JP2014205140A5 - - Google Patents

Download PDF

Info

Publication number
JP2014205140A5
JP2014205140A5 JP2014079241A JP2014079241A JP2014205140A5 JP 2014205140 A5 JP2014205140 A5 JP 2014205140A5 JP 2014079241 A JP2014079241 A JP 2014079241A JP 2014079241 A JP2014079241 A JP 2014079241A JP 2014205140 A5 JP2014205140 A5 JP 2014205140A5
Authority
JP
Japan
Prior art keywords
discharge nozzle
tip
substrate
fixed
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014079241A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014205140A (ja
JP6331192B2 (ja
Filing date
Publication date
Priority claimed from CH00777/13A external-priority patent/CH707890B1/de
Application filed filed Critical
Publication of JP2014205140A publication Critical patent/JP2014205140A/ja
Publication of JP2014205140A5 publication Critical patent/JP2014205140A5/ja
Application granted granted Critical
Publication of JP6331192B2 publication Critical patent/JP6331192B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014079241A 2013-04-15 2014-04-08 接着剤を基材上に吐出するデバイス Expired - Fee Related JP6331192B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00777/13A CH707890B1 (de) 2013-04-15 2013-04-15 Vorrichtung zum Auftragen von Klebstoff auf ein Substrat.
CH00777/13 2013-04-15

Publications (3)

Publication Number Publication Date
JP2014205140A JP2014205140A (ja) 2014-10-30
JP2014205140A5 true JP2014205140A5 (enExample) 2017-03-30
JP6331192B2 JP6331192B2 (ja) 2018-05-30

Family

ID=51618518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014079241A Expired - Fee Related JP6331192B2 (ja) 2013-04-15 2014-04-08 接着剤を基材上に吐出するデバイス

Country Status (10)

Country Link
US (1) US9233389B2 (enExample)
JP (1) JP6331192B2 (enExample)
KR (1) KR20140123910A (enExample)
CN (1) CN104107781B (enExample)
CH (1) CH707890B1 (enExample)
DE (1) DE102014103822A1 (enExample)
FR (1) FR3004363B1 (enExample)
MY (1) MY172008A (enExample)
SG (1) SG10201400757VA (enExample)
TW (1) TWI610334B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105478299A (zh) * 2015-12-24 2016-04-13 深圳市轴心自控技术有限公司 点胶装置及具有该点胶装置的点胶机
NL2016164B1 (en) * 2016-01-27 2017-08-01 Ultimaker Bv Nozzle lifting assembly.
US10083896B1 (en) 2017-03-27 2018-09-25 Texas Instruments Incorporated Methods and apparatus for a semiconductor device having bi-material die attach layer
US11343949B2 (en) * 2018-03-13 2022-05-24 Asm Technology Singapore Pte Ltd Apparatus and method for dispensing a viscous adhesive
US20200035512A1 (en) * 2018-07-24 2020-01-30 Illinois Tool Works Inc. Method of transitioning from synchronous to asynchronous dispensing
WO2020097354A2 (en) * 2018-11-09 2020-05-14 Illinois Tool Works Inc. Modular fluid application device for varying fluid coat weight
US11289445B2 (en) * 2018-12-24 2022-03-29 Asm Technology Singapore Pte Ltd Die bonder incorporating rotatable adhesive dispenser head
CN113262943A (zh) * 2021-05-25 2021-08-17 延锋伟世通汽车电子有限公司 自动涂覆装置
JP7281839B1 (ja) * 2021-10-25 2023-05-26 スターテクノ株式会社 塗布装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584571A (en) * 1967-08-25 1971-06-15 Pannier Corp The Character generation marking device
US3810779A (en) * 1971-06-07 1974-05-14 Bio Medical Sciences Inc Method and apparatus for depositing precisely metered quantities of liquid on a surface
JPS62180774A (ja) * 1986-01-31 1987-08-08 Mitsubishi Heavy Ind Ltd 塗工装置
US4715112A (en) * 1986-12-10 1987-12-29 Amp Incorporated Pick-up head
JPH0466157A (ja) * 1990-07-05 1992-03-02 Toray Eng Co Ltd 液体供給装置
JPH05185004A (ja) * 1992-01-17 1993-07-27 Toshiba Corp 接着剤塗布装置
JPH0629664U (ja) * 1992-09-21 1994-04-19 石川島播磨重工業株式会社 塗工装置
JPH06106118A (ja) * 1992-09-29 1994-04-19 Sanyo Electric Co Ltd 塗布装置
GB9312704D0 (en) * 1993-06-19 1993-08-04 Molins Plc Cigarette making machine
JPH07163927A (ja) * 1993-12-10 1995-06-27 Three Bond Co Ltd ディスペンサ及びこれを備えた自動塗布装置
EP0901155B1 (de) 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
JP4104730B2 (ja) * 1998-04-07 2008-06-18 松下電器産業株式会社 ボンド塗布装置
US20030044534A1 (en) 2001-09-06 2003-03-06 Lau Siu Wing Multi-pin epoxy writing apparatus
DE10201120A1 (de) * 2002-01-15 2003-07-31 Bosch Gmbh Robert Vorrichtung zum Aufbringen eines Mediums an einer Aufbringposition auf einem Substrat
EP1432013A1 (de) 2002-12-18 2004-06-23 Esec Trading S.A. Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf ein Substrat
JP4501382B2 (ja) * 2003-09-11 2010-07-14 株式会社豊田自動織機 デフォッガー線塗布装置
JP2005129668A (ja) * 2003-10-23 2005-05-19 Ricoh Co Ltd 接着剤塗布ノズル及び接着剤塗布装置
DE102006038973A1 (de) * 2006-08-21 2008-03-20 Hauni Maschinenbau Ag Papierbeleimung bei der Strangherstellung
JP4750056B2 (ja) * 2007-02-22 2011-08-17 日立アロカメディカル株式会社 ノズル駆動装置
CN101939114A (zh) * 2008-02-08 2011-01-05 中央硝子株式会社 涂布液的涂布装置及涂布方法
US7977231B1 (en) 2010-11-08 2011-07-12 Asm Assembly Automation Ltd Die bonder incorporating dual-head dispenser
CH705475B1 (de) 2011-09-09 2015-04-30 Esec Ag Verfahren zum Auftragen von Klebstoff auf ein Substrat.

Similar Documents

Publication Publication Date Title
JP2014205140A5 (enExample)
JP6331192B2 (ja) 接着剤を基材上に吐出するデバイス
US9827758B2 (en) Film stripping device and film stripping method
JP6004162B2 (ja) 記録装置及び記録方法
US20170208942A1 (en) Slide rail assembly and operation method thereof
TW201703610A (zh) 滑軌總成及其托架裝置
CN103633006B (zh) 晶圆芯片顶起机构
EP2433863A3 (en) Slat support assembly
TW202015590A (zh) 滑軌總成
TWI607723B (zh) 滑軌總成
TWI603465B (zh) 用於顯示裝置之組件設備
JP2011230010A5 (enExample)
US11364731B2 (en) Printer, method of operating printer, and substrate handling mechanism
JP5243585B2 (ja) 基板供給装置
CN205927512U (zh) 一种自动激光焊接机
CN105564009A (zh) 一种bga基板的夹持装置
TW202406479A (zh) 滑軌總成
JP2008064666A5 (enExample)
JP2016179433A5 (enExample)
CN103537828A (zh) 移动式定位装置
JP4104730B2 (ja) ボンド塗布装置
TWI593336B (zh) 滑軌總成
JP2010114242A5 (enExample)
JP2013212668A5 (enExample)
JP2023132695A (ja) 塗布装置