JP5606780B2 - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置 Download PDF

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Publication number
JP5606780B2
JP5606780B2 JP2010100037A JP2010100037A JP5606780B2 JP 5606780 B2 JP5606780 B2 JP 5606780B2 JP 2010100037 A JP2010100037 A JP 2010100037A JP 2010100037 A JP2010100037 A JP 2010100037A JP 5606780 B2 JP5606780 B2 JP 5606780B2
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JP
Japan
Prior art keywords
wafer
unit
stage
adhesive
coating head
Prior art date
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Expired - Fee Related
Application number
JP2010100037A
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English (en)
Japanese (ja)
Other versions
JP2011230010A (ja
JP2011230010A5 (enExample
Inventor
暁 原
真吾 玉井
昭宏 重山
路夫 小川
均 青柳
裕之 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2010100037A priority Critical patent/JP5606780B2/ja
Priority to KR1020110037492A priority patent/KR101257569B1/ko
Priority to TW100114161A priority patent/TW201201265A/zh
Priority to CN2011101046333A priority patent/CN102233311A/zh
Publication of JP2011230010A publication Critical patent/JP2011230010A/ja
Publication of JP2011230010A5 publication Critical patent/JP2011230010A5/ja
Application granted granted Critical
Publication of JP5606780B2 publication Critical patent/JP5606780B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2010100037A 2010-04-23 2010-04-23 半導体装置の製造装置 Expired - Fee Related JP5606780B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010100037A JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置
KR1020110037492A KR101257569B1 (ko) 2010-04-23 2011-04-21 반도체 장치의 제조 장치
TW100114161A TW201201265A (en) 2010-04-23 2011-04-22 Manufacturing apparatus of semiconductor device
CN2011101046333A CN102233311A (zh) 2010-04-23 2011-04-22 半导体装置制造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010100037A JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

Publications (3)

Publication Number Publication Date
JP2011230010A JP2011230010A (ja) 2011-11-17
JP2011230010A5 JP2011230010A5 (enExample) 2013-06-06
JP5606780B2 true JP5606780B2 (ja) 2014-10-15

Family

ID=44884711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010100037A Expired - Fee Related JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

Country Status (4)

Country Link
JP (1) JP5606780B2 (enExample)
KR (1) KR101257569B1 (enExample)
CN (1) CN102233311A (enExample)
TW (1) TW201201265A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170000320A (ko) * 2015-06-23 2017-01-02 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102247118B1 (ko) * 2013-09-26 2021-04-30 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 토출 검사 장치
JP6161489B2 (ja) * 2013-09-26 2017-07-12 株式会社Ｓｃｒｅｅｎホールディングス 吐出検査装置および基板処理装置
CN105032711A (zh) * 2015-07-09 2015-11-11 北京中电科电子装备有限公司 一种点胶装置
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
CN107131825B (zh) * 2017-03-24 2019-08-09 北京工业大学 一种判别并记录硅片位置的检测装置及方法
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
CN113093473A (zh) * 2021-03-26 2021-07-09 硅芯崟科技(苏州)有限公司 一种mems芯片喷匀胶设备及其工艺方法
CN115593910B (zh) * 2022-10-19 2024-08-06 苏州广年科技有限公司 防刮伤式晶圆转运方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148968B1 (ko) * 1995-04-29 1998-12-15 배순훈 비젼 시스템을 이용한 도포량 자동조절장치 및 그 제어방법
KR200266310Y1 (ko) * 1999-05-13 2002-02-28 김종기 볼그리드어레이 반도체칩 제조용 핀타입 접착제 도포장치
JP3696156B2 (ja) * 2000-12-26 2005-09-14 株式会社東芝 塗布膜の加熱装置、レジスト膜の処理方法
KR100492082B1 (ko) * 2003-01-23 2005-06-01 삼성전자주식회사 습식 와이핑 장치 및 이를 구비하는 메인터넌스 장치
JP4752822B2 (ja) * 2004-02-13 2011-08-17 セイコーエプソン株式会社 液滴吐出装置および電気光学装置の製造方法
JP2006013427A (ja) * 2004-05-25 2006-01-12 Ricoh Co Ltd 微小接着剤ノズルおよび接着剤塗布装置
JP4241639B2 (ja) * 2005-02-14 2009-03-18 セイコーエプソン株式会社 液滴吐出装置及び液滴吐出ヘッドの保守方法
JP2006248102A (ja) * 2005-03-11 2006-09-21 Shibaura Mechatronics Corp インクジェット塗布装置及びインクジェットヘッドのクリーニング方法
TWI311500B (en) * 2005-10-20 2009-07-01 Shibaura Mechatronics Corporatio Apparatus for applying solution and method of measuring quantity of solution
JP4818187B2 (ja) * 2007-04-16 2011-11-16 株式会社東芝 半導体装置の製造方法
JP2009090211A (ja) * 2007-10-09 2009-04-30 Seiko Epson Corp 液滴吐出ヘッドの液滴吐出量検出方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170000320A (ko) * 2015-06-23 2017-01-02 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 장치
JP2017011121A (ja) * 2015-06-23 2017-01-12 三星ダイヤモンド工業株式会社 スクライブ装置
KR102531216B1 (ko) 2015-06-23 2023-05-10 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 장치

Also Published As

Publication number Publication date
JP2011230010A (ja) 2011-11-17
TW201201265A (en) 2012-01-01
CN102233311A (zh) 2011-11-09
KR101257569B1 (ko) 2013-04-23
KR20110118576A (ko) 2011-10-31

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