JP6331192B2 - 接着剤を基材上に吐出するデバイス - Google Patents
接着剤を基材上に吐出するデバイス Download PDFInfo
- Publication number
- JP6331192B2 JP6331192B2 JP2014079241A JP2014079241A JP6331192B2 JP 6331192 B2 JP6331192 B2 JP 6331192B2 JP 2014079241 A JP2014079241 A JP 2014079241A JP 2014079241 A JP2014079241 A JP 2014079241A JP 6331192 B2 JP6331192 B2 JP 6331192B2
- Authority
- JP
- Japan
- Prior art keywords
- discharge nozzle
- substrate
- tip
- fixed
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
- B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
- B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0295—Floating coating heads or nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
−書き込みヘッドを持ち上げるステップ;
−ピンを伸張又は後退させるステップ、及び
−書き込みヘッドを所定の動作高さまで下降させるステップであって、ピンが後退した状態では、吐出ノズルの先端部は基材上の実質的に同様の高さに達し、ピンが伸張した状態では、少なくとも1つの第2の吐出ノズルの先端部は、基材上の、第1の吐出ノズルの先端部よりも高い高さに達する、下降させるステップ
を行うように設定される。
−ピン22は後退位置に移動し;
−書き込みヘッドは所定のZ位置z 2 に下降し、z 2 <z1であり、z 2 は、基材上の吐出ノズル4及び6の先端部の所望の動作高さに相当し;
又はモード2では、
−ピン22は伸張位置に移動し;
−書き込みヘッド1は所定のZ位置z 2 に下降する。
Claims (2)
- 接着剤を基材上に吐出するデバイスであって、3つの空間方向に移動可能な書き込みヘッド(1)を含み、第1の吐出ノズル(4)及び少なくとも1つの第2の吐出ノズル(6)を、前記第1の吐出ノズル(4)の先端部が固定され、前記少なくとも1つの第2の吐出ノズル(6)の先端部が前記基材の表面に対して実質的に垂直に延びる方向に移動可能であるように、前記書き込みヘッド(1)に固定することができ、デバイスはピン(22)を備えるアクチュエーター(21)をさらに含み、該デバイスは2つの動作モードで動作することができ、一方の動作モードから他方の動作モードに変わるよう以下のステップ:
−前記書き込みヘッド(1)を持ち上げるステップ、
−前記ピン(22)を後退又は伸張させるステップ、及び
−前記書き込みヘッド(1)を所定の動作高さまで下降させるステップであって、前記ピン(22)が後退した状態では、前記吐出ノズル(4、6)の前記先端部は前記基材上の実質的に同様の高さに達し、前記ピン(22)が伸張した状態では、前記少なくとも1つの第2の吐出ノズル(6)の前記先端部は、前記基材上の、前記第1の吐出ノズル(4)の前記先端部よりも高い高さに達する、下降させるステップ
を行うように構成されている、デバイス。 - 前記デバイスは、撓みヒンジ(18)によって互いに接続される4つのストラット(17)を含み、前記少なくとも1つの第2の吐出ノズル(6)は前記ストラット(17)のうちの1つに固定され、前記撓みヒンジ(18)は、前記少なくとも1つの第2の吐出ノズル(6)の前記先端部が前記基材の前記表面に対して実質的に垂直に延びる前記方向に移動することを可能にし、ガイド(13)が、前記少なくとも1つの第2の吐出ノズル(6)が固定される前記ストラット(17)が他の方向に移動することを防止する、請求項1に記載のデバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00777/13A CH707890B1 (de) | 2013-04-15 | 2013-04-15 | Vorrichtung zum Auftragen von Klebstoff auf ein Substrat. |
CH00777/13 | 2013-04-15 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014205140A JP2014205140A (ja) | 2014-10-30 |
JP2014205140A5 JP2014205140A5 (ja) | 2017-03-30 |
JP6331192B2 true JP6331192B2 (ja) | 2018-05-30 |
Family
ID=51618518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014079241A Expired - Fee Related JP6331192B2 (ja) | 2013-04-15 | 2014-04-08 | 接着剤を基材上に吐出するデバイス |
Country Status (10)
Country | Link |
---|---|
US (1) | US9233389B2 (ja) |
JP (1) | JP6331192B2 (ja) |
KR (1) | KR20140123910A (ja) |
CN (1) | CN104107781B (ja) |
CH (1) | CH707890B1 (ja) |
DE (1) | DE102014103822A1 (ja) |
FR (1) | FR3004363B1 (ja) |
MY (1) | MY172008A (ja) |
SG (1) | SG10201400757VA (ja) |
TW (1) | TWI610334B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105478299A (zh) * | 2015-12-24 | 2016-04-13 | 深圳市轴心自控技术有限公司 | 点胶装置及具有该点胶装置的点胶机 |
NL2016164B1 (en) * | 2016-01-27 | 2017-08-01 | Ultimaker Bv | Nozzle lifting assembly. |
US10083896B1 (en) | 2017-03-27 | 2018-09-25 | Texas Instruments Incorporated | Methods and apparatus for a semiconductor device having bi-material die attach layer |
US11343949B2 (en) * | 2018-03-13 | 2022-05-24 | Asm Technology Singapore Pte Ltd | Apparatus and method for dispensing a viscous adhesive |
US20200035512A1 (en) * | 2018-07-24 | 2020-01-30 | Illinois Tool Works Inc. | Method of transitioning from synchronous to asynchronous dispensing |
US11684947B2 (en) * | 2018-11-09 | 2023-06-27 | Illinois Tool Works Inc. | Modular fluid application device for varying fluid coat weight |
US11289445B2 (en) * | 2018-12-24 | 2022-03-29 | Asm Technology Singapore Pte Ltd | Die bonder incorporating rotatable adhesive dispenser head |
CN113262943A (zh) * | 2021-05-25 | 2021-08-17 | 延锋伟世通汽车电子有限公司 | 自动涂覆装置 |
JP7281839B1 (ja) * | 2021-10-25 | 2023-05-26 | スターテクノ株式会社 | 塗布装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3584571A (en) * | 1967-08-25 | 1971-06-15 | Pannier Corp The | Character generation marking device |
US3810779A (en) * | 1971-06-07 | 1974-05-14 | Bio Medical Sciences Inc | Method and apparatus for depositing precisely metered quantities of liquid on a surface |
JPS62180774A (ja) * | 1986-01-31 | 1987-08-08 | Mitsubishi Heavy Ind Ltd | 塗工装置 |
US4715112A (en) * | 1986-12-10 | 1987-12-29 | Amp Incorporated | Pick-up head |
JPH0466157A (ja) * | 1990-07-05 | 1992-03-02 | Toray Eng Co Ltd | 液体供給装置 |
JPH05185004A (ja) * | 1992-01-17 | 1993-07-27 | Toshiba Corp | 接着剤塗布装置 |
JPH0629664U (ja) * | 1992-09-21 | 1994-04-19 | 石川島播磨重工業株式会社 | 塗工装置 |
JPH06106118A (ja) * | 1992-09-29 | 1994-04-19 | Sanyo Electric Co Ltd | 塗布装置 |
GB9312704D0 (en) * | 1993-06-19 | 1993-08-04 | Molins Plc | Cigarette making machine |
JPH07163927A (ja) * | 1993-12-10 | 1995-06-27 | Three Bond Co Ltd | ディスペンサ及びこれを備えた自動塗布装置 |
DE59811823D1 (de) | 1997-09-05 | 2004-09-23 | Esec Trading Sa | Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat |
JP4104730B2 (ja) * | 1998-04-07 | 2008-06-18 | 松下電器産業株式会社 | ボンド塗布装置 |
US20030044534A1 (en) | 2001-09-06 | 2003-03-06 | Lau Siu Wing | Multi-pin epoxy writing apparatus |
DE10201120A1 (de) * | 2002-01-15 | 2003-07-31 | Bosch Gmbh Robert | Vorrichtung zum Aufbringen eines Mediums an einer Aufbringposition auf einem Substrat |
EP1432013A1 (de) | 2002-12-18 | 2004-06-23 | Esec Trading S.A. | Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf ein Substrat |
JP4501382B2 (ja) * | 2003-09-11 | 2010-07-14 | 株式会社豊田自動織機 | デフォッガー線塗布装置 |
JP2005129668A (ja) * | 2003-10-23 | 2005-05-19 | Ricoh Co Ltd | 接着剤塗布ノズル及び接着剤塗布装置 |
DE102006038973A1 (de) * | 2006-08-21 | 2008-03-20 | Hauni Maschinenbau Ag | Papierbeleimung bei der Strangherstellung |
JP4750056B2 (ja) * | 2007-02-22 | 2011-08-17 | 日立アロカメディカル株式会社 | ノズル駆動装置 |
CN101939114A (zh) * | 2008-02-08 | 2011-01-05 | 中央硝子株式会社 | 涂布液的涂布装置及涂布方法 |
US7977231B1 (en) | 2010-11-08 | 2011-07-12 | Asm Assembly Automation Ltd | Die bonder incorporating dual-head dispenser |
CH705475B1 (de) | 2011-09-09 | 2015-04-30 | Esec Ag | Verfahren zum Auftragen von Klebstoff auf ein Substrat. |
-
2013
- 2013-04-15 CH CH00777/13A patent/CH707890B1/de unknown
-
2014
- 2014-03-18 MY MYPI2014700649A patent/MY172008A/en unknown
- 2014-03-19 SG SG10201400757VA patent/SG10201400757VA/en unknown
- 2014-03-20 DE DE102014103822.3A patent/DE102014103822A1/de not_active Withdrawn
- 2014-03-25 FR FR1452488A patent/FR3004363B1/fr not_active Expired - Fee Related
- 2014-04-01 TW TW103112129A patent/TWI610334B/zh not_active IP Right Cessation
- 2014-04-08 JP JP2014079241A patent/JP6331192B2/ja not_active Expired - Fee Related
- 2014-04-11 KR KR1020140043602A patent/KR20140123910A/ko not_active Application Discontinuation
- 2014-04-15 CN CN201410150731.4A patent/CN104107781B/zh not_active Expired - Fee Related
- 2014-04-15 US US14/253,625 patent/US9233389B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR3004363A1 (fr) | 2014-10-17 |
DE102014103822A1 (de) | 2014-10-16 |
KR20140123910A (ko) | 2014-10-23 |
FR3004363B1 (fr) | 2019-05-03 |
US20140305372A1 (en) | 2014-10-16 |
CH707890A1 (de) | 2014-10-15 |
CH707890B1 (de) | 2017-12-15 |
MY172008A (en) | 2019-11-11 |
CN104107781A (zh) | 2014-10-22 |
CN104107781B (zh) | 2017-12-19 |
SG10201400757VA (en) | 2014-11-27 |
JP2014205140A (ja) | 2014-10-30 |
US9233389B2 (en) | 2016-01-12 |
TWI610334B (zh) | 2018-01-01 |
TW201503224A (zh) | 2015-01-16 |
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