KR20140123910A - 접착제를 기판상에 분배하기 위한 장치 - Google Patents

접착제를 기판상에 분배하기 위한 장치 Download PDF

Info

Publication number
KR20140123910A
KR20140123910A KR1020140043602A KR20140043602A KR20140123910A KR 20140123910 A KR20140123910 A KR 20140123910A KR 1020140043602 A KR1020140043602 A KR 1020140043602A KR 20140043602 A KR20140043602 A KR 20140043602A KR 20140123910 A KR20140123910 A KR 20140123910A
Authority
KR
South Korea
Prior art keywords
substrate
nozzle
recording head
tip
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020140043602A
Other languages
English (en)
Korean (ko)
Inventor
뤼디 그뤼터
크리스토프 코스터
파울 안드레아스 슈타들러
Original Assignee
베시 스위처랜드 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베시 스위처랜드 아게 filed Critical 베시 스위처랜드 아게
Publication of KR20140123910A publication Critical patent/KR20140123910A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0295—Floating coating heads or nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020140043602A 2013-04-15 2014-04-11 접착제를 기판상에 분배하기 위한 장치 Ceased KR20140123910A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00777/13A CH707890B1 (de) 2013-04-15 2013-04-15 Vorrichtung zum Auftragen von Klebstoff auf ein Substrat.
CH00777/13 2013-04-15

Publications (1)

Publication Number Publication Date
KR20140123910A true KR20140123910A (ko) 2014-10-23

Family

ID=51618518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140043602A Ceased KR20140123910A (ko) 2013-04-15 2014-04-11 접착제를 기판상에 분배하기 위한 장치

Country Status (10)

Country Link
US (1) US9233389B2 (enExample)
JP (1) JP6331192B2 (enExample)
KR (1) KR20140123910A (enExample)
CN (1) CN104107781B (enExample)
CH (1) CH707890B1 (enExample)
DE (1) DE102014103822A1 (enExample)
FR (1) FR3004363B1 (enExample)
MY (1) MY172008A (enExample)
SG (1) SG10201400757VA (enExample)
TW (1) TWI610334B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105478299A (zh) * 2015-12-24 2016-04-13 深圳市轴心自控技术有限公司 点胶装置及具有该点胶装置的点胶机
NL2016164B1 (en) * 2016-01-27 2017-08-01 Ultimaker Bv Nozzle lifting assembly.
US10083896B1 (en) 2017-03-27 2018-09-25 Texas Instruments Incorporated Methods and apparatus for a semiconductor device having bi-material die attach layer
US11343949B2 (en) * 2018-03-13 2022-05-24 Asm Technology Singapore Pte Ltd Apparatus and method for dispensing a viscous adhesive
US20200035512A1 (en) * 2018-07-24 2020-01-30 Illinois Tool Works Inc. Method of transitioning from synchronous to asynchronous dispensing
WO2020097354A2 (en) * 2018-11-09 2020-05-14 Illinois Tool Works Inc. Modular fluid application device for varying fluid coat weight
US11289445B2 (en) * 2018-12-24 2022-03-29 Asm Technology Singapore Pte Ltd Die bonder incorporating rotatable adhesive dispenser head
CN113262943A (zh) * 2021-05-25 2021-08-17 延锋伟世通汽车电子有限公司 自动涂覆装置
JP7281839B1 (ja) * 2021-10-25 2023-05-26 スターテクノ株式会社 塗布装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584571A (en) * 1967-08-25 1971-06-15 Pannier Corp The Character generation marking device
US3810779A (en) * 1971-06-07 1974-05-14 Bio Medical Sciences Inc Method and apparatus for depositing precisely metered quantities of liquid on a surface
JPS62180774A (ja) * 1986-01-31 1987-08-08 Mitsubishi Heavy Ind Ltd 塗工装置
US4715112A (en) * 1986-12-10 1987-12-29 Amp Incorporated Pick-up head
JPH0466157A (ja) * 1990-07-05 1992-03-02 Toray Eng Co Ltd 液体供給装置
JPH05185004A (ja) * 1992-01-17 1993-07-27 Toshiba Corp 接着剤塗布装置
JPH0629664U (ja) * 1992-09-21 1994-04-19 石川島播磨重工業株式会社 塗工装置
JPH06106118A (ja) * 1992-09-29 1994-04-19 Sanyo Electric Co Ltd 塗布装置
GB9312704D0 (en) * 1993-06-19 1993-08-04 Molins Plc Cigarette making machine
JPH07163927A (ja) * 1993-12-10 1995-06-27 Three Bond Co Ltd ディスペンサ及びこれを備えた自動塗布装置
EP0901155B1 (de) 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
JP4104730B2 (ja) * 1998-04-07 2008-06-18 松下電器産業株式会社 ボンド塗布装置
US20030044534A1 (en) 2001-09-06 2003-03-06 Lau Siu Wing Multi-pin epoxy writing apparatus
DE10201120A1 (de) * 2002-01-15 2003-07-31 Bosch Gmbh Robert Vorrichtung zum Aufbringen eines Mediums an einer Aufbringposition auf einem Substrat
EP1432013A1 (de) 2002-12-18 2004-06-23 Esec Trading S.A. Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf ein Substrat
JP4501382B2 (ja) * 2003-09-11 2010-07-14 株式会社豊田自動織機 デフォッガー線塗布装置
JP2005129668A (ja) * 2003-10-23 2005-05-19 Ricoh Co Ltd 接着剤塗布ノズル及び接着剤塗布装置
DE102006038973A1 (de) * 2006-08-21 2008-03-20 Hauni Maschinenbau Ag Papierbeleimung bei der Strangherstellung
JP4750056B2 (ja) * 2007-02-22 2011-08-17 日立アロカメディカル株式会社 ノズル駆動装置
CN101939114A (zh) * 2008-02-08 2011-01-05 中央硝子株式会社 涂布液的涂布装置及涂布方法
US7977231B1 (en) 2010-11-08 2011-07-12 Asm Assembly Automation Ltd Die bonder incorporating dual-head dispenser
CH705475B1 (de) 2011-09-09 2015-04-30 Esec Ag Verfahren zum Auftragen von Klebstoff auf ein Substrat.

Also Published As

Publication number Publication date
TW201503224A (zh) 2015-01-16
TWI610334B (zh) 2018-01-01
CH707890B1 (de) 2017-12-15
CH707890A1 (de) 2014-10-15
JP2014205140A (ja) 2014-10-30
CN104107781A (zh) 2014-10-22
FR3004363A1 (fr) 2014-10-17
JP6331192B2 (ja) 2018-05-30
FR3004363B1 (fr) 2019-05-03
DE102014103822A1 (de) 2014-10-16
US9233389B2 (en) 2016-01-12
CN104107781B (zh) 2017-12-19
US20140305372A1 (en) 2014-10-16
MY172008A (en) 2019-11-11
SG10201400757VA (en) 2014-11-27

Similar Documents

Publication Publication Date Title
KR20140123910A (ko) 접착제를 기판상에 분배하기 위한 장치
US10549306B2 (en) Methods and devices for jetting viscous medium on workpieces
EP3557968B1 (en) Method and apparatus for automatically adjusting dispensing units of a dispenser
CN105188957B (zh) 用于将粘性介质喷射在工件上的方法和装置
EP1134034B1 (en) Method of forming paste
TWI298650B (en) Method of noncontact dispensing of viscous material
US9398697B2 (en) Methods and devices for jetting viscous medium on workpiece
US20180071771A1 (en) Detaching apparatus and detaching method
CN104185379A (zh) 印刷基板用作业装置
HK1197588A (en) Device for dispensing adhesive on a substrate
HK1197588B (en) Device for dispensing adhesive on a substrate
KR100548652B1 (ko) 에어프레셔 타입의 고속 디스펜서헤드
CN112334236B (zh) 液剂供给装置以及液剂供给方法
TW201607613A (zh) 液體材料滴下裝置及方法
JP4104730B2 (ja) ボンド塗布装置
JP2007245033A (ja) ペースト塗布設備
US20160031029A1 (en) Methods and devices for jetting viscous medium on workpiece
JP4502620B2 (ja) 表示パネル封止装置
JP2826506B2 (ja) ダイマウント方法およびその装置
JP3237904U (ja) インクジェット方式による半田印刷装置
JP2015039668A (ja) 塗布装置および塗布ヘッドのクリーニング方法
JP3244018B2 (ja) ダイボンディング装置
KR101366672B1 (ko) 반도체 칩 다이 본딩 방법 및 반도체 칩 다이 본딩 장치
JP2012146980A (ja) 電界放出ディスプレー用のスペーサー自動実装システム及びスペーサー自動実装方法
CN210610224U (zh) 一种用于贴片机移动贴装头

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000