JP6308344B2 - 硬化性樹脂組成物 - Google Patents
硬化性樹脂組成物 Download PDFInfo
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- JP6308344B2 JP6308344B2 JP2013080551A JP2013080551A JP6308344B2 JP 6308344 B2 JP6308344 B2 JP 6308344B2 JP 2013080551 A JP2013080551 A JP 2013080551A JP 2013080551 A JP2013080551 A JP 2013080551A JP 6308344 B2 JP6308344 B2 JP 6308344B2
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- epoxy resin
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000004593 Epoxy Substances 0.000 claims description 31
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 31
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- 239000002648 laminated material Substances 0.000 claims description 28
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- 229910003475 inorganic filler Inorganic materials 0.000 claims description 24
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 22
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- 238000003475 lamination Methods 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
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- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
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| JP2013080551A JP6308344B2 (ja) | 2013-04-08 | 2013-04-08 | 硬化性樹脂組成物 |
| TW103109641A TWI624508B (zh) | 2013-04-08 | 2014-03-14 | Curable resin composition |
| KR1020140039581A KR102129715B1 (ko) | 2013-04-08 | 2014-04-02 | 경화성 수지 조성물 |
| CN201410134634.6A CN104098871B (zh) | 2013-04-08 | 2014-04-04 | 固化性树脂组合物 |
| CN201810649524.1A CN108976709B (zh) | 2013-04-08 | 2014-04-04 | 固化性树脂组合物 |
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| JP2013080551A JP6308344B2 (ja) | 2013-04-08 | 2013-04-08 | 硬化性樹脂組成物 |
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| JP6308344B2 true JP6308344B2 (ja) | 2018-04-11 |
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| KR (1) | KR102129715B1 (ko) |
| CN (2) | CN108976709B (ko) |
| TW (1) | TWI624508B (ko) |
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| JP2015151483A (ja) * | 2014-02-17 | 2015-08-24 | 三菱瓦斯化学株式会社 | レジンシート、金属箔張積層板及びプリント配線板 |
| JP2016088050A (ja) * | 2014-11-11 | 2016-05-23 | 住友ベークライト株式会社 | 樹脂層付き金属膜 |
| KR102334000B1 (ko) * | 2015-04-01 | 2021-12-01 | 에스케이이노베이션 주식회사 | 접착제 조성물 및 이로부터 제조된 커버레이 필름 |
| JP6620457B2 (ja) * | 2015-08-11 | 2019-12-18 | 味の素株式会社 | 樹脂組成物 |
| JP6852332B2 (ja) * | 2015-10-28 | 2021-03-31 | 味の素株式会社 | 接着フィルム |
| CN109072018B (zh) * | 2016-04-22 | 2021-10-08 | 昭和电工材料株式会社 | 多层印刷线路板用的粘接膜 |
| KR102511759B1 (ko) * | 2017-03-31 | 2023-03-20 | 다이요 홀딩스 가부시키가이샤 | 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품 |
| TWI620763B (zh) * | 2017-04-27 | 2018-04-11 | Taiwan Union Technology Corporation | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
| TWI808973B (zh) * | 2017-06-28 | 2023-07-21 | 日商迪愛生股份有限公司 | 活性酯化合物及硬化性組成物 |
| JP7243093B2 (ja) * | 2018-09-10 | 2023-03-22 | 株式会社レゾナック | エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 |
| US20200118716A1 (en) * | 2018-10-12 | 2020-04-16 | Te Connectivity Corporation | Electrical cable |
| CN109749440B (zh) * | 2018-12-29 | 2021-08-27 | 广东生益科技股份有限公司 | 氰酸酯树脂组合物及其用途 |
| JP7135970B2 (ja) * | 2019-03-27 | 2022-09-13 | 味の素株式会社 | 樹脂組成物 |
| CN111849122B (zh) * | 2019-04-25 | 2022-06-14 | 常熟生益科技有限公司 | 一种树脂组合物及其应用 |
| KR20220013361A (ko) * | 2019-05-27 | 2022-02-04 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 리소그래피용 하층막 형성용 조성물, 리소그래피용 하층막 및 패턴 형성방법 및 정제방법 |
| CN113088039A (zh) * | 2021-05-26 | 2021-07-09 | 深圳市纽菲斯新材料科技有限公司 | 一种绝缘胶膜及其制备方法和应用 |
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| JP4655490B2 (ja) * | 2004-03-11 | 2011-03-23 | 三菱化学株式会社 | エポキシ樹脂組成物及びその硬化体 |
| WO2007108087A1 (ja) * | 2006-03-20 | 2007-09-27 | Sumitomo Bakelite Co., Ltd. | 絶縁樹脂層、キャリア付き絶縁樹脂層および多層プリント配線板 |
| JPWO2007129662A1 (ja) * | 2006-05-08 | 2009-09-17 | 積水化学工業株式会社 | 絶縁材料、電子部品装置の製造方法及び電子部品装置 |
| US20080036097A1 (en) * | 2006-08-10 | 2008-02-14 | Teppei Ito | Semiconductor package, method of production thereof and encapsulation resin |
| KR101174971B1 (ko) * | 2007-09-05 | 2012-08-17 | 세키스이가가쿠 고교가부시키가이샤 | 절연 시트 및 적층 구조체 |
| US20110189432A1 (en) * | 2008-07-29 | 2011-08-04 | Sekisui Chemical Co., Ltd. | Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| WO2010061980A1 (ja) * | 2008-11-28 | 2010-06-03 | 味の素株式会社 | 樹脂組成物 |
| TWI494364B (zh) * | 2009-01-30 | 2015-08-01 | Ajinomoto Kk | Resin composition |
| JP5550875B2 (ja) * | 2009-09-25 | 2014-07-16 | パナソニック株式会社 | 液状熱硬化性樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板 |
| JP5249903B2 (ja) * | 2009-10-22 | 2013-07-31 | 味の素株式会社 | 樹脂組成物 |
| CN105860436B (zh) * | 2010-08-31 | 2019-01-18 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料及层叠板 |
| JP4993031B2 (ja) * | 2011-10-11 | 2012-08-08 | 住友ベークライト株式会社 | 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置 |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104098871B (zh) | 2018-07-10 |
| TW201500452A (zh) | 2015-01-01 |
| JP2014201698A (ja) | 2014-10-27 |
| CN108976709A (zh) | 2018-12-11 |
| TWI624508B (zh) | 2018-05-21 |
| CN108976709B (zh) | 2021-07-06 |
| CN104098871A (zh) | 2014-10-15 |
| KR20140121783A (ko) | 2014-10-16 |
| KR102129715B1 (ko) | 2020-07-03 |
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