WO2011013581A1 - 発光装置及びその製造方法 - Google Patents
発光装置及びその製造方法 Download PDFInfo
- Publication number
- WO2011013581A1 WO2011013581A1 PCT/JP2010/062406 JP2010062406W WO2011013581A1 WO 2011013581 A1 WO2011013581 A1 WO 2011013581A1 JP 2010062406 W JP2010062406 W JP 2010062406W WO 2011013581 A1 WO2011013581 A1 WO 2011013581A1
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- WO
- WIPO (PCT)
- Prior art keywords
- package
- light emitting
- emitting device
- light
- frame portion
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 109
- 239000000853 adhesive Substances 0.000 claims abstract description 96
- 230000001070 adhesive effect Effects 0.000 claims abstract description 96
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Definitions
- the present invention relates to a light emitting device in which a package and a cap are bonded and a method for manufacturing the same.
- Such a light emitting device is used for, for example, a light source of an optical printer head, a liquid crystal backlight light source, a light source of various meters, various reading sensors, and the like, taking advantage of features such as low power consumption, small size, and light weight.
- a light emitting device in which a light emitting element 42 is mounted on the bottom surface of a recess provided on one surface of a package 41 as shown in FIG. 1).
- a plate-like light color conversion member 43 in which a phosphor is dispersed in a translucent resin is fixed with an adhesive or the like in a state of closing the opening of the recess.
- the adhesive a translucent resin is usually used.
- FIG. 6B As another example of a light-emitting device provided with a translucent member that closes the recess opening of the package, a light-emitting device as shown in FIG. 6B has been proposed (see, for example, Patent Document 2).
- the light-emitting device shown in FIG. 6B uses a package 44 having a recess, die-bonds the semiconductor light-emitting element 45 to the bottom surface of the recess, and the conductive member 46 provided on the electrode of the semiconductor light-emitting element 45 and the package 44. Are electrically connected using a conductive wire 47.
- a metal cap 49 fitted with a translucent member 48 is bonded to the opening side of the concave portion of the package 44 and hermetically sealed.
- the joining member used for joining passes through the wall surface of the package to the electrode. May reach. At this time, there is no problem in driving the light emitting device if the bonding member is an insulating material such as resin.
- the bonding member is an insulating material such as resin.
- the positive and negative electrodes of the package are electrically connected by an adhesive. There is a risk that a short circuit will occur.
- a method for manufacturing a light emitting device includes an adhesion step of adhering a cap having a frame portion to a package in which a light emitting element is mounted in the recess so as to cover the opening of the recess.
- a metal adhesive having a wettability with respect to the frame part larger than the wettability with respect to the package is partially formed on the package or the frame part, and the metal adhesive is formed along the frame part.
- the frame portion extends from an adhesive portion with the package to the inside of a concave portion of the package, and the package has an electrode to which the light emitting element is connected in the concave portion, and the cap is adhered to the frame portion.
- a step is provided between the bonded portion and the electrode.
- the frame portion has a rectangular shape when viewed from above, and in the bonding step, the metal adhesive is formed on two opposite sides of the frame portion, and the metal adhesive is opposed to the opposite side of the peripheral portion. Extend and bond to the side adjacent to the side.
- the frame portion is a metal member.
- the light emitting element is a light emitting element that emits ultraviolet rays.
- the frame portion has a shape protruding along the step.
- the frame portion has a surface on the concave portion side on the step.
- the method for manufacturing a light emitting device includes a bonding step of bonding a cap that covers the opening of the concave portion to a package in which the light emitting element is mounted in the concave portion, and the cap is attached to the package on the periphery thereof.
- a frame portion that is bonded and extends from a bonding portion with the package to the inside of a recess of the package, the package having an electrode to which the light emitting element is connected in the recess, and the cap is bonded
- a step is provided between the bonded portion and the electrode, and in the bonding step, a metal adhesive having a wettability with respect to the frame portion is larger than the wettability with respect to the package in the package or the frame portion. Partially formed, the metal adhesive is stretched along the frame portion to bond the package and the frame portion.
- the metal adhesive is stretched and bonded, and a gap is formed in a bonded portion where the metal adhesive is bonded.
- the frame portion has a rectangular shape when viewed from above, and in the bonding step, the metal adhesive is formed on two opposite sides of the frame portion, and the metal adhesive is opposed to the opposite side of the peripheral portion. Extend and bond to the side adjacent to the side.
- the frame portion is a metal member.
- the light emitting device includes a package having a recess, a light emitting element mounted in the recess, and a cap bonded to cover the opening of the recess.
- a frame portion that is bonded to the package and extends from an adhesion portion with the package to an inside of a recess of the package, and the frame portion and the package have a wettability with respect to the frame portion that is higher than a wettability with respect to the package
- the package is bonded via a large metal adhesive, and the package has an electrode to which the light emitting element is electrically connected in a recess thereof, and the gap between the bonded portion to which the cap is bonded and the electrode. Have a step.
- the frame portion has a shape protruding along the step.
- the frame portion has a surface on the concave portion side on the step.
- the frame portion is a metal member.
- the light emitting element is a light emitting element that emits ultraviolet rays.
- a non-hermetic light emitting device in a light emitting device using a conductive adhesive for bonding a package and a cap, a non-hermetic light emitting device can be manufactured stably and the yield can be improved. Can do.
- the metal adhesive is introduced in the package recess inward direction by extending the frame portion of the cap into the recess of the package and using a metal adhesive having high wettability to the frame portion. At the same time, the metal adhesive can be stopped before the electrode of the package by the step in the recess. Therefore, a short circuit can be prevented. Further, since the metal adhesive is introduced into the recess of the package, leakage of the metal adhesive out of the package can be suppressed.
- FIG. 1 a is a schematic cross-sectional view showing a light emitting device according to an embodiment of the present invention.
- FIG. 1b is a schematic enlarged view in which a part of FIG. 1a is enlarged.
- FIG. 2 is a schematic front view showing the light emitting device according to the embodiment of the present invention.
- FIG. 3 is a schematic front view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention.
- FIG. 4A is a schematic front view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention.
- FIG. 4B is a schematic enlarged view of the joint portion 30b in FIG. 4A viewed from the right direction in the drawing.
- FIG. 5 is a schematic cross-sectional view showing another light emitting device according to an embodiment of the present invention.
- FIG. 6 is a schematic cross-sectional view showing a conventional light emitting device.
- FIG. 1a shows a light emitting device according to an embodiment of the present invention.
- the light emitting device includes a package 1, a light emitting element 2 mounted in a recess of the package 1, and a cap 3 that closes an opening of the recess of the package.
- the package 1 has recesses in which the light emitting elements 2 can be placed, and the light emitting elements 2 are respectively fixed to the bottom surfaces of the recesses using bonding members.
- the electrode of the light emitting element and the electrodes 8 a and 8 b provided on the package 1 are electrically connected using a conductive wire 9.
- FIG. 1b is a schematic enlarged view in which a part of FIG. 1a is enlarged.
- the metal adhesive 31 has a greater wettability with respect to the frame part 4 than the wettability with respect to the package 1, and the metal adhesive 31 tends to spread along the frame part 4 as shown in FIG.
- the frame portion 4 has a shape extending from the bonding portion of the frame portion 4 and the package 1 to the recess portion of the package 1, and a step 6 is formed in the recess portion of the package 1 between the bonding portion and the electrode 8 a of the package 1.
- the step may be one step or two or more steps.
- excess adhesive can be accumulated in steps, a sufficient amount of adhesive can be used, and a light-emitting device in which the package and the cap are firmly bonded can be obtained with high manufacturing yield.
- the frame portion 4 of the cap 3 preferably has a shape protruding along the step 6 as shown in FIG.
- the metal adhesive 31 can be efficiently introduce
- FIG. 1a by adjusting the space
- the frame 4 and the side wall 7 of the recess may be bonded by the metal adhesive 31. With such a configuration, the bonding area between the cap 3 and the package 1 can be increased, and the adhesion can be improved.
- the step 6 refers to a protrusion that protrudes toward the center of the recess from the side wall 7 of the recess that is continuous from the bonding portion.
- the upper surface of the step 6 is preferably substantially parallel to the back surface of the package 1 or inclined to the side wall 7 side of the recess, so that the outflow of the metal adhesive 31 can be suppressed.
- the surface on the concave side of the cap 3 is a substantially flat surface as in the light emitting device shown in FIG. 1 a, it is preferable that the surface substantially parallel to this surface be the upper surface of the step 6.
- the upper surface of the step 6 and the cap 3 are preferably separated from each other. For the same reason, when the cap 3 has a shape protruding into the recess, the outer diameter of the protrusion of the cap 3 is preferably smaller than the inner diameter of the side wall 7 of the recess.
- the frame portion 4 is bent along the step 6 and the surface along the side wall 7 of the recess is disposed on the step 6.
- the frame part 4 is provided along the protrusion part of the cap 3, it is preferable to provide the surface by the side of the recessed part of the frame part 4 above the level
- the metal adhesive 31 introduced into the recess by the highly wettable frame portion 4 can be easily stopped by the step 6.
- the frame part 4 does not extend to the surface along the upper surface of the step 6 of the cap 3, and the terminal end of the frame part 4 can be arranged on the surface along the side wall 7 of the corner or the recess.
- the frame portion 4 has a shape extending to a surface along the upper surface of the step 6.
- FIG. 2 An example of a schematic front view of the light emitting device of this embodiment is shown in FIG.
- the light emitting device shown in FIG. 2 four light emitting elements 3 are mounted on the bottom surface of the recess of the package 1, and the electrodes 8b of the package 1 to which the elements are connected are separated from each other.
- the translucent member 5 is omitted for explanation.
- the light-emitting element 3 shown here is an element having a counter electrode structure, and an upper surface is an n-electrode and a lower surface is a p-electrode.
- the p-electrode of the light-emitting element 3 is electrically connected to the electrode 8b provided on the bottom surface of the recess through a conductive adhesive, and the n-electrode of the light-emitting element 3 is connected to the bottom surface of the recess as shown in FIG. It is electrically connected to the electrode 8a provided on the upper stage via a conductive wire 9.
- the electrodes 8a and 8b of the package 1 are connected to a back electrode provided on the back surface of the package via the inside or the outer wall of the package, and solder or the like is used so that the back electrode is electrically connected to the circuit board. It is fixed using.
- the four light emitting elements are connected in series.
- a protective element 10 may be provided on the electrodes 8a and 8b.
- the method for manufacturing a light emitting device of the present invention includes a step of bonding the package 1 and the frame portion 4 with a metal adhesive 31.
- the material of the metal adhesive 31 that bonds the frame 4 and the package 1 include AuSn alloy, high melting point solder, and Ag solder. Considering the temperature at the time of bonding, it is preferable to use an AuSn alloy that can be melted and bonded at a relatively low temperature.
- the metal adhesive 31 for example, a paste-like material or a solid material previously formed on the frame portion 4 can be used.
- An example of the translucent member 5 is translucent glass.
- a method of bonding by partially providing the metal adhesive 31 and extending it along the frame part 4 can be employed.
- the metal adhesive 31 is stretched along the frame part 4 and bonded in this way, the metal adhesive 31 easily flows outside the frame part 4 or inside the recess.
- the metal adhesive 31 can be stopped before the electrode 8a of the package 1.
- FIG. 3 is a schematic front view for explaining the method for manufacturing the light emitting device of the present embodiment.
- a metal member 20 for bonding is formed as a metal adhesive.
- the bonding metal member 20 is a member formed between the frame portion 4 and the package 1 and thus cannot be confirmed from the upper surface.
- the formation position of the bonding metal member 20 is schematically illustrated for explanation. It shows.
- the metal member 20 for bonding is preferably formed on the frame portion 4 having high wettability.
- the metal member 20 for bonding is preferably formed at a position where the frame portion 4 faces, and when the shape of the frame portion 4 in a plan view is rectangular as shown in FIG. 3, it is formed at two opposite sides. Is preferred. In particular, by forming up to the corner with the adjacent side, it is possible to make the shape easy to extend to the adjacent side. In order to uniformly extend the metal adhesive, it is preferable that the shape of the frame portion 4 in plan view is a square.
- the metal adhesive 31 after bonding is partially provided on the frame portion 4, that is, a light emitting device having a gap serving as a vent hole between the metal adhesive 31 and the metal adhesive 31. It is preferable. If the metal adhesive 31 is formed on the entire circumference of the frame portion 4 to be hermetically sealed for airtightness, the metal 1 is not sufficiently bonded due to the unevenness of the surface of the package 1 and is not airtight. This is because the manufacturing yield deteriorates. By providing the metal adhesive 31 partially, a non-hermetic light-emitting device can be manufactured stably and the yield can be improved.
- the metal adhesive 31 melted and bonded can have a film thickness of about several ⁇ m to several tens of ⁇ m, it is possible to form a void that is difficult for foreign matter to enter.
- the gas or the like in the package recess may be altered or decomposed due to the influence of ultraviolet light. By providing such a gap, gas or the like is removed from the light-emitting device. Therefore, a highly reliable light-emitting device can be obtained.
- the gap is preferably provided in the joint portions 30a and 30b in which the end portions of the metal adhesive 31 are joined.
- the metal adhesive 31 shown in FIG. 4a is formed.
- FIG. 4A is a schematic front view for explaining the method for manufacturing the light-emitting device of the present embodiment.
- the metal adhesive 31 is a member formed between the frame 4 and the package 1 and cannot be confirmed from the upper surface
- FIG. 4a schematically shows the formation position of the metal adhesive 31 for the sake of explanation. Yes.
- the metal member is preferably made of a metal material.
- FIG. 4b is a schematic enlarged view of the joint 30b in FIG. 4a observed from the right direction in the drawing.
- Such voids are melted at a temperature at which the metal member that becomes the metal adhesive extends along the frame part 4 and does not join the metal adhesives 31, and extends along the frame part 4. Can be formed by bonding.
- the temperature is preferably about 200 to 330.degree. Moreover, since it is lower than the growth temperature of the semiconductor layer which comprises the light emitting element 2 if it is such a temperature range, the bad influence to the light emitting element 2 can be suppressed.
- the gap formed in the joint portions 30a and 30b between the metal adhesives 31 is the metal adhesive 31 in the thickness direction of the metal adhesive 31 (the distance between the package and the frame portion via the metal adhesive 31). It is preferable that the height is smaller than the thickness.
- the gap preferably has a maximum width of about several ⁇ m to several tens of ⁇ m as described above on the frame side or the package side (preferably the package side).
- the package 1 is selected from materials whose wettability of the metal adhesive 31 is smaller than that of the frame portion 4.
- ceramic can be used, and specifically, AlN, Al 2 O 3 and the like can be mentioned. Ceramic is excellent in resistance to ultraviolet rays, and is preferable when an ultraviolet light emitting element is used as the light emitting element 2.
- the package 1 can also promote the extending
- the recessed part of the package 1 should just ensure the area
- FIG. 5 is a schematic cross-sectional view showing another example of the light-emitting device of the present embodiment, in which conductive wires 9 are respectively connected to an n-electrode and a p-electrode disposed on one main surface of the light-emitting element 2. The other end of the conductive wire 9 is connected to the electrodes 8a and 8b of the package.
- the light emitting element 2 is a semiconductor light emitting element that can be used as a light emitting diode (LED) or a laser diode (LD).
- a light-emitting element that emits ultraviolet light can also be used.
- a light emitting element that emits ultraviolet light if an organic material such as a resin is used as an adhesive, the organic substance is decomposed by the ultraviolet light and adheres to the light emitting element. In this embodiment, a metal adhesive is used. This can be prevented.
- the cap 3 has at least a frame portion 4, and further has a translucent member 5 fitted into the frame portion 4.
- the shape of the frame 4 in plan view can be selected from a rectangle, a circle, and an ellipse, and is preferably a square as described above.
- the material of the frame portion 4 is preferably selected so that the wettability of the metal adhesive is greater than the wettability of the metal adhesive with respect to the package 1, and at least the surface is made of metal.
- Kovar can be employed, and the surface may be plated with Au in order to improve the adhesion to the metal adhesive.
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Abstract
Description
前記枠部は、前記パッケージとの接着部から前記パッケージの凹部の内側まで延在しており、前記パッケージは、その凹部内に、前記発光素子が接続された電極を有し、前記キャップが接着された接着部と前記電極との間に段差が設けられている。
前記枠部は、その上面視形状が矩形であり、前記接着工程において、前記金属接着剤を前記枠部の対向する2辺に形成し、前記金属接着剤を前記周縁部の対向辺から該対向辺と隣接する辺へ延伸させて接着する。
前記枠部は金属部材である。
前記発光素子は、紫外線を発光する発光素子である。
前記枠部は、前記段差に沿って突出した形状である。
前記枠部は、前記段差の上に前記凹部側の面を有する。
前記接着工程において、前記金属接着剤を延伸させて接合させ、前記金属接着剤が接合された接合部に空隙を有する。
前記枠部は、その上面視形状が矩形であり、前記接着工程において、前記金属接着剤を前記枠部の対向する2辺に形成し、前記金属接着剤を前記周縁部の対向辺から該対向辺と隣接する辺へ延伸させて接着する。
前記枠部は金属部材である。
前記枠部は、前記段差に沿って突出した形状である。
前記枠部は、前記段差の上に前記凹部側の面を有する。
前記枠部は金属部材である。
前記発光素子は、紫外線を発光する発光素子である。
また、本発明の発光装置によれば、キャップの枠部をパッケージの凹部内に延伸させ、枠部に対する濡れ性大の金属接着剤を用いることで、金属接着剤をパッケージ凹部内方向へ導入すると共に、凹部内の段差によって、金属接着剤をパッケージの電極の手前で止めることができる。よって、短絡を防止することができる。また、金属接着剤をパッケージの凹部内に導入するので、金属接着剤のパッケージ外への漏出を抑制できる。
図1aに、本発明の実施の形態に係る発光装置を示す。発光装置は、パッケージ1と、パッケージ1の凹部内に実装された発光素子2と、パッケージの凹部の開口を塞ぐキャップ3とを有する。パッケージ1の内部には、発光素子2を載置可能な凹部が形成されており、発光素子2は、凹部底面に接合部材を用いてそれぞれ固定されている。発光素子の電極とパッケージ1に設けられた電極8a、8bとは、導電性ワイヤ9を用いて電気的に接続されている。
本発明の発光装置の製造方法は、パッケージ1と枠部4とを金属接着剤31によって接着する工程を含む。
枠部4とパッケージ1を接着する金属接着剤31の材料の一例としては、AuSn合金、高融点半田、Agロウが挙げられる。接着時の温度を考慮すると、比較的低温で溶融して接着できるAuSn合金を用いることが好ましい。金属接着剤31は、例えば、ペースト状のものや、予め枠部4に形成された固体状のものを用いることができる。透光性部材5としては透光性ガラスが挙げられる。
接着方法としては、金属接着剤31を部分的に設けて枠部4に沿って延伸させることによって接着する方法を採用することができる。このように金属接着剤31を枠部4に沿って延伸させて接着する方法を用いると、金属接着剤31が枠部4の外や凹部の内側に流れ易いが、本実施の形態の段差6を有するパッケージ1とすることで、パッケージ1の電極8aの手前で金属接着剤31を止めることができる。
このような空隙は、金属接着剤になる金属部材が枠部4に沿って延伸する温度であって且つ金属接着剤31同士が接合しない程度の温度で溶融させ、枠部4に沿って延伸させて接着することで形成できる。例えば、金属接着剤31がAuSn合金である場合は200~330℃程度とすることが好ましい。また、このような温度範囲であれば、発光素子2を構成する半導体層の成長温度よりも低温であるので、発光素子2への悪影響を抑制することができる。
なお、金属接着剤31同士の接合部30a、30bに形成される空隙は、金属接着剤31の厚み方向(パッケージと枠部との金属接着剤31を介した距離)においては、金属接着剤31の厚みよりも小さい高さとすることが好ましい。また、空隙は、例えば、枠部側又はパッケージ側(好ましくはパッケージ側)において、最大幅が上述したような数μm~数十μm程度とすることが好ましい。
以下、本願の各構成について説明する。
パッケージ1は、金属接着剤31の濡れ性が枠部4より小さい材料から選択する。例えばセラミックが採用でき、具体的にはAlN、Al2O3等があげられる。セラミックは紫外線に対する耐性に優れており、発光素子2として紫外発光の素子を用いる場合に好ましい。パッケージ1は、金属接着剤31が形成される位置にAu等の金属めっきを施し、金属接着剤31の延伸を促進させることもできる。この場合、金属接着剤31のパッケージ外への漏出を抑制するために、金属めっきはキャップ3によって完全に被覆される位置に形成することが好ましい。パッケージ1の凹部は、発光素子2が載置可能な領域を確保できればよい。また、ツェナーダイオードなどの保護素子10を設ける場合は、それらの載置領域も確保できるようにする。
発光素子2は、発光ダイオード(LED)、又はレーザダイオード(LD)として用いることが可能な半導体発光素子である。紫外線を発光する発光素子を用いることもできる。紫外発光の発光素子を用いる場合、接着剤として樹脂等の有機物を含有する部材を用いると、紫外線により有機物が分解されて発光素子に付着してしまうが、本実施の形態では金属接着剤を使用しているので、これを防止することができる。
キャップ3は、少なくとも枠部4を有し、さらには枠部4に嵌め込まれた透光性部材5を有する。
枠部4の平面視形状は、矩形、円形、楕円形を選択することができ、好ましくは上述のように正方形とする。枠部4の材料としては、金属接着剤の濡れ性が金属接着剤のパッケージ1に対する濡れ性よりも大きいものから選択され、少なくとも表面が金属からなるものが好ましい。具体的にはコバールを採用することができ、金属接着剤との密着性を向上するために表面をAuめっきしてもよい。
2 発光素子
3 キャップ
4 枠部
5 透光性部材
6 段差
7 凹部の側壁
8a、8b パッケージの電極
9 導電性ワイヤ
10 保護素子
20 接着用の金属部材
30a、30b 接合部
31 金属接着剤
32 空隙
41 パッケージ
42 発光素子
43 光色変換部材
44 パッケージ
45 半導体発光素子
46 導電性部材
47 導電性ワイヤ
48 透光性部材
49 金属キャップ
50 メッキ
Claims (16)
- 凹部内に発光素子が実装されたパッケージに、枠部を備えたキャップを前記凹部の開口部を覆うように接着する接着工程を有し、
前記接着工程において、前記パッケージ又は前記枠部に、前記枠部に対する濡れ性が前記パッケージに対する濡れ性よりも大きい金属接着剤を部分的に形成し、前記金属接着剤を、前記枠部に沿って延伸させて接合させることで、前記金属接着剤が接合された接合部に空隙を形成し、前記パッケージと前記枠部とを接着する発光装置の製造方法。 - 前記枠部は、前記パッケージとの接着部から前記パッケージの凹部の内側まで延在しており、
前記パッケージは、その凹部内に、前記発光素子が接続された電極を有し、前記キャップが接着された接着部と前記電極との間に段差が設けられている請求項1に記載の発光装置の製造方法。 - 前記枠部は、その上面視形状が矩形であり、
前記接着工程において、前記金属接着剤を前記枠部の対向する2辺に形成し、前記金属接着剤を前記周縁部の対向辺から該対向辺と隣接する辺へ延伸させて接着する請求項1又は2に記載の発光装置の製造方法。 - 前記枠部は金属部材である請求項1~3のいずれか1項に記載の発光装置の製造方法。
- 前記発光素子は、紫外線を発光する発光素子である請求項1~4のいずれか1項に記載の発光装置の製造方法。
- 前記枠部は、前記段差に沿って突出した形状である請求項2に記載の発光装置の製造方法。
- 前記枠部は、前記段差の上に前記凹部側の面を有する請求項6に記載の発光装置の製造方法。
- 凹部内に発光素子が実装されたパッケージに、前記凹部の開口部を覆うキャップを接着する接着工程を有し、
前記キャップは、その周辺部に、前記パッケージと接着され、前記パッケージとの接着部から前記パッケージの凹部の内側まで延在する枠部を備え、
前記パッケージは、その凹部内に、前記発光素子が接続された電極を有し、前記キャップが接着された接着部と前記電極との間に段差が設けられており、
前記接着工程において、前記パッケージ又は前記枠部に、前記枠部に対する濡れ性が前記パッケージに対する濡れ性よりも大きい金属接着剤を部分的に形成し、前記金属接着剤を、前記枠部に沿って延伸させて前記パッケージと前記枠部とを接着する発光装置の製造方法。 - 前記接着工程において、前記金属接着剤を延伸させて接合させ、前記金属接着剤が接合された接合部に空隙を有する請求項8記載の発光装置の製造方法。
- 前記枠部は、その上面視形状が矩形であり、
前記接着工程において、前記金属接着剤を前記枠部の対向する2辺に形成し、前記金属接着剤を前記周縁部の対向辺から該対向辺と隣接する辺へ延伸させて接着する請求項8又は9に記載の発光装置の製造方法。 - 前記枠部は金属部材である請求項8~10のいずれか1項に記載の発光装置。
- 凹部を有するパッケージと、前記凹部内に実装された発光素子と、前記凹部の開口部を覆って接着されたキャップと、を具備し、
前記キャップは、その周辺部に、前記パッケージと接着され、前記パッケージとの接着部から前記パッケージの凹部の内側まで延在する枠部を備え、
前記枠部と前記パッケージは、前記枠部に対する濡れ性が前記パッケージに対する濡れ性よりも大きい金属接着剤を介して接着されており、
前記パッケージは、その凹部内に、前記発光素子が電気的に接続された電極を有し、前記キャップが接着された接着部と前記電極との間に段差を有する発光装置。 - 前記枠部は、前記段差に沿って突出した形状である請求項12に記載の発光装置。
- 前記枠部は、前記段差の上に前記凹部側の面を有する請求項13に記載の発光装置。
- 前記枠部は金属部材である請求項12~14のいずれか1項に記載の発光装置。
- 前記発光素子は、紫外線を発光する発光素子である請求項12~15のいずれか1項に記載の発光装置。
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WO2012168031A1 (en) * | 2011-06-07 | 2012-12-13 | Osram Ag | Encapsulation housing and led module with the same |
US9343632B2 (en) | 2011-06-07 | 2016-05-17 | Osram Gmbh | Encapsulation housing and LED module with the same |
US9893259B2 (en) | 2012-08-09 | 2018-02-13 | Lg Innotek Co., Ltd. | Light emitting package |
JP2014036226A (ja) * | 2012-08-09 | 2014-02-24 | Lg Innotek Co Ltd | 発光パッケージ |
US10388841B2 (en) | 2012-08-09 | 2019-08-20 | Lg Innotek Co., Ltd. | Light emitting package |
KR102114931B1 (ko) | 2012-12-18 | 2020-05-25 | 엘지이노텍 주식회사 | 발광소자 패키지 |
KR20140078823A (ko) * | 2012-12-18 | 2014-06-26 | 엘지이노텍 주식회사 | 발광소자 패키지 |
JP2015057826A (ja) * | 2013-09-16 | 2015-03-26 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
US9746160B2 (en) | 2015-07-28 | 2017-08-29 | Nichia Corporation | Light emitting device and method of manufacturing light emitting device |
JP2018006477A (ja) * | 2016-06-29 | 2018-01-11 | セイコーエプソン株式会社 | 光源装置およびプロジェクター |
JP2018056263A (ja) * | 2016-09-28 | 2018-04-05 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
JP2019184644A (ja) * | 2018-04-02 | 2019-10-24 | 日本特殊陶業株式会社 | 光波長変換部材及び発光装置 |
JP7115888B2 (ja) | 2018-04-02 | 2022-08-09 | 日本特殊陶業株式会社 | 光波長変換部材及び発光装置 |
JP2020053617A (ja) * | 2018-09-28 | 2020-04-02 | 日亜化学工業株式会社 | 発光装置 |
JP7054005B2 (ja) | 2018-09-28 | 2022-04-13 | 日亜化学工業株式会社 | 発光装置 |
US11476638B2 (en) | 2019-01-22 | 2022-10-18 | Nichia Corporation | Light emitting device |
US11984698B2 (en) | 2019-01-22 | 2024-05-14 | Nichia Corporation | Light emitting device |
JP7569622B2 (ja) | 2019-11-21 | 2024-10-18 | 浜松ホトニクス株式会社 | ミラーユニット |
JP7553830B2 (ja) | 2022-04-19 | 2024-09-19 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
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RU2510103C2 (ru) | 2014-03-20 |
US20130344631A1 (en) | 2013-12-26 |
KR101716919B1 (ko) | 2017-03-15 |
JP5522172B2 (ja) | 2014-06-18 |
EP2461378B1 (en) | 2018-03-21 |
TWI513047B (zh) | 2015-12-11 |
RU2012107386A (ru) | 2013-09-10 |
EP2461378A1 (en) | 2012-06-06 |
CN102473813A (zh) | 2012-05-23 |
US20120091500A1 (en) | 2012-04-19 |
KR20120052370A (ko) | 2012-05-23 |
CN102473813B (zh) | 2015-02-04 |
TW201117429A (en) | 2011-05-16 |
JPWO2011013581A1 (ja) | 2013-01-07 |
US8546841B2 (en) | 2013-10-01 |
US8703511B2 (en) | 2014-04-22 |
EP2461378A4 (en) | 2014-03-19 |
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