JP6285671B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6285671B2 JP6285671B2 JP2013187259A JP2013187259A JP6285671B2 JP 6285671 B2 JP6285671 B2 JP 6285671B2 JP 2013187259 A JP2013187259 A JP 2013187259A JP 2013187259 A JP2013187259 A JP 2013187259A JP 6285671 B2 JP6285671 B2 JP 6285671B2
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- JP
- Japan
- Prior art keywords
- circuit
- signal output
- wiring
- signal
- output circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20184—Detector read-out circuitry, e.g. for clearing of traps, compensating for traps or compensating for direct hits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/208—Circuits specially adapted for scintillation detectors, e.g. for the photo-multiplier section
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/618—Noise processing, e.g. detecting, correcting, reducing or removing noise for random or high-frequency noise
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/198—Contact-type image sensors [CIS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Geophysics And Detection Of Objects (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013187259A JP6285671B2 (ja) | 2012-09-12 | 2013-09-10 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012200495 | 2012-09-12 | ||
| JP2012200495 | 2012-09-12 | ||
| JP2013187259A JP6285671B2 (ja) | 2012-09-12 | 2013-09-10 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014074713A JP2014074713A (ja) | 2014-04-24 |
| JP2014074713A5 JP2014074713A5 (enExample) | 2016-10-27 |
| JP6285671B2 true JP6285671B2 (ja) | 2018-02-28 |
Family
ID=50232274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013187259A Expired - Fee Related JP6285671B2 (ja) | 2012-09-12 | 2013-09-10 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9006635B2 (enExample) |
| JP (1) | JP6285671B2 (enExample) |
| KR (1) | KR102133602B1 (enExample) |
| DE (1) | DE102013217278B4 (enExample) |
| TW (2) | TWI587700B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792677B (zh) * | 2010-03-08 | 2015-08-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| TWI635750B (zh) | 2013-08-02 | 2018-09-11 | 半導體能源研究所股份有限公司 | 攝像裝置以及其工作方法 |
| WO2015189732A1 (ja) | 2014-06-09 | 2015-12-17 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| US9881954B2 (en) | 2014-06-11 | 2018-01-30 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
| TWI757788B (zh) | 2014-06-27 | 2022-03-11 | 日商半導體能源研究所股份有限公司 | 攝像裝置及電子裝置 |
| JP6555956B2 (ja) * | 2014-07-31 | 2019-08-07 | 株式会社半導体エネルギー研究所 | 撮像装置、監視装置、及び電子機器 |
| TWI710124B (zh) | 2015-01-30 | 2020-11-11 | 日商半導體能源研究所股份有限公司 | 成像裝置及電子裝置 |
| JP6176583B1 (ja) * | 2015-11-12 | 2017-08-09 | パナソニックIpマネジメント株式会社 | 光検出装置 |
| US10147813B2 (en) * | 2016-03-04 | 2018-12-04 | United Silicon Carbide, Inc. | Tunneling field effect transistor |
| JP6727938B2 (ja) * | 2016-06-10 | 2020-07-22 | キヤノン株式会社 | 撮像装置、撮像装置の制御方法、及び撮像システム |
| US10362255B2 (en) * | 2017-02-09 | 2019-07-23 | Semiconductor Components Industries, Llc | Multi-conversion gain pixel configurations |
| US10686996B2 (en) | 2017-06-26 | 2020-06-16 | Facebook Technologies, Llc | Digital pixel with extended dynamic range |
| WO2019003037A1 (ja) | 2017-06-27 | 2019-01-03 | 株式会社半導体エネルギー研究所 | 半導体装置および電子部品 |
| US10598546B2 (en) | 2017-08-17 | 2020-03-24 | Facebook Technologies, Llc | Detecting high intensity light in photo sensor |
| US10575806B2 (en) | 2018-03-22 | 2020-03-03 | International Business Machines Corporation | Charge amplifiers that can be implemented in thin film and are useful for imaging systems such as digital breast tomosynthesis with reduced X-ray exposure |
| US11906353B2 (en) | 2018-06-11 | 2024-02-20 | Meta Platforms Technologies, Llc | Digital pixel with extended dynamic range |
| US10897586B2 (en) | 2018-06-28 | 2021-01-19 | Facebook Technologies, Llc | Global shutter image sensor |
| CN112840639B (zh) * | 2018-10-11 | 2024-10-15 | 株式会社半导体能源研究所 | 摄像装置及电子设备 |
| US11943561B2 (en) | 2019-06-13 | 2024-03-26 | Meta Platforms Technologies, Llc | Non-linear quantization at pixel sensor |
| WO2021064518A1 (ja) | 2019-10-04 | 2021-04-08 | 株式会社半導体エネルギー研究所 | 表示モジュール、および電子機器 |
| KR102815487B1 (ko) * | 2019-10-15 | 2025-05-30 | 에스케이하이닉스 주식회사 | 이미지 센서 및 이를 포함하는 이미지 처리 장치 |
| US11936998B1 (en) | 2019-10-17 | 2024-03-19 | Meta Platforms Technologies, Llc | Digital pixel sensor having extended dynamic range |
| US11902685B1 (en) | 2020-04-28 | 2024-02-13 | Meta Platforms Technologies, Llc | Pixel sensor having hierarchical memory |
| US11956560B2 (en) | 2020-10-09 | 2024-04-09 | Meta Platforms Technologies, Llc | Digital pixel sensor having reduced quantization operation |
| US12022218B2 (en) | 2020-12-29 | 2024-06-25 | Meta Platforms Technologies, Llc | Digital image sensor using a single-input comparator based quantizer |
| US11925497B2 (en) | 2021-09-01 | 2024-03-12 | Mazor Robotics Ltd. | Systems, methods, and devices for multiple exposures imaging |
| CN117878128A (zh) * | 2023-12-05 | 2024-04-12 | 中山大学 | 一种发光探测一体化器件及其制备方法 |
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| US20140070079A1 (en) | 2014-03-13 |
| DE102013217278A1 (de) | 2014-04-10 |
| TW201424370A (zh) | 2014-06-16 |
| TW201728161A (zh) | 2017-08-01 |
| JP2014074713A (ja) | 2014-04-24 |
| TWI587700B (zh) | 2017-06-11 |
| US9887232B2 (en) | 2018-02-06 |
| TWI622302B (zh) | 2018-04-21 |
| US20150179696A1 (en) | 2015-06-25 |
| US9006635B2 (en) | 2015-04-14 |
| KR20140034691A (ko) | 2014-03-20 |
| DE102013217278B4 (de) | 2017-03-30 |
| KR102133602B1 (ko) | 2020-07-13 |
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