JP5313143B2 - 張力緩和を備える発光装置 - Google Patents
張力緩和を備える発光装置 Download PDFInfo
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- JP5313143B2 JP5313143B2 JP2009528835A JP2009528835A JP5313143B2 JP 5313143 B2 JP5313143 B2 JP 5313143B2 JP 2009528835 A JP2009528835 A JP 2009528835A JP 2009528835 A JP2009528835 A JP 2009528835A JP 5313143 B2 JP5313143 B2 JP 5313143B2
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- Prior art keywords
- light emitting
- light
- glass
- emitting device
- optical element
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- 239000000463 material Substances 0.000 claims description 63
- 230000003287 optical effect Effects 0.000 claims description 54
- 239000011521 glass Substances 0.000 claims description 22
- 239000005365 phosphate glass Substances 0.000 claims description 21
- 239000000075 oxide glass Substances 0.000 claims description 17
- 229910052714 tellurium Inorganic materials 0.000 claims description 12
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010272 inorganic material Inorganic materials 0.000 claims description 6
- 239000011147 inorganic material Substances 0.000 claims description 6
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910001386 lithium phosphate Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910000160 potassium phosphate Inorganic materials 0.000 claims description 3
- 235000011009 potassium phosphates Nutrition 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 claims description 3
- CPWJKGIJFGMVPL-UHFFFAOYSA-K tricesium;phosphate Chemical compound [Cs+].[Cs+].[Cs+].[O-]P([O-])([O-])=O CPWJKGIJFGMVPL-UHFFFAOYSA-K 0.000 claims description 3
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims (10)
- 少なくとも1つの発光ダイオードと、前記少なくとも1つの発光ダイオードの発光面に結合材料によって結合される少なくとも1つの光学素子とを有する発光装置であって、前記結合材料が、前記発光装置の動作温度以下の250℃までのTgを持つ、リン酸塩ガラス及び酸化物ガラスから成るグループから選択されるガラス材料を有することを特徴とする発光装置。
- 請求項1に記載の発光装置であって、前記リン酸塩ガラスが、スズリン酸塩ガラス、リチウムリン酸塩ガラス、ナトリウムリン酸塩ガラス、カリウムリン酸塩ガラス、セシウムリン酸塩ガラス、テルルリン酸塩ガラス及びそれらの混合物から成るグループから選択される発光装置。
- 請求項1又は2に記載の発光装置であって、前記酸化物ガラスが、タングステン/テルル酸化物ガラス、ナトリウム/亜鉛/テルル酸化物ガラス、バリウム/亜鉛/テルル酸化物ガラス及びそれらの混合物から成るグループから選択される発光装置。
- 請求項1乃至3のいずれか一項に記載の発光装置であって、前記少なくとも1つの発光ダイオードが、フリップチップタイプの発光ダイオードである発光装置。
- 請求項1乃至4のいずれか一項に記載の発光装置であって、前記光学素子が、無機材料製である発光装置。
- 請求項1乃至5のいずれか一項に記載の発光装置であって、前記光学素子が、発光化合物を有する発光装置。
- 請求項1乃至6のいずれか一項に記載の発光装置であって、前記結合材料が、発光化合物を有する発光装置。
- 発光装置の製造方法であって、
− 少なくとも1つの発光ダイオード及び少なくとも1つの光学素子を設けるステップと、
− 前記少なくとも1つの発光ダイオードの発光面及び/又は前記少なくとも1つの光学素子の面に、前記発光装置の動作温度以下の250℃までのTgを持つ、リン酸塩ガラス及び酸化物ガラスから成るグループから選択されるガラス材料を有する結合材料を配設するステップと、
− 組立体を形成するよう、前記少なくとも1つの発光ダイオードの前記発光面上に、前記少なくとも1つの光学素子を、それらの間に前記結合材料をはさんで、配置するステップと、
− 前記少なくとも1つの光学素子を前記少なくとも1つの発光ダイオードに結合するよう前記結合材料を前記結合材料の前記Tgを上回る温度で加熱するステップとを有する発光装置の製造方法。 - 請求項8に記載の方法であって、前記加熱するステップが、前記組立体に加圧しながら行われる方法。
- 発光装置において光学素子を発光ダイオードの発光面に結合するための結合材料としての、前記発光装置の動作温度以下の250℃までのT g を持つ、リン酸塩ガラス及び酸化物ガラスから成るグループから選択されるガラス材料の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06121092.8 | 2006-09-22 | ||
EP06121092 | 2006-09-22 | ||
PCT/IB2007/053765 WO2008035283A2 (en) | 2006-09-22 | 2007-09-18 | Light emitting device with tension relaxation |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010504638A JP2010504638A (ja) | 2010-02-12 |
JP5313143B2 true JP5313143B2 (ja) | 2013-10-09 |
Family
ID=38926132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009528835A Active JP5313143B2 (ja) | 2006-09-22 | 2007-09-18 | 張力緩和を備える発光装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8044421B2 (ja) |
EP (1) | EP2067182B1 (ja) |
JP (1) | JP5313143B2 (ja) |
KR (1) | KR101370367B1 (ja) |
CN (1) | CN101517756B (ja) |
WO (1) | WO2008035283A2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012117346A1 (en) | 2011-03-02 | 2012-09-07 | Koninklijke Philips Electronics N.V. | Tin phosphate glass containing embedded luminescent material particles |
US10290779B2 (en) * | 2016-12-15 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting element |
DE102017122325A1 (de) | 2017-09-26 | 2019-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
WO2020175396A1 (ja) * | 2019-02-28 | 2020-09-03 | Agc株式会社 | 接着層付き光学部材および発光装置 |
Family Cites Families (27)
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JPS4974174U (ja) * | 1972-10-17 | 1974-06-27 | ||
US4743302A (en) * | 1986-06-06 | 1988-05-10 | Vlsi Packaging Materials, Inc. | Low melting glass composition |
JPH01138150A (ja) * | 1987-11-25 | 1989-05-31 | Ohara Inc | 低融性ガラス |
US5013360A (en) * | 1989-09-15 | 1991-05-07 | Vlsi Packaging Materials, Inc. | Sealing glass compositions |
US4997718A (en) * | 1989-11-08 | 1991-03-05 | Vlsi Packaging Materials, Inc. | Silver phosphate glass die-attach composition |
US5089446A (en) * | 1990-10-09 | 1992-02-18 | Corning Incorporated | Sealing materials and glasses |
US5958100A (en) | 1993-06-03 | 1999-09-28 | Micron Technology, Inc. | Process of making a glass semiconductor package |
DE4430171C2 (de) * | 1994-08-25 | 1996-08-14 | Walter Ag | Formschlüssig gesicherte Schneidplatte |
JPH09148326A (ja) | 1995-11-21 | 1997-06-06 | Hitachi Ltd | 半導体素子およびその製造方法 |
DE19803936A1 (de) * | 1998-01-30 | 1999-08-05 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung |
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US6652972B1 (en) * | 1999-11-01 | 2003-11-25 | Schott Glass Technologies Inc. | Low temperature joining of phosphate glass |
JP2002037644A (ja) * | 2000-05-16 | 2002-02-06 | Nippon Electric Glass Co Ltd | 封着用ガラス及びそれを用いた封着材料 |
JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
DE10118630A1 (de) | 2001-04-12 | 2002-10-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelements |
EP1440950B1 (en) * | 2001-10-30 | 2016-07-06 | Sumita Optical Glass, Inc. | Optical glass suitable for mold forming |
JP2004200531A (ja) * | 2002-12-20 | 2004-07-15 | Stanley Electric Co Ltd | 面実装型led素子 |
WO2004082036A1 (ja) | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | 固体素子デバイスおよびその製造方法 |
CN1617347A (zh) | 2003-04-09 | 2005-05-18 | Hoya株式会社 | 半导体封装窗用玻璃及所用玻璃窗及其制法和半导体封装 |
JP4465989B2 (ja) * | 2003-06-18 | 2010-05-26 | 旭硝子株式会社 | 発光ダイオード素子 |
JP2005072129A (ja) | 2003-08-21 | 2005-03-17 | Nec Lighting Ltd | 可視光線発光装置とその製造方法及び表示装置 |
JP4697652B2 (ja) * | 2003-08-29 | 2011-06-08 | 日本電気硝子株式会社 | ガラスペースト |
WO2005109529A1 (en) * | 2004-05-07 | 2005-11-17 | Koninklijke Philips Electronics N.V. | Light-emitting-diode chip package and a collimator |
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US8050526B2 (en) * | 2005-02-08 | 2011-11-01 | Samsung Electronics Co., Ltd. | Micro-optical device and method of making same |
-
2007
- 2007-09-18 KR KR1020097008163A patent/KR101370367B1/ko active IP Right Grant
- 2007-09-18 US US12/439,295 patent/US8044421B2/en active Active
- 2007-09-18 WO PCT/IB2007/053765 patent/WO2008035283A2/en active Application Filing
- 2007-09-18 JP JP2009528835A patent/JP5313143B2/ja active Active
- 2007-09-18 CN CN200780035304XA patent/CN101517756B/zh active Active
- 2007-09-18 EP EP07826424.9A patent/EP2067182B1/en active Active
Also Published As
Publication number | Publication date |
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US20100012958A1 (en) | 2010-01-21 |
CN101517756A (zh) | 2009-08-26 |
CN101517756B (zh) | 2013-06-19 |
EP2067182B1 (en) | 2016-10-05 |
WO2008035283A2 (en) | 2008-03-27 |
WO2008035283A3 (en) | 2008-05-29 |
JP2010504638A (ja) | 2010-02-12 |
KR20090064460A (ko) | 2009-06-18 |
EP2067182A2 (en) | 2009-06-10 |
KR101370367B1 (ko) | 2014-03-05 |
US8044421B2 (en) | 2011-10-25 |
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