄ装置
JP6889533B2 (ja) * 2015-10-21 2021-06-18 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
JP6712855B2 (ja) * 2015-12-02 2020-06-24 スタンレー電気株式会社 紫外線発光装置及び紫外線照射装置
EP3416202B1 (en) * 2016-02-12 2021-04-07 LG Innotek Co., Ltd. Light emitting device package and lighting apparatus comprising same
US10864377B2 (en) 2016-12-01 2020-12-15 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
US10207116B2 (en) 2016-12-01 2019-02-19 Medtronic, Inc. Pacing mode switching in a ventricular pacemaker
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JP6687008B2 (ja) * 2017-11-30 2020-04-22 日亜化学工業株式会社 発光装置
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
JP7109930B2 (ja) * 2018-02-05 2022-08-01 日機装株式会社 流体殺菌装置
US10438975B1 (en) * 2018-03-13 2019-10-08 Innolux Corporation Display device and method for preparing the same
JP7356983B2 (ja) * 2018-08-22 2023-10-05 エーディーワイ株式会社 紫外線素子パッケージ
JP7405031B2 (ja) * 2020-07-16 2023-12-26 日本電気硝子株式会社 電子装置及び電子装置の製造方法
CN113707616A (zh) * 2021-07-19 2021-11-26 中国电子科技集团公司第十三研究所 盖板及陶瓷封装结构
WO2023042792A1 (ja) * 2021-09-16 2023-03-23 旭化成株式会社 紫外線照射装置
JP2025041057A (ja) * 2023-09-13 2025-03-26 ウシオ電機株式会社 光源モジュール、光源モジュールの製造方法

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Also Published As

Publication number Publication date
JP2014036226A (ja) 2014-02-24
US10388841B2 (en) 2019-08-20
JP6401435B2 (ja) 2018-10-10
US20140042482A1 (en) 2014-02-13
EP4040518A1 (en) 2022-08-10
US9893259B2 (en) 2018-02-13
KR20140020529A (ko) 2014-02-19
CN103574354A (zh) 2014-02-12
EP2696379A3 (en) 2016-01-20
US20180130934A1 (en) 2018-05-10
EP2696379B1 (en) 2022-05-18
CN107023760A (zh) 2017-08-08
EP2696379A2 (en) 2014-02-12
CN103574354B (zh) 2018-06-01

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