CN107615478A - 半导体模块 - Google Patents

半导体模块 Download PDF

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CN107615478A
CN107615478A CN201580079879.6A CN201580079879A CN107615478A CN 107615478 A CN107615478 A CN 107615478A CN 201580079879 A CN201580079879 A CN 201580079879A CN 107615478 A CN107615478 A CN 107615478A
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semiconductor module
mold resin
resin portion
edge
addition
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吉井大
谷川正明
竹内谦介
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Mitsubishi Electric Corp
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Abstract

在构成为搭载有半导体元件、将多个外部连接端子(302、303、304)从模塑树脂部(301)的边引出的半导体模块(1)中，出于用简单的结构确保将该半导体模块(1)组装至装置时的夹具的保持位置这一目的，构成为在由模塑树脂部(301)的相邻的边构成的角部的相向的至少2处设置保持边部(305、306)。

Description

半导体模块
技术领域
本发明涉及内置有半导体元件的半导体模块。
背景技术
以往，已知内置有多个FET等半导体元件的半导体模块。该半导体模块一般构成为设置有与半导体元件相连接的多个端子，并从半导体模块的主体的侧面引出上述端子。(例如，参照专利文献1)
现有技术文献
专利文献
专利文献1：日本专利第5532955号公报(段落0044、图4、图5)
发明内容
发明所要解决的技术问题
通常，在将上述那样的半导体模块组装至各种装置时，利用夹具夹住半导体模块的主体部分，从而配置在装置内，然而，在专利文献1所示的现有的半导体模块那样的端子结构中，由于存在从主体引出的各端子，因此难以确保保持半导体模块的位置。此外，也已知有对半导体模块的主体部进行吸引并保持的夹具，然而由于半导体模块自身的外形较大、重量也较重，且因吸附背面而有可能附着异物等情况，因此吸引方法也难以顺利实现。
本发明是为了解决上述现有问题而完成的，其提供了一种半导体模块，能以简单的结构确保由夹具进行保持的半导体模块的保持部。
解决技术问题所采用的技术方案
本发明所涉及的半导体模块搭载有半导体元件，多个外部连接端子从模塑树脂部的边被引出，其特征在于，所述半导体模块的模塑树脂部具有多个角部，在这些角部中的相向的至少2处设置有保持边部。
发明效果
根据本发明所涉及的半导体模块，通过在相向的2个角部设置保持边部，从而能避开外部连接端子来保持模塑树脂部，进而能容易地向装置内进行搭载。
此外，关于本发明的目的、特征、效果，可以从以下实施方式中的详细说明及附图的记载来进一步明确。
附图说明
图1是示出内置于本发明实施方式1所涉及的半导体模块的电路的电路图。
图2是示出搭载有本发明实施方式1所涉及的半导体模块的机电一体结构电动机的控制器部分的概要结构的展开图。
图3是示出本发明实施方式1所涉及的半导体模块的外形形状的俯视图。
图4是示出本发明实施方式2所涉及的半导体模块的外形形状的俯视图。
图5是示出本发明实施方式3所涉及的半导体模块的外形形状的俯视图。
具体实施方式
实施方式1.
以下，参照图1对本发明所涉及的实施方式进行说明。
另外，本发明所涉及的半导体模块被用作为与电动机、交流发电机等旋转电机进行组合的功率电路，适用于希望利用机电一体结构使产品的功能构成为小型、紧凑、高效率而使用的功率电子电路，尤其是内置有半导体开关元件的功率电子电路。
图1是示出内置于半导体模块的电路的电路图。图中，半导体模块1具有构成半导体开关元件的2个MOSFET101、以及与MOSFET101相连接的引线框102，并构成为将上述元器件收纳于树脂模塑103来进行保护。
此外，半导体模块1在树脂模塑103内具有线夹引线(clip lead)104、引线键合(wire bond)105等连接构件，并经由上述连接构件与引线框102相连接。此处，引线框102通过树脂模塑外部连接端子106被引出至树脂模塑103的外部。此外，半导体模块1构成为被集成在1个封装中，并构成为作为整体具有切断逆变器电路驱动用电源的开关功能以及切断电池反接时的过电流的开关功能。
此外，用于进行各MOSFET101的控制以及电压的监视的信号端子被集中到树脂模塑103的一边107一侧并被引出，与外部的控制电路相连接。并且，端子也从与树脂模塑103的一边107相邻的两侧的边被引出，并在有限的空间内与构成控制单元的其他机构部件相连接。
图2是示出搭载有本发明实施方式1所涉及的半导体模块的机电一体结构电动机的控制器(ECU：Electronic Control Unit，电子控制设备)部分的展开图。另外，此处，示出了逆变器控制单元的结构的一个示例。
此外，该逆变器单元包括用于驱动无刷DC电动机的三相逆变器驱动电路以及电路电源切断用电路，并利用与电动机同轴一体结构从而构成作为紧凑的电源组模块的结构体。
为了实现该同轴一体结构，对于半导体模块1的热损耗，收纳逆变器控制单元的外壳202需要获得作为散热器的功能，因此利用兼具高散热性和上述的机械刚性的铝压铸合金等原材料来制作。
此外，半导体模块1被夹在外壳202与由树脂成形得到的框架组装体203之间，通过将框架组装体203螺钉紧固于外壳202来同时进行固定。此时，为了确保半导体模块1的散热面与由外壳202构成的散热器之间的热传导及电绝缘，从而使散热片材和油脂等介于这两者之间。
此外，框架组装体203中设有用于对半导体模块1提供电源的汇流条205，经由连接器组装体204从外部接收电力。
此外，半导体模块1的信号引脚经由设置于框架组装体203的贯通孔与控制基板206相连接。并且，来自连接器组装体204的信号连接器部的信号引脚也与控制基板206相连接。
图3是示出本发明实施方式1所涉及的半导体模块的外形形状的结构图。
在将半导体模块1搭载在逆变器控制单元等装置内时，需要利用夹具夹住成为半导体模块1的主体部的模塑树脂部301，然而在多个外部连接端子302、303、304从多条边被引出的结构的情况下，无法使夹具与相向的2个面紧贴，从而难以保持半导体模块1。
因此，本发明中，如图3所示，将半导体模块1中的模塑树脂部301形成为四边形，在由四边形的相邻的边形成的角部设置与各个面的角度不同的倾斜的保持边部305，并且，在该保持边部305的相反侧的角部通过一体成形的方式设置与保持边部305平行的保持边部306。
由此，通过在相向的2个角部设置平行的保持边部305、306，从而能避开外部连接端子302、303、304来保持模塑树脂部301，进而能容易地向装置内进行搭载。
此外，通过在角部设置一对保持边部305、306，从而在夹具打滑而无法保持模塑树脂部301的情况下，也能防止夹具与外部连接端子302、303、304发生碰撞。
另外，还有以下优点，即：即使像相向面307、308那样具有相向的边，在除半导体模块1以外的元器件造成妨碍而无法进行保持的情况下，也能通过在角部保持一对保持边部305、306，从而向装置进行搭载变得容易。
实施方式2.
接着，参照图4对本发明的实施方式2进行说明。另外，图中，对与实施方式1同等的部分标注了同一标号。
在上述实施方式1中，构成为将模塑树脂部301的外形形状设为四边形，然而在实施方式2中，如图4所示，是将模塑树脂部301的外形形状设为四边形以上的多边形时的示例。即，构成为在由相邻的边形成的角部设置保持边部305，并在其相向的角部设置与保持边部305平行的保持边部306。另外，在多边形的各边形成为直线以外的情况下也能以同样的方式来构成。
通过上述结构，即使在不以四边形来形成模塑树脂部301的情况下，也能获得与实施方式1同样的效果。
实施方式3.
接着，参照图5对本发明的实施方式3进行说明。
在图5中，基于与实施方式2相同的四边形以上的多边形或在各边包含直线以外的形状的模塑树脂部301，在由相邻边形成的角部设置从各边突出的底座部来形成保持边部305，并且在与该保持边部305相向的部分设置从各边突出的底座部来形成与保持边部305平行的保持边部306。
由此，通过在由模塑树脂部301的相邻的边形成的角部设置平行的保持边部305、306，从而能获得与实施方式1同样的效果。此外，通过在模塑树脂部301设置从各边突出的保持边部305、306，从而在夹具打滑而无法保持模塑树脂部301主体的情况下，也能防止夹具与外部连接端子302、303、304发生碰撞的缺点。
另外，上述说明中，保持边部305、306的平行无需具有数学上的严密性，只要形成为具有保持边部305、306可被保持的程度的平行度即可。此外，保持边部305、306只要至少设置在相向的2处即可，例如设置于四边形的各角部等。并且，根据夹住保持边部的夹具的保持部分的形状的不同，也可以将2个保持边部305、306设为不平行。
另外，本发明在其发明范围内可对实施方式进行适当变形、省略。
标号说明
1：半导体模块，301：模塑树脂部，302、303、304：外部连接端子，305、306：保持边部。

Claims (6)

1.一种半导体模块，搭载有半导体元件，多个外部连接端子从模塑树脂部的边被引出，其特征在于，
所述半导体模块的模塑树脂部具有多个角部，在这些角部中的相向的至少2处设置有保持边部。
2.如权利要求1所述的半导体模块，其特征在于，
所述保持边部与所述模塑树脂部一体成形。
3.如权利要求1或2所述的半导体模块，其特征在于，
所述半导体模块的模塑树脂部形成为四边形或四边形以上的多边形。
4.如权利要求1至3的任一项所述的半导体模块，其特征在于，
至少2处的所述保持边部形成为互相平行或互相不平行。
5.如权利要求1至4的任一项所述的半导体模块，其特征在于，
所述多个外部连接端子仅配置于所述模塑树脂部的边。
6.如权利要求1至5的任一项所述的半导体模块，其特征在于，
所述保持边部通过设为从所述多个外部连接端子被引出的所述模塑树脂部的边突出的底座部来形成。
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