WO2016181516A1 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- WO2016181516A1 WO2016181516A1 PCT/JP2015/063720 JP2015063720W WO2016181516A1 WO 2016181516 A1 WO2016181516 A1 WO 2016181516A1 JP 2015063720 W JP2015063720 W JP 2015063720W WO 2016181516 A1 WO2016181516 A1 WO 2016181516A1
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- semiconductor module
- holding
- mold resin
- holding side
- external connection
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H02M7/538—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a push-pull configuration
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
- H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
Definitions
- the present invention relates to a semiconductor module incorporating a semiconductor element.
- a semiconductor module incorporating a plurality of semiconductor elements such as FETs is known.
- the semiconductor module is provided with a large number of terminals connected to the semiconductor element, and these terminals are generally drawn out from the side surface of the main body of the semiconductor module. (For example, see Patent Document 1)
- the present invention has been made to solve the conventional problems as described above, and provides a semiconductor module that can secure a holding portion of the semiconductor module by a holder with a simple structure.
- the semiconductor module according to the present invention is a semiconductor module in which a semiconductor element is mounted and a plurality of external connection terminals are drawn out from the side of the mold resin portion.
- the mold resin portion of the semiconductor module has a plurality of corner portions, The holding side portions are provided at at least two opposing positions in the corners of the.
- the semiconductor module of the present invention it is possible to hold the mold resin portion by avoiding the external connection terminals by providing the holding side portions at the two opposite corner portions, and easy mounting in the apparatus. Can be done.
- Embodiment 1 FIG. A description will be given below with reference to FIG. 1 showing an embodiment according to the present invention.
- the semiconductor module according to the present invention is used as a power circuit combined with a rotating electric machine such as a motor or an alternator, and is used with the intention of configuring a product function in a compact, compact, and high efficiency by an electromechanical integrated structure. It is applied to power electronics circuits, and in particular has a built-in semiconductor switching element.
- FIG. 1 is a circuit diagram showing a circuit built in a semiconductor module.
- a semiconductor module 1 has two MOSFETs 101 constituting a semiconductor switching element, and a lead frame 102 connected to the MOSFET 101, and these components are housed in a resin mold 103 to be protected. ing.
- the semiconductor module 1 has connection members such as a clip lead 104 and a wire bond 105 in a resin mold 103, and is connected to the lead frame 102 via these connection members.
- the lead frame 102 is drawn out of the resin mold 103 by the resin mold external connection terminal 106.
- the semiconductor module 1 is configured as a single package, and is configured to have a switch function for cutting off the inverter circuit drive power supply and a switch function for cutting off overcurrent when the battery is reversely connected as a whole.
- signal terminals for controlling each MOSFET 101 and monitoring the voltage are gathered and drawn out to the side 107 of the resin mold 103 and connected to an external control circuit. Furthermore, terminals are also drawn out from both sides adjacent to one side 107 of the resin mold 103, and connected to other mechanical parts constituting the control unit in a limited space.
- FIG. 2 is a developed view showing a controller (ECU: Electronic Control Unit) portion of an electromechanically integrated motor equipped with the semiconductor module according to Embodiment 1 of the present invention.
- ECU Electronic Control Unit
- the inverter unit includes a three-phase inverter drive circuit for driving a brushless DC motor and a circuit power cutoff circuit, and forms a compact structure as a power pack module by a coaxial integrated structure with the motor.
- the housing 202 that accommodates the inverter control unit needs to obtain a function as a heat sink against the heat loss of the semiconductor module 1. It is made of a material such as an aluminum die-casting alloy that combines rigidity.
- the semiconductor module 1 is sandwiched between the housing 202 and a frame assembly 203 formed of resin, and is fixed simultaneously by screwing the frame assembly 203 to the housing 202. At this time, in order to maintain heat conduction and electrical insulation between the heat radiation surface of the semiconductor module 1 and the heat sink formed of the housing 202, a heat radiation sheet and grease are interposed.
- the frame assembly 203 is provided with a bus bar 205 for supplying power to the semiconductor module 1, and receives power from the outside via the connector assembly 204. Further, the signal pins of the semiconductor module 1 are connected to the control board 206 through through holes provided in the frame assembly 203. Further, signal pins from the signal connector portion of the connector assembly 204 are also connected to the control board 206.
- FIG. 3 is a block diagram showing the outer shape of the semiconductor module according to Embodiment 1 of the present invention.
- the mold resin part 301 in the semiconductor module 1 is formed in a quadrangular shape, and the corners formed by the adjacent sides of the quadrangular shape are inclined at different angles from the respective surfaces.
- the holding side portion 305 is provided, and a holding side portion 306 that is parallel to the holding side portion 305 is formed by integral molding at the corner opposite to the holding side portion 305.
- the holder collides with the external connection terminals 302, 303, and 304. This can also be prevented. Even if the opposing surfaces 307 and 308 have opposing sides, a pair of holding side portions 305 and 306 are held at the corners even when components other than the semiconductor module 1 are obstructed and cannot be held. As a result, there is also an advantage that the device can be easily mounted.
- FIG. Next, a second embodiment of the present invention will be described with reference to FIG.
- symbol is attached
- FIG. In the above-described first embodiment, the outer shape of the mold resin portion 301 is configured as a quadrangle. However, in the second embodiment, as illustrated in FIG. This is an example of the case. That is, the holding side portion 305 is provided at a corner portion formed by adjacent sides, and the holding side portion 306 parallel to the holding side portion 305 is provided at the opposite corner portion.
- the same configuration can be adopted. By configuring in this way, even when the mold resin portion 301 is not formed in a quadrangular shape, the same effect as in the first embodiment can be obtained.
- the mold resin portion 301 includes a quadrangular or more polygon or a shape other than a straight line on each side, and protrudes from each side to a corner formed by adjacent sides.
- a holding side portion 305 is formed by providing a pedestal portion, and a holding side portion 306 parallel to the holding side portion 305 is formed by providing a pedestal portion protruding from each side at a portion facing the holding side portion 305. It is.
- the holding side portions 305 and 306 parallel to the corner portions formed by the adjacent sides of the mold resin portion 301 the same effect as in the first embodiment can be obtained.
- the holding device can be connected to the external connection terminals 302, 303, and 304. It is also possible to prevent the drawbacks of colliding with each other.
- the parallelism of the holding side portions 305 and 306 does not require mathematical strictness, and may be formed to have a degree of parallelism that allows the holding side portions 305 and 306 to be held. . Further, the holding side portions 305 and 306 may be provided at at least two opposing positions, such as provided at each corner of the quadrilateral shape. Furthermore, depending on the shape of the holding part of the holder that holds the holding side part, the two holding side parts 305 and 306 can be made non-parallel. In the present invention, the embodiments can be appropriately modified and omitted within the scope of the invention.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
なお、この発明の目的、特徴、効果は、以下の実施の形態における詳細な説明および図面の記載からより明らかとなる。
以下、この発明に係る実施の形態を示す図1を参照して説明する。
なお、この発明に係る半導体モジュールは、モータやオルタネータ等の回転電機と組み合わせるパワー回路として利用され、機電一体構造により製品の機能を小型、コンパクト、高効率に構成することを意図して使用されるパワーエレクトロニクス回路に適用され、とりわけ半導体スイッチング素子を内蔵したものである。
また、このインバータユニットは、ブラシレスDCモータを駆動するための3相インバータ駆動回路および回路電源遮断用回路を備え、モータと同軸一体構造によってコンパクトなパワーパックモジュールとしての構造体を成している。
また、半導体モジュール1は、ハウジング202と樹脂により成形されたフレーム組立体203との間に挟み込まれ、ハウジング202にフレーム組立体203をねじ止めすることによって同時に固定されている。このとき、半導体モジュール1の放熱面とハウジング202からなるヒートシンクとの間の熱伝導および電気的な絶縁を保つために、放熱シートとグリス等が介在されている。
また、半導体モジュール1の信号ピンは、フレーム組立体203に設けられた貫通穴を介して制御基板206に接続されている。さらに、コネクタ組立体204の信号コネクタ部からの信号ピンも制御基板206に接続されている。
半導体モジュール1をインバータコントロールユニットなどの装置内に搭載する際、保持具により半導体モジュール1の本体部となるモールド樹脂部301を掴むことが必要になるが、複数の外部接続端子302、303、304が複数の辺から引き出された構造の場合、対向する2面に保持具を当てることができず、半導体モジュール1を保持することが困難となる。
このため、この発明では、図3に示すように、半導体モジュール1におけるモールド樹脂部301を四角形状に形成し、四角形状の隣接した辺により形成される角部にそれぞれの面と角度が異なる傾斜した保持辺部305を設け、さらに、この保持辺部305の反対側の角部に保持辺部305と平行となる保持辺部306を一体成形により設けている。
このように対向する2つの角部に平行な保持辺部305,306を設けることによって、外部接続端子302,303,304を避けてモールド樹脂部301を保持することが可能となり、装置内への搭載を容易に行わせることができる。
なお、対向面307、308のように対向した辺を有していても、半導体モジュール1以外の部品が邪魔になり保持できない場合においても、角部に一対の保持辺部305、306を保持させることによって、装置への搭載が容易となる利点もある。
次に、この発明の実施の形態2について図4を参照して説明する。なお、図中、実施の形態1と同等の部分には同一符号を付している。
上述の実施の形態1においては、モールド樹脂部301の外形形状を四角形として構成したが、実施の形態2においては、図4に示すように、モールド樹脂部301の外形形状を四角形以上の多角形とした場合の例である。すなわち、隣接する辺により形成される角部に保持辺部305を設け、その対向する角部に保持辺部305と平行な保持辺部306を設けるように構成している。なお、多角形状の各辺が直線以外で形成された場合も同様に構成することができる。
このように構成することによって、モールド樹脂部301が四角形で形成されていない場合においても、実施の形態1と同様の効果を得ることができる。
次に、この発明の実施の形態3について図5を参照して説明する。
図5においては、実施の形態2と同様に四角形以上の多角形または各辺に直線以外の形状を含むモールド樹脂部301を基本とし、隣接する辺により形成される角部に各辺から突出する台座部を設けて保持辺部305を形成し、かつ、この保持辺部305に対向する部分に各辺から突出する台座部を設けて保持辺部305に平行な保持辺部306を形成したものである。
このようにモールド樹脂部301の隣接する辺により形成される角部に平行な保持辺部305、306を設けることによって、実施の形態1と同様の効果を得ることができる。また、モールド樹脂部301に各辺から突出させた保持辺部305、306を設けることにより、保持具がすべってモールド樹脂部301本体を保持できない場合に保持具が外部接続端子302、303、304に衝突する欠点も防止することが可能となる。
なお、本発明は、その発明の範囲内において、実施の形態を適宜、変形、省略することが可能である。
Claims (6)
- 半導体素子を搭載し、複数の外部接続端子がモールド樹脂部の辺より引き出された半導体モジュールにおいて、
前記半導体モジュールのモールド樹脂部は複数の角部を有し、これらの角部の内の対向する少なくとも2カ所に保持辺部を設けたことを特徴とする半導体モジュール。 - 前記保持辺部は、前記モールド樹脂部と一体成形されていることを特徴とする請求項1に記載の半導体モジュール。
- 前記半導体モジュールのモールド樹脂部は、四角形または四角形以上の多角形に形成されていることを特徴とする請求項1又は2に記載の半導体モジュール。
- 少なくとも2カ所の前記保持辺部は、互いに平行または非平行に形成されていることを特徴とする請求項1から3のいずれか一項に記載の半導体モジュール。
- 前記複数の外部接続端子は、前記モールド樹脂部の辺にのみ配置されていることを特徴とする請求項1から4のいずれか一項に記載の半導体モジュール。
- 前記保持辺部は、前記複数の外部接続端子が引き出された前記モールド樹脂部の辺より突出した台座部とすることにより形成したことを特徴とする請求項1から5のいずれか一項に記載の半導体モジュール。
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EP15891840.9A EP3297020A4 (en) | 2015-05-13 | 2015-05-13 | Semiconductor module |
JP2017517532A JPWO2016181516A1 (ja) | 2015-05-13 | 2015-05-13 | 半導体モジュール |
US15/541,919 US10217683B2 (en) | 2015-05-13 | 2015-05-13 | Mounted semiconductor module with a mold resin portion |
PCT/JP2015/063720 WO2016181516A1 (ja) | 2015-05-13 | 2015-05-13 | 半導体モジュール |
CN201580079879.6A CN107615478A (zh) | 2015-05-13 | 2015-05-13 | 半导体模块 |
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- 2015-05-13 EP EP15891840.9A patent/EP3297020A4/en not_active Withdrawn
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