JP2011230010A5 - - Google Patents

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Publication number
JP2011230010A5
JP2011230010A5 JP2010100037A JP2010100037A JP2011230010A5 JP 2011230010 A5 JP2011230010 A5 JP 2011230010A5 JP 2010100037 A JP2010100037 A JP 2010100037A JP 2010100037 A JP2010100037 A JP 2010100037A JP 2011230010 A5 JP2011230010 A5 JP 2011230010A5
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JP
Japan
Prior art keywords
stage
unit
coating head
coating
semiconductor device
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Application number
JP2010100037A
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English (en)
Japanese (ja)
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JP2011230010A (ja
JP5606780B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2010100037A priority Critical patent/JP5606780B2/ja
Priority claimed from JP2010100037A external-priority patent/JP5606780B2/ja
Priority to KR1020110037492A priority patent/KR101257569B1/ko
Priority to TW100114161A priority patent/TW201201265A/zh
Priority to CN2011101046333A priority patent/CN102233311A/zh
Publication of JP2011230010A publication Critical patent/JP2011230010A/ja
Publication of JP2011230010A5 publication Critical patent/JP2011230010A5/ja
Application granted granted Critical
Publication of JP5606780B2 publication Critical patent/JP5606780B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010100037A 2010-04-23 2010-04-23 半導体装置の製造装置 Expired - Fee Related JP5606780B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010100037A JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置
KR1020110037492A KR101257569B1 (ko) 2010-04-23 2011-04-21 반도체 장치의 제조 장치
TW100114161A TW201201265A (en) 2010-04-23 2011-04-22 Manufacturing apparatus of semiconductor device
CN2011101046333A CN102233311A (zh) 2010-04-23 2011-04-22 半导体装置制造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010100037A JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

Publications (3)

Publication Number Publication Date
JP2011230010A JP2011230010A (ja) 2011-11-17
JP2011230010A5 true JP2011230010A5 (enExample) 2013-06-06
JP5606780B2 JP5606780B2 (ja) 2014-10-15

Family

ID=44884711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010100037A Expired - Fee Related JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

Country Status (4)

Country Link
JP (1) JP5606780B2 (enExample)
KR (1) KR101257569B1 (enExample)
CN (1) CN102233311A (enExample)
TW (1) TW201201265A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102247118B1 (ko) * 2013-09-26 2021-04-30 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 토출 검사 장치
JP6161489B2 (ja) * 2013-09-26 2017-07-12 株式会社Ｓｃｒｅｅｎホールディングス 吐出検査装置および基板処理装置
JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
CN105032711A (zh) * 2015-07-09 2015-11-11 北京中电科电子装备有限公司 一种点胶装置
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
CN107131825B (zh) * 2017-03-24 2019-08-09 北京工业大学 一种判别并记录硅片位置的检测装置及方法
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
CN113093473A (zh) * 2021-03-26 2021-07-09 硅芯崟科技(苏州)有限公司 一种mems芯片喷匀胶设备及其工艺方法
CN115593910B (zh) * 2022-10-19 2024-08-06 苏州广年科技有限公司 防刮伤式晶圆转运方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148968B1 (ko) * 1995-04-29 1998-12-15 배순훈 비젼 시스템을 이용한 도포량 자동조절장치 및 그 제어방법
KR200266310Y1 (ko) * 1999-05-13 2002-02-28 김종기 볼그리드어레이 반도체칩 제조용 핀타입 접착제 도포장치
JP3696156B2 (ja) * 2000-12-26 2005-09-14 株式会社東芝 塗布膜の加熱装置、レジスト膜の処理方法
KR100492082B1 (ko) * 2003-01-23 2005-06-01 삼성전자주식회사 습식 와이핑 장치 및 이를 구비하는 메인터넌스 장치
JP4752822B2 (ja) * 2004-02-13 2011-08-17 セイコーエプソン株式会社 液滴吐出装置および電気光学装置の製造方法
JP2006013427A (ja) * 2004-05-25 2006-01-12 Ricoh Co Ltd 微小接着剤ノズルおよび接着剤塗布装置
JP4241639B2 (ja) * 2005-02-14 2009-03-18 セイコーエプソン株式会社 液滴吐出装置及び液滴吐出ヘッドの保守方法
JP2006248102A (ja) * 2005-03-11 2006-09-21 Shibaura Mechatronics Corp インクジェット塗布装置及びインクジェットヘッドのクリーニング方法
TWI311500B (en) * 2005-10-20 2009-07-01 Shibaura Mechatronics Corporatio Apparatus for applying solution and method of measuring quantity of solution
JP4818187B2 (ja) * 2007-04-16 2011-11-16 株式会社東芝 半導体装置の製造方法
JP2009090211A (ja) * 2007-10-09 2009-04-30 Seiko Epson Corp 液滴吐出ヘッドの液滴吐出量検出方法

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