JPS4974174U - - Google Patents
Info
- Publication number
- JPS4974174U JPS4974174U JP1972119311U JP11931172U JPS4974174U JP S4974174 U JPS4974174 U JP S4974174U JP 1972119311 U JP1972119311 U JP 1972119311U JP 11931172 U JP11931172 U JP 11931172U JP S4974174 U JPS4974174 U JP S4974174U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972119311U JPS4974174U (ja) | 1972-10-17 | 1972-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972119311U JPS4974174U (ja) | 1972-10-17 | 1972-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4974174U true JPS4974174U (ja) | 1974-06-27 |
Family
ID=28358549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972119311U Pending JPS4974174U (ja) | 1972-10-17 | 1972-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4974174U (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001080635A1 (fr) * | 2000-04-21 | 2001-11-01 | Labosphere Institute | Dispositif menaçant |
| JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
| JP2008041844A (ja) * | 2006-08-03 | 2008-02-21 | Toyoda Gosei Co Ltd | 光学装置及びその製造方法 |
| JP2010504638A (ja) * | 2006-09-22 | 2010-02-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 張力緩和を備える発光装置 |
-
1972
- 1972-10-17 JP JP1972119311U patent/JPS4974174U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001080635A1 (fr) * | 2000-04-21 | 2001-11-01 | Labosphere Institute | Dispositif menaçant |
| JP4708660B2 (ja) * | 2000-04-21 | 2011-06-22 | ラボ・スフィア株式会社 | 威嚇装置 |
| JP2004071771A (ja) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | 発光ダイオード |
| JP2008041844A (ja) * | 2006-08-03 | 2008-02-21 | Toyoda Gosei Co Ltd | 光学装置及びその製造方法 |
| US8490431B2 (en) | 2006-08-03 | 2013-07-23 | Toyoda Gosei Co., Ltd. | Optical device and method for making the same |
| JP2010504638A (ja) * | 2006-09-22 | 2010-02-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 張力緩和を備える発光装置 |