JP6331192B2 - 接着剤を基材上に吐出するデバイス - Google Patents

接着剤を基材上に吐出するデバイス Download PDF

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Publication number
JP6331192B2
JP6331192B2 JP2014079241A JP2014079241A JP6331192B2 JP 6331192 B2 JP6331192 B2 JP 6331192B2 JP 2014079241 A JP2014079241 A JP 2014079241A JP 2014079241 A JP2014079241 A JP 2014079241A JP 6331192 B2 JP6331192 B2 JP 6331192B2
Authority
JP
Japan
Prior art keywords
discharge nozzle
substrate
tip
fixed
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014079241A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014205140A (ja
JP2014205140A5 (enExample
Inventor
リュディ グロイター
リュディ グロイター
クリストフ コスター
クリストフ コスター
パウル アンドレアス スタッドラー
パウル アンドレアス スタッドラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of JP2014205140A publication Critical patent/JP2014205140A/ja
Publication of JP2014205140A5 publication Critical patent/JP2014205140A5/ja
Application granted granted Critical
Publication of JP6331192B2 publication Critical patent/JP6331192B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0295—Floating coating heads or nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2014079241A 2013-04-15 2014-04-08 接着剤を基材上に吐出するデバイス Expired - Fee Related JP6331192B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00777/13A CH707890B1 (de) 2013-04-15 2013-04-15 Vorrichtung zum Auftragen von Klebstoff auf ein Substrat.
CH00777/13 2013-04-15

Publications (3)

Publication Number Publication Date
JP2014205140A JP2014205140A (ja) 2014-10-30
JP2014205140A5 JP2014205140A5 (enExample) 2017-03-30
JP6331192B2 true JP6331192B2 (ja) 2018-05-30

Family

ID=51618518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014079241A Expired - Fee Related JP6331192B2 (ja) 2013-04-15 2014-04-08 接着剤を基材上に吐出するデバイス

Country Status (10)

Country Link
US (1) US9233389B2 (enExample)
JP (1) JP6331192B2 (enExample)
KR (1) KR20140123910A (enExample)
CN (1) CN104107781B (enExample)
CH (1) CH707890B1 (enExample)
DE (1) DE102014103822A1 (enExample)
FR (1) FR3004363B1 (enExample)
MY (1) MY172008A (enExample)
SG (1) SG10201400757VA (enExample)
TW (1) TWI610334B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105478299A (zh) * 2015-12-24 2016-04-13 深圳市轴心自控技术有限公司 点胶装置及具有该点胶装置的点胶机
NL2016164B1 (en) * 2016-01-27 2017-08-01 Ultimaker Bv Nozzle lifting assembly.
US10083896B1 (en) * 2017-03-27 2018-09-25 Texas Instruments Incorporated Methods and apparatus for a semiconductor device having bi-material die attach layer
US11343949B2 (en) * 2018-03-13 2022-05-24 Asm Technology Singapore Pte Ltd Apparatus and method for dispensing a viscous adhesive
US20200035512A1 (en) * 2018-07-24 2020-01-30 Illinois Tool Works Inc. Method of transitioning from synchronous to asynchronous dispensing
US11684947B2 (en) * 2018-11-09 2023-06-27 Illinois Tool Works Inc. Modular fluid application device for varying fluid coat weight
US11289445B2 (en) * 2018-12-24 2022-03-29 Asm Technology Singapore Pte Ltd Die bonder incorporating rotatable adhesive dispenser head
CN113262943A (zh) * 2021-05-25 2021-08-17 延锋伟世通汽车电子有限公司 自动涂覆装置
WO2023073746A1 (ja) * 2021-10-25 2023-05-04 スターテクノ株式会社 塗布装置及びその塗布装置によって製造された組部材

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584571A (en) * 1967-08-25 1971-06-15 Pannier Corp The Character generation marking device
US3810779A (en) * 1971-06-07 1974-05-14 Bio Medical Sciences Inc Method and apparatus for depositing precisely metered quantities of liquid on a surface
JPS62180774A (ja) * 1986-01-31 1987-08-08 Mitsubishi Heavy Ind Ltd 塗工装置
US4715112A (en) * 1986-12-10 1987-12-29 Amp Incorporated Pick-up head
JPH0466157A (ja) * 1990-07-05 1992-03-02 Toray Eng Co Ltd 液体供給装置
JPH05185004A (ja) * 1992-01-17 1993-07-27 Toshiba Corp 接着剤塗布装置
JPH0629664U (ja) * 1992-09-21 1994-04-19 石川島播磨重工業株式会社 塗工装置
JPH06106118A (ja) * 1992-09-29 1994-04-19 Sanyo Electric Co Ltd 塗布装置
GB9312704D0 (en) * 1993-06-19 1993-08-04 Molins Plc Cigarette making machine
JPH07163927A (ja) * 1993-12-10 1995-06-27 Three Bond Co Ltd ディスペンサ及びこれを備えた自動塗布装置
EP0901155B1 (de) 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
JP4104730B2 (ja) * 1998-04-07 2008-06-18 松下電器産業株式会社 ボンド塗布装置
US20030044534A1 (en) 2001-09-06 2003-03-06 Lau Siu Wing Multi-pin epoxy writing apparatus
DE10201120A1 (de) * 2002-01-15 2003-07-31 Bosch Gmbh Robert Vorrichtung zum Aufbringen eines Mediums an einer Aufbringposition auf einem Substrat
EP1432013A1 (de) 2002-12-18 2004-06-23 Esec Trading S.A. Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf ein Substrat
JP4501382B2 (ja) * 2003-09-11 2010-07-14 株式会社豊田自動織機 デフォッガー線塗布装置
JP2005129668A (ja) * 2003-10-23 2005-05-19 Ricoh Co Ltd 接着剤塗布ノズル及び接着剤塗布装置
DE102006038973A1 (de) * 2006-08-21 2008-03-20 Hauni Maschinenbau Ag Papierbeleimung bei der Strangherstellung
JP4750056B2 (ja) * 2007-02-22 2011-08-17 日立アロカメディカル株式会社 ノズル駆動装置
KR20100119880A (ko) * 2008-02-08 2010-11-11 샌트랄 글래스 컴퍼니 리미티드 도포액의 도포장치 및 도포방법
US7977231B1 (en) 2010-11-08 2011-07-12 Asm Assembly Automation Ltd Die bonder incorporating dual-head dispenser
CH705475B1 (de) 2011-09-09 2015-04-30 Esec Ag Verfahren zum Auftragen von Klebstoff auf ein Substrat.

Also Published As

Publication number Publication date
CH707890B1 (de) 2017-12-15
MY172008A (en) 2019-11-11
US20140305372A1 (en) 2014-10-16
JP2014205140A (ja) 2014-10-30
SG10201400757VA (en) 2014-11-27
US9233389B2 (en) 2016-01-12
CH707890A1 (de) 2014-10-15
CN104107781B (zh) 2017-12-19
TW201503224A (zh) 2015-01-16
KR20140123910A (ko) 2014-10-23
TWI610334B (zh) 2018-01-01
DE102014103822A1 (de) 2014-10-16
CN104107781A (zh) 2014-10-22
FR3004363A1 (fr) 2014-10-17
FR3004363B1 (fr) 2019-05-03

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