SG10201400757VA - Device for dispensing adhesive on a substrate - Google Patents

Device for dispensing adhesive on a substrate

Info

Publication number
SG10201400757VA
SG10201400757VA SG10201400757VA SG10201400757VA SG10201400757VA SG 10201400757V A SG10201400757V A SG 10201400757VA SG 10201400757V A SG10201400757V A SG 10201400757VA SG 10201400757V A SG10201400757V A SG 10201400757VA SG 10201400757V A SG10201400757V A SG 10201400757VA
Authority
SG
Singapore
Prior art keywords
substrate
dispensing adhesive
dispensing
adhesive
Prior art date
Application number
SG10201400757VA
Inventor
Ruedi Grueter
Christof Koster
Paul Andreas Stadler
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of SG10201400757VA publication Critical patent/SG10201400757VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0295—Floating coating heads or nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SG10201400757VA 2013-04-15 2014-03-19 Device for dispensing adhesive on a substrate SG10201400757VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00777/13A CH707890B1 (en) 2013-04-15 2013-04-15 Device for applying adhesive to a substrate.

Publications (1)

Publication Number Publication Date
SG10201400757VA true SG10201400757VA (en) 2014-11-27

Family

ID=51618518

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201400757VA SG10201400757VA (en) 2013-04-15 2014-03-19 Device for dispensing adhesive on a substrate

Country Status (10)

Country Link
US (1) US9233389B2 (en)
JP (1) JP6331192B2 (en)
KR (1) KR20140123910A (en)
CN (1) CN104107781B (en)
CH (1) CH707890B1 (en)
DE (1) DE102014103822A1 (en)
FR (1) FR3004363B1 (en)
MY (1) MY172008A (en)
SG (1) SG10201400757VA (en)
TW (1) TWI610334B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105478299A (en) * 2015-12-24 2016-04-13 深圳市轴心自控技术有限公司 Dispensing device and dispensing machine with dispensing device
NL2016164B1 (en) * 2016-01-27 2017-08-01 Ultimaker Bv Nozzle lifting assembly.
US10083896B1 (en) 2017-03-27 2018-09-25 Texas Instruments Incorporated Methods and apparatus for a semiconductor device having bi-material die attach layer
US11343949B2 (en) * 2018-03-13 2022-05-24 Asm Technology Singapore Pte Ltd Apparatus and method for dispensing a viscous adhesive
US20200035512A1 (en) * 2018-07-24 2020-01-30 Illinois Tool Works Inc. Method of transitioning from synchronous to asynchronous dispensing
US11684947B2 (en) * 2018-11-09 2023-06-27 Illinois Tool Works Inc. Modular fluid application device for varying fluid coat weight
US11289445B2 (en) * 2018-12-24 2022-03-29 Asm Technology Singapore Pte Ltd Die bonder incorporating rotatable adhesive dispenser head
CN113262943A (en) * 2021-05-25 2021-08-17 延锋伟世通汽车电子有限公司 Automatic coating device
JP7281839B1 (en) * 2021-10-25 2023-05-26 スターテクノ株式会社 Coating device

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US3584571A (en) * 1967-08-25 1971-06-15 Pannier Corp The Character generation marking device
US3810779A (en) * 1971-06-07 1974-05-14 Bio Medical Sciences Inc Method and apparatus for depositing precisely metered quantities of liquid on a surface
JPS62180774A (en) * 1986-01-31 1987-08-08 Mitsubishi Heavy Ind Ltd Coating device
US4715112A (en) * 1986-12-10 1987-12-29 Amp Incorporated Pick-up head
JPH0466157A (en) * 1990-07-05 1992-03-02 Toray Eng Co Ltd Liquid supply apparatus
JPH05185004A (en) * 1992-01-17 1993-07-27 Toshiba Corp Adhesive coating device
JPH0629664U (en) * 1992-09-21 1994-04-19 石川島播磨重工業株式会社 Coating equipment
JPH06106118A (en) * 1992-09-29 1994-04-19 Sanyo Electric Co Ltd Coating device
GB9312704D0 (en) * 1993-06-19 1993-08-04 Molins Plc Cigarette making machine
JPH07163927A (en) * 1993-12-10 1995-06-27 Three Bond Co Ltd Dispenser and automatic coating applicator equipped with the same
DE59811823D1 (en) 1997-09-05 2004-09-23 Esec Trading Sa Semiconductor assembly device for applying adhesive to a substrate
JP4104730B2 (en) * 1998-04-07 2008-06-18 松下電器産業株式会社 Bond applicator
US20030044534A1 (en) 2001-09-06 2003-03-06 Lau Siu Wing Multi-pin epoxy writing apparatus
DE10201120A1 (en) * 2002-01-15 2003-07-31 Bosch Gmbh Robert Device for applying a medium at an application position on a substrate
EP1432013A1 (en) 2002-12-18 2004-06-23 Esec Trading S.A. Semiconductor-mounting apparatus for dispensing an adhesive on a substrat
JP4501382B2 (en) * 2003-09-11 2010-07-14 株式会社豊田自動織機 Defogger wire coating device
JP2005129668A (en) * 2003-10-23 2005-05-19 Ricoh Co Ltd Adhesive application nozzle and adhesive applicator
DE102006038973A1 (en) * 2006-08-21 2008-03-20 Hauni Maschinenbau Ag Paper gluing during strand production
JP4750056B2 (en) * 2007-02-22 2011-08-17 日立アロカメディカル株式会社 Nozzle drive device
CN101939114A (en) * 2008-02-08 2011-01-05 中央硝子株式会社 Device and method for applying application liquid
US7977231B1 (en) 2010-11-08 2011-07-12 Asm Assembly Automation Ltd Die bonder incorporating dual-head dispenser
CH705475B1 (en) 2011-09-09 2015-04-30 Esec Ag Method of applying adhesive to a substrate.

Also Published As

Publication number Publication date
FR3004363A1 (en) 2014-10-17
DE102014103822A1 (en) 2014-10-16
KR20140123910A (en) 2014-10-23
JP6331192B2 (en) 2018-05-30
FR3004363B1 (en) 2019-05-03
US20140305372A1 (en) 2014-10-16
CH707890A1 (en) 2014-10-15
CH707890B1 (en) 2017-12-15
MY172008A (en) 2019-11-11
CN104107781A (en) 2014-10-22
CN104107781B (en) 2017-12-19
JP2014205140A (en) 2014-10-30
US9233389B2 (en) 2016-01-12
TWI610334B (en) 2018-01-01
TW201503224A (en) 2015-01-16

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