CN108976709B - 固化性树脂组合物 - Google Patents

固化性树脂组合物 Download PDF

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Publication number
CN108976709B
CN108976709B CN201810649524.1A CN201810649524A CN108976709B CN 108976709 B CN108976709 B CN 108976709B CN 201810649524 A CN201810649524 A CN 201810649524A CN 108976709 B CN108976709 B CN 108976709B
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China
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resin composition
resin
mass
curable resin
composition according
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CN201810649524.1A
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English (en)
Chinese (zh)
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CN108976709A (zh
Inventor
巽志朗
西村嘉生
松山干
川合贤司
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201810649524.1A 2013-04-08 2014-04-04 固化性树脂组合物 Active CN108976709B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013080551A JP6308344B2 (ja) 2013-04-08 2013-04-08 硬化性樹脂組成物
JP2013-080551 2013-04-08
CN201410134634.6A CN104098871B (zh) 2013-04-08 2014-04-04 固化性树脂组合物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410134634.6A Division CN104098871B (zh) 2013-04-08 2014-04-04 固化性树脂组合物

Publications (2)

Publication Number Publication Date
CN108976709A CN108976709A (zh) 2018-12-11
CN108976709B true CN108976709B (zh) 2021-07-06

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CN201410134634.6A Active CN104098871B (zh) 2013-04-08 2014-04-04 固化性树脂组合物
CN201810649524.1A Active CN108976709B (zh) 2013-04-08 2014-04-04 固化性树脂组合物

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Country Status (4)

Country Link
JP (1) JP6308344B2 (ko)
KR (1) KR102129715B1 (ko)
CN (2) CN104098871B (ko)
TW (1) TWI624508B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015151483A (ja) * 2014-02-17 2015-08-24 三菱瓦斯化学株式会社 レジンシート、金属箔張積層板及びプリント配線板
JP2016088050A (ja) * 2014-11-11 2016-05-23 住友ベークライト株式会社 樹脂層付き金属膜
KR102334000B1 (ko) * 2015-04-01 2021-12-01 에스케이이노베이션 주식회사 접착제 조성물 및 이로부터 제조된 커버레이 필름
JP6620457B2 (ja) * 2015-08-11 2019-12-18 味の素株式会社 樹脂組成物
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
KR20180134349A (ko) * 2016-04-22 2018-12-18 히타치가세이가부시끼가이샤 다층 프린트 배선판용의 접착 필름
WO2018181803A1 (ja) * 2017-03-31 2018-10-04 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品
TWI620763B (zh) * 2017-04-27 2018-04-11 Taiwan Union Technology Corporation 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
TWI808973B (zh) * 2017-06-28 2023-07-21 日商迪愛生股份有限公司 活性酯化合物及硬化性組成物
JP7243093B2 (ja) * 2018-09-10 2023-03-22 株式会社レゾナック エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
US12087465B2 (en) * 2018-10-12 2024-09-10 Te Connectivity Solutions Gmbh Electrical cable
CN109749440B (zh) * 2018-12-29 2021-08-27 广东生益科技股份有限公司 氰酸酯树脂组合物及其用途
JP7135970B2 (ja) * 2019-03-27 2022-09-13 味の素株式会社 樹脂組成物
CN111849122B (zh) * 2019-04-25 2022-06-14 常熟生益科技有限公司 一种树脂组合物及其应用
KR20220013361A (ko) * 2019-05-27 2022-02-04 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 리소그래피용 하층막 형성용 조성물, 리소그래피용 하층막 및 패턴 형성방법 및 정제방법
JP7552786B2 (ja) 2020-09-23 2024-09-18 味の素株式会社 配線板及び半導体装置
CN113088039A (zh) * 2021-05-26 2021-07-09 深圳市纽菲斯新材料科技有限公司 一种绝缘胶膜及其制备方法和应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3668463B2 (ja) 2002-03-06 2005-07-06 ジャパンエポキシレジン株式会社 高分子量エポキシ樹脂とその製造方法、該エポキシ樹脂を用いた電気積層板用樹脂組成物及び電気積層板
JP4655490B2 (ja) * 2004-03-11 2011-03-23 三菱化学株式会社 エポキシ樹脂組成物及びその硬化体
CN101401491B (zh) * 2006-03-20 2011-04-13 住友电木株式会社 绝缘树脂层、带载体的绝缘树脂层和多层印刷布线板
JPWO2007129662A1 (ja) * 2006-05-08 2009-09-17 積水化学工業株式会社 絶縁材料、電子部品装置の製造方法及び電子部品装置
US20080036097A1 (en) * 2006-08-10 2008-02-14 Teppei Ito Semiconductor package, method of production thereof and encapsulation resin
KR101174971B1 (ko) * 2007-09-05 2012-08-17 세키스이가가쿠 고교가부시키가이샤 절연 시트 및 적층 구조체
US20110189432A1 (en) * 2008-07-29 2011-08-04 Sekisui Chemical Co., Ltd. Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
TWI486372B (zh) * 2008-11-28 2015-06-01 Ajinomoto Kk Resin composition
TWI494364B (zh) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
JP5550875B2 (ja) * 2009-09-25 2014-07-16 パナソニック株式会社 液状熱硬化性樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP5249903B2 (ja) * 2009-10-22 2013-07-31 味の素株式会社 樹脂組成物
SG187208A1 (en) * 2010-08-31 2013-02-28 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminated sheet
JP4993031B2 (ja) * 2011-10-11 2012-08-08 住友ベークライト株式会社 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置

Also Published As

Publication number Publication date
CN108976709A (zh) 2018-12-11
TW201500452A (zh) 2015-01-01
TWI624508B (zh) 2018-05-21
CN104098871B (zh) 2018-07-10
CN104098871A (zh) 2014-10-15
JP6308344B2 (ja) 2018-04-11
JP2014201698A (ja) 2014-10-27
KR20140121783A (ko) 2014-10-16
KR102129715B1 (ko) 2020-07-03

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