JP2014205140A5 - - Google Patents
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- Publication number
- JP2014205140A5 JP2014205140A5 JP2014079241A JP2014079241A JP2014205140A5 JP 2014205140 A5 JP2014205140 A5 JP 2014205140A5 JP 2014079241 A JP2014079241 A JP 2014079241A JP 2014079241 A JP2014079241 A JP 2014079241A JP 2014205140 A5 JP2014205140 A5 JP 2014205140A5
- Authority
- JP
- Japan
- Prior art keywords
- discharge nozzle
- tip
- substrate
- fixed
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH00777/13A CH707890B1 (de) | 2013-04-15 | 2013-04-15 | Vorrichtung zum Auftragen von Klebstoff auf ein Substrat. |
| CH00777/13 | 2013-04-15 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014205140A JP2014205140A (ja) | 2014-10-30 |
| JP2014205140A5 true JP2014205140A5 (enExample) | 2017-03-30 |
| JP6331192B2 JP6331192B2 (ja) | 2018-05-30 |
Family
ID=51618518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014079241A Expired - Fee Related JP6331192B2 (ja) | 2013-04-15 | 2014-04-08 | 接着剤を基材上に吐出するデバイス |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9233389B2 (enExample) |
| JP (1) | JP6331192B2 (enExample) |
| KR (1) | KR20140123910A (enExample) |
| CN (1) | CN104107781B (enExample) |
| CH (1) | CH707890B1 (enExample) |
| DE (1) | DE102014103822A1 (enExample) |
| FR (1) | FR3004363B1 (enExample) |
| MY (1) | MY172008A (enExample) |
| SG (1) | SG10201400757VA (enExample) |
| TW (1) | TWI610334B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105478299A (zh) * | 2015-12-24 | 2016-04-13 | 深圳市轴心自控技术有限公司 | 点胶装置及具有该点胶装置的点胶机 |
| NL2016164B1 (en) * | 2016-01-27 | 2017-08-01 | Ultimaker Bv | Nozzle lifting assembly. |
| US10083896B1 (en) * | 2017-03-27 | 2018-09-25 | Texas Instruments Incorporated | Methods and apparatus for a semiconductor device having bi-material die attach layer |
| US11343949B2 (en) * | 2018-03-13 | 2022-05-24 | Asm Technology Singapore Pte Ltd | Apparatus and method for dispensing a viscous adhesive |
| US20200035512A1 (en) * | 2018-07-24 | 2020-01-30 | Illinois Tool Works Inc. | Method of transitioning from synchronous to asynchronous dispensing |
| US11684947B2 (en) * | 2018-11-09 | 2023-06-27 | Illinois Tool Works Inc. | Modular fluid application device for varying fluid coat weight |
| US11289445B2 (en) * | 2018-12-24 | 2022-03-29 | Asm Technology Singapore Pte Ltd | Die bonder incorporating rotatable adhesive dispenser head |
| CN113262943A (zh) * | 2021-05-25 | 2021-08-17 | 延锋伟世通汽车电子有限公司 | 自动涂覆装置 |
| WO2023073746A1 (ja) * | 2021-10-25 | 2023-05-04 | スターテクノ株式会社 | 塗布装置及びその塗布装置によって製造された組部材 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3584571A (en) * | 1967-08-25 | 1971-06-15 | Pannier Corp The | Character generation marking device |
| US3810779A (en) * | 1971-06-07 | 1974-05-14 | Bio Medical Sciences Inc | Method and apparatus for depositing precisely metered quantities of liquid on a surface |
| JPS62180774A (ja) * | 1986-01-31 | 1987-08-08 | Mitsubishi Heavy Ind Ltd | 塗工装置 |
| US4715112A (en) * | 1986-12-10 | 1987-12-29 | Amp Incorporated | Pick-up head |
| JPH0466157A (ja) * | 1990-07-05 | 1992-03-02 | Toray Eng Co Ltd | 液体供給装置 |
| JPH05185004A (ja) * | 1992-01-17 | 1993-07-27 | Toshiba Corp | 接着剤塗布装置 |
| JPH0629664U (ja) * | 1992-09-21 | 1994-04-19 | 石川島播磨重工業株式会社 | 塗工装置 |
| JPH06106118A (ja) * | 1992-09-29 | 1994-04-19 | Sanyo Electric Co Ltd | 塗布装置 |
| GB9312704D0 (en) * | 1993-06-19 | 1993-08-04 | Molins Plc | Cigarette making machine |
| JPH07163927A (ja) * | 1993-12-10 | 1995-06-27 | Three Bond Co Ltd | ディスペンサ及びこれを備えた自動塗布装置 |
| EP0901155B1 (de) | 1997-09-05 | 2004-08-18 | ESEC Trading SA | Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat |
| JP4104730B2 (ja) * | 1998-04-07 | 2008-06-18 | 松下電器産業株式会社 | ボンド塗布装置 |
| US20030044534A1 (en) | 2001-09-06 | 2003-03-06 | Lau Siu Wing | Multi-pin epoxy writing apparatus |
| DE10201120A1 (de) * | 2002-01-15 | 2003-07-31 | Bosch Gmbh Robert | Vorrichtung zum Aufbringen eines Mediums an einer Aufbringposition auf einem Substrat |
| EP1432013A1 (de) | 2002-12-18 | 2004-06-23 | Esec Trading S.A. | Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf ein Substrat |
| JP4501382B2 (ja) * | 2003-09-11 | 2010-07-14 | 株式会社豊田自動織機 | デフォッガー線塗布装置 |
| JP2005129668A (ja) * | 2003-10-23 | 2005-05-19 | Ricoh Co Ltd | 接着剤塗布ノズル及び接着剤塗布装置 |
| DE102006038973A1 (de) * | 2006-08-21 | 2008-03-20 | Hauni Maschinenbau Ag | Papierbeleimung bei der Strangherstellung |
| JP4750056B2 (ja) * | 2007-02-22 | 2011-08-17 | 日立アロカメディカル株式会社 | ノズル駆動装置 |
| KR20100119880A (ko) * | 2008-02-08 | 2010-11-11 | 샌트랄 글래스 컴퍼니 리미티드 | 도포액의 도포장치 및 도포방법 |
| US7977231B1 (en) | 2010-11-08 | 2011-07-12 | Asm Assembly Automation Ltd | Die bonder incorporating dual-head dispenser |
| CH705475B1 (de) | 2011-09-09 | 2015-04-30 | Esec Ag | Verfahren zum Auftragen von Klebstoff auf ein Substrat. |
-
2013
- 2013-04-15 CH CH00777/13A patent/CH707890B1/de unknown
-
2014
- 2014-03-18 MY MYPI2014700649A patent/MY172008A/en unknown
- 2014-03-19 SG SG10201400757VA patent/SG10201400757VA/en unknown
- 2014-03-20 DE DE102014103822.3A patent/DE102014103822A1/de not_active Withdrawn
- 2014-03-25 FR FR1452488A patent/FR3004363B1/fr not_active Expired - Fee Related
- 2014-04-01 TW TW103112129A patent/TWI610334B/zh not_active IP Right Cessation
- 2014-04-08 JP JP2014079241A patent/JP6331192B2/ja not_active Expired - Fee Related
- 2014-04-11 KR KR1020140043602A patent/KR20140123910A/ko not_active Ceased
- 2014-04-15 US US14/253,625 patent/US9233389B2/en not_active Expired - Fee Related
- 2014-04-15 CN CN201410150731.4A patent/CN104107781B/zh not_active Expired - Fee Related
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