KR101257569B1 - 반도체 장치의 제조 장치 - Google Patents

반도체 장치의 제조 장치 Download PDF

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Publication number
KR101257569B1
KR101257569B1 KR1020110037492A KR20110037492A KR101257569B1 KR 101257569 B1 KR101257569 B1 KR 101257569B1 KR 1020110037492 A KR1020110037492 A KR 1020110037492A KR 20110037492 A KR20110037492 A KR 20110037492A KR 101257569 B1 KR101257569 B1 KR 101257569B1
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KR
South Korea
Prior art keywords
wafer
application
stage
coating
adhesive
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Expired - Fee Related
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KR1020110037492A
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English (en)
Korean (ko)
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KR20110118576A (ko
Inventor
사토루 하라
신고 다마이
아키히로 시게야마
미치오 오가와
히토시 아오야기
히로유키 다나카
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20110118576A publication Critical patent/KR20110118576A/ko
Application granted granted Critical
Publication of KR101257569B1 publication Critical patent/KR101257569B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Dicing (AREA)
KR1020110037492A 2010-04-23 2011-04-21 반도체 장치의 제조 장치 Expired - Fee Related KR101257569B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-100037 2010-04-23
JP2010100037A JP5606780B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
KR20110118576A KR20110118576A (ko) 2011-10-31
KR101257569B1 true KR101257569B1 (ko) 2013-04-23

Family

ID=44884711

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110037492A Expired - Fee Related KR101257569B1 (ko) 2010-04-23 2011-04-21 반도체 장치의 제조 장치

Country Status (4)

Country Link
JP (1) JP5606780B2 (enExample)
KR (1) KR101257569B1 (enExample)
CN (1) CN102233311A (enExample)
TW (1) TW201201265A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6161489B2 (ja) * 2013-09-26 2017-07-12 株式会社Ｓｃｒｅｅｎホールディングス 吐出検査装置および基板処理装置
KR102247118B1 (ko) * 2013-09-26 2021-04-30 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 토출 검사 장치
JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
CN105032711A (zh) * 2015-07-09 2015-11-11 北京中电科电子装备有限公司 一种点胶装置
JP2017092313A (ja) * 2015-11-12 2017-05-25 株式会社東芝 半導体製造装置。
CN107131825B (zh) * 2017-03-24 2019-08-09 北京工业大学 一种判别并记录硅片位置的检测装置及方法
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
CN113093473A (zh) * 2021-03-26 2021-07-09 硅芯崟科技(苏州)有限公司 一种mems芯片喷匀胶设备及其工艺方法
CN115593910B (zh) * 2022-10-19 2024-08-06 苏州广年科技有限公司 防刮伤式晶圆转运方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148968B1 (ko) * 1995-04-29 1998-12-15 배순훈 비젼 시스템을 이용한 도포량 자동조절장치 및 그 제어방법
KR19990033693U (ko) * 1999-05-13 1999-08-16 백명열 볼그리드어레이반도체칩제조용핀타입접착제도포장치
KR20040067499A (ko) * 2003-01-23 2004-07-30 삼성전자주식회사 습식 와이핑 장치 및 이를 구비하는 메인터넌스 장치
JP2006013427A (ja) * 2004-05-25 2006-01-12 Ricoh Co Ltd 微小接着剤ノズルおよび接着剤塗布装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696156B2 (ja) * 2000-12-26 2005-09-14 株式会社東芝 塗布膜の加熱装置、レジスト膜の処理方法
JP4752822B2 (ja) * 2004-02-13 2011-08-17 セイコーエプソン株式会社 液滴吐出装置および電気光学装置の製造方法
JP4241639B2 (ja) * 2005-02-14 2009-03-18 セイコーエプソン株式会社 液滴吐出装置及び液滴吐出ヘッドの保守方法
JP2006248102A (ja) * 2005-03-11 2006-09-21 Shibaura Mechatronics Corp インクジェット塗布装置及びインクジェットヘッドのクリーニング方法
TWI311500B (en) * 2005-10-20 2009-07-01 Shibaura Mechatronics Corporatio Apparatus for applying solution and method of measuring quantity of solution
JP4818187B2 (ja) * 2007-04-16 2011-11-16 株式会社東芝 半導体装置の製造方法
JP2009090211A (ja) * 2007-10-09 2009-04-30 Seiko Epson Corp 液滴吐出ヘッドの液滴吐出量検出方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148968B1 (ko) * 1995-04-29 1998-12-15 배순훈 비젼 시스템을 이용한 도포량 자동조절장치 및 그 제어방법
KR19990033693U (ko) * 1999-05-13 1999-08-16 백명열 볼그리드어레이반도체칩제조용핀타입접착제도포장치
KR20040067499A (ko) * 2003-01-23 2004-07-30 삼성전자주식회사 습식 와이핑 장치 및 이를 구비하는 메인터넌스 장치
JP2006013427A (ja) * 2004-05-25 2006-01-12 Ricoh Co Ltd 微小接着剤ノズルおよび接着剤塗布装置

Also Published As

Publication number Publication date
KR20110118576A (ko) 2011-10-31
JP2011230010A (ja) 2011-11-17
TW201201265A (en) 2012-01-01
JP5606780B2 (ja) 2014-10-15
CN102233311A (zh) 2011-11-09

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