TW201201265A - Manufacturing apparatus of semiconductor device - Google Patents
Manufacturing apparatus of semiconductor device Download PDFInfo
- Publication number
- TW201201265A TW201201265A TW100114161A TW100114161A TW201201265A TW 201201265 A TW201201265 A TW 201201265A TW 100114161 A TW100114161 A TW 100114161A TW 100114161 A TW100114161 A TW 100114161A TW 201201265 A TW201201265 A TW 201201265A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- coating
- unit
- stage
- hand
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000011248 coating agent Substances 0.000 claims abstract description 175
- 238000000576 coating method Methods 0.000 claims abstract description 172
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000004140 cleaning Methods 0.000 claims abstract description 19
- 238000007599 discharging Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 85
- 239000000853 adhesive Substances 0.000 claims description 50
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 238000012546 transfer Methods 0.000 claims description 27
- 239000004744 fabric Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 238000003384 imaging method Methods 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000012790 confirmation Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 238000010408 sweeping Methods 0.000 claims 1
- 239000011230 binding agent Substances 0.000 abstract description 44
- 230000002452 interceptive effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 353
- 238000001179 sorption measurement Methods 0.000 description 42
- 238000001035 drying Methods 0.000 description 38
- 239000007789 gas Substances 0.000 description 21
- 239000013078 crystal Substances 0.000 description 20
- 230000032258 transport Effects 0.000 description 19
- 239000007767 bonding agent Substances 0.000 description 17
- 238000003860 storage Methods 0.000 description 17
- 230000002829 reductive effect Effects 0.000 description 15
- 238000005286 illumination Methods 0.000 description 14
- 239000010410 layer Substances 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000001965 increasing effect Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011068 loading method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 244000126211 Hericium coralloides Species 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 241000255925 Diptera Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 235000002566 Capsicum Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000006002 Pepper Substances 0.000 description 1
- 235000016761 Piper aduncum Nutrition 0.000 description 1
- 235000017804 Piper guineense Nutrition 0.000 description 1
- 244000203593 Piper nigrum Species 0.000 description 1
- 235000008184 Piper nigrum Nutrition 0.000 description 1
- 101700004678 SLIT3 Proteins 0.000 description 1
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000008451 emotion Effects 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010100037A JP5606780B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201201265A true TW201201265A (en) | 2012-01-01 |
Family
ID=44884711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100114161A TW201201265A (en) | 2010-04-23 | 2011-04-22 | Manufacturing apparatus of semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5606780B2 (enExample) |
| KR (1) | KR101257569B1 (enExample) |
| CN (1) | CN102233311A (enExample) |
| TW (1) | TW201201265A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI635561B (zh) * | 2015-11-12 | 2018-09-11 | 東芝記憶體股份有限公司 | 半導體製造裝置 |
| TWI681853B (zh) * | 2015-06-23 | 2020-01-11 | 日商三星鑽石工業股份有限公司 | 刻劃裝置 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102247118B1 (ko) * | 2013-09-26 | 2021-04-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 토출 검사 장치 |
| JP6161489B2 (ja) * | 2013-09-26 | 2017-07-12 | 株式会社Ｓｃｒｅｅｎホールディングス | 吐出検査装置および基板処理装置 |
| CN105032711A (zh) * | 2015-07-09 | 2015-11-11 | 北京中电科电子装备有限公司 | 一种点胶装置 |
| CN107131825B (zh) * | 2017-03-24 | 2019-08-09 | 北京工业大学 | 一种判别并记录硅片位置的检测装置及方法 |
| JP2019027623A (ja) * | 2017-07-26 | 2019-02-21 | 株式会社Ｓｃｒｅｅｎホールディングス | 加熱装置および加熱方法 |
| CN113093473A (zh) * | 2021-03-26 | 2021-07-09 | 硅芯崟科技(苏州)有限公司 | 一种mems芯片喷匀胶设备及其工艺方法 |
| CN115593910B (zh) * | 2022-10-19 | 2024-08-06 | 苏州广年科技有限公司 | 防刮伤式晶圆转运方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0148968B1 (ko) * | 1995-04-29 | 1998-12-15 | 배순훈 | 비젼 시스템을 이용한 도포량 자동조절장치 및 그 제어방법 |
| KR200266310Y1 (ko) * | 1999-05-13 | 2002-02-28 | 김종기 | 볼그리드어레이 반도체칩 제조용 핀타입 접착제 도포장치 |
| JP3696156B2 (ja) * | 2000-12-26 | 2005-09-14 | 株式会社東芝 | 塗布膜の加熱装置、レジスト膜の処理方法 |
| KR100492082B1 (ko) * | 2003-01-23 | 2005-06-01 | 삼성전자주식회사 | 습식 와이핑 장치 및 이를 구비하는 메인터넌스 장치 |
| JP4752822B2 (ja) * | 2004-02-13 | 2011-08-17 | セイコーエプソン株式会社 | 液滴吐出装置および電気光学装置の製造方法 |
| JP2006013427A (ja) * | 2004-05-25 | 2006-01-12 | Ricoh Co Ltd | 微小接着剤ノズルおよび接着剤塗布装置 |
| JP4241639B2 (ja) * | 2005-02-14 | 2009-03-18 | セイコーエプソン株式会社 | 液滴吐出装置及び液滴吐出ヘッドの保守方法 |
| JP2006248102A (ja) * | 2005-03-11 | 2006-09-21 | Shibaura Mechatronics Corp | インクジェット塗布装置及びインクジェットヘッドのクリーニング方法 |
| TWI311500B (en) * | 2005-10-20 | 2009-07-01 | Shibaura Mechatronics Corporatio | Apparatus for applying solution and method of measuring quantity of solution |
| JP4818187B2 (ja) * | 2007-04-16 | 2011-11-16 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2009090211A (ja) * | 2007-10-09 | 2009-04-30 | Seiko Epson Corp | 液滴吐出ヘッドの液滴吐出量検出方法 |
-
2010
- 2010-04-23 JP JP2010100037A patent/JP5606780B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-21 KR KR1020110037492A patent/KR101257569B1/ko not_active Expired - Fee Related
- 2011-04-22 CN CN2011101046333A patent/CN102233311A/zh active Pending
- 2011-04-22 TW TW100114161A patent/TW201201265A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI681853B (zh) * | 2015-06-23 | 2020-01-11 | 日商三星鑽石工業股份有限公司 | 刻劃裝置 |
| TWI635561B (zh) * | 2015-11-12 | 2018-09-11 | 東芝記憶體股份有限公司 | 半導體製造裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011230010A (ja) | 2011-11-17 |
| JP5606780B2 (ja) | 2014-10-15 |
| CN102233311A (zh) | 2011-11-09 |
| KR101257569B1 (ko) | 2013-04-23 |
| KR20110118576A (ko) | 2011-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201201265A (en) | Manufacturing apparatus of semiconductor device | |
| JP5586314B2 (ja) | 半導体装置の製造装置及び半導体装置の製造方法 | |
| TWI425557B (zh) | 液體處理裝置及液體處理方法 | |
| JP5576173B2 (ja) | 半導体装置の製造装置 | |
| JP5336441B2 (ja) | 液処理装置及び液処理方法 | |
| JP5324180B2 (ja) | レーザ加工方法およびレーザ加工装置 | |
| JP5604186B2 (ja) | 加工装置 | |
| CN109817549B (zh) | 基片处理装置和涂敷单元的参数的调整方法以及存储介质 | |
| CN105032711A (zh) | 一种点胶装置 | |
| CN102696098B (zh) | 安装方法和安装装置 | |
| JP2011192663A (ja) | 実装方法及び実装装置 | |
| CN114160371B (zh) | 一种点胶装置 | |
| JP2014185358A (ja) | レーザを用いる焼結体膜形成方法及び焼結体膜形成装置 | |
| TWI293579B (en) | Coating nozzle and coating apparatus | |
| TWI737266B (zh) | 保持構件、檢查機構、切斷裝置、保持對象物的製造方法及保持構件的製造方法 | |
| JP2011233907A (ja) | 液処理装置 | |
| JP2010016090A (ja) | 基板製造用装置 | |
| JP5554133B2 (ja) | 半導体装置の製造装置及び半導体装置の製造方法 | |
| TWI313193B (en) | Coating method, coating apparatus and memory medium | |
| JP4516034B2 (ja) | 塗布方法及び塗布装置及び塗布処理プログラム | |
| JP2008098520A (ja) | 周辺露光装置、塗布、現像装置、周辺露光方法及び塗布、現像方法並びに記憶媒体 | |
| TW200924858A (en) | Liquid material applying apparatus | |
| JP2011233576A (ja) | 半導体装置の製造装置及び半導体装置の製造方法 | |
| JP2011233575A (ja) | 半導体装置の製造装置及び半導体装置の製造方法 | |
| US11915948B2 (en) | Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus |