JP6276721B2 - パワーモジュール - Google Patents

パワーモジュール Download PDF

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Publication number
JP6276721B2
JP6276721B2 JP2015022257A JP2015022257A JP6276721B2 JP 6276721 B2 JP6276721 B2 JP 6276721B2 JP 2015022257 A JP2015022257 A JP 2015022257A JP 2015022257 A JP2015022257 A JP 2015022257A JP 6276721 B2 JP6276721 B2 JP 6276721B2
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JP
Japan
Prior art keywords
semiconductor chip
solder
length
base plate
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015022257A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016146398A5 (https=
JP2016146398A (ja
Inventor
山下　志郎
志郎 山下
佑輔 高木
佑輔 高木
志村　隆弘
隆弘 志村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2015022257A priority Critical patent/JP6276721B2/ja
Priority to US15/541,861 priority patent/US9960147B2/en
Priority to PCT/JP2015/084685 priority patent/WO2016125390A1/ja
Priority to CN201580071664.XA priority patent/CN107112319B/zh
Priority to DE112015005593.2T priority patent/DE112015005593B4/de
Publication of JP2016146398A publication Critical patent/JP2016146398A/ja
Publication of JP2016146398A5 publication Critical patent/JP2016146398A5/ja
Application granted granted Critical
Publication of JP6276721B2 publication Critical patent/JP6276721B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2015022257A 2015-02-06 2015-02-06 パワーモジュール Active JP6276721B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015022257A JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール
US15/541,861 US9960147B2 (en) 2015-02-06 2015-12-10 Power module
PCT/JP2015/084685 WO2016125390A1 (ja) 2015-02-06 2015-12-10 パワーモジュール
CN201580071664.XA CN107112319B (zh) 2015-02-06 2015-12-10 功率模块
DE112015005593.2T DE112015005593B4 (de) 2015-02-06 2015-12-10 Leistungsmodul

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015022257A JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール

Publications (3)

Publication Number Publication Date
JP2016146398A JP2016146398A (ja) 2016-08-12
JP2016146398A5 JP2016146398A5 (https=) 2017-02-09
JP6276721B2 true JP6276721B2 (ja) 2018-02-07

Family

ID=56563747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015022257A Active JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール

Country Status (5)

Country Link
US (1) US9960147B2 (https=)
JP (1) JP6276721B2 (https=)
CN (1) CN107112319B (https=)
DE (1) DE112015005593B4 (https=)
WO (1) WO2016125390A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020240866A1 (ja) * 2019-05-31 2020-12-03 Ｊｘ金属株式会社 半導体デバイス
CN112151565B (zh) * 2019-06-27 2023-01-24 成都辰显光电有限公司 微发光二极管显示面板的制造方法
CN111524883B (zh) 2020-04-29 2022-09-20 业成科技（成都）有限公司 膜内电子组件及其制备方法
JP7356402B2 (ja) 2020-05-18 2023-10-04 日立Astemo株式会社 パワーモジュール

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935803A (en) 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
DE19750073A1 (de) 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
US6427901B2 (en) 1999-06-30 2002-08-06 Lucent Technologies Inc. System and method for forming stable solder bonds
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
JP2003100983A (ja) 2001-09-21 2003-04-04 Kyocera Corp セラミック回路基板
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP4302607B2 (ja) 2004-01-30 2009-07-29 株式会社デンソー 半導体装置
DE102006058695B4 (de) 2006-12-13 2009-06-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelötetem Anschlusselement
JP5446863B2 (ja) 2007-08-23 2014-03-19 株式会社大真空 電子部品用パッケージ及び電子部品用パッケージのベース
EP2720263A4 (en) 2011-06-09 2015-04-22 Mitsubishi Electric Corp SEMICONDUCTOR COMPONENT
JP2013069825A (ja) * 2011-09-22 2013-04-18 Hitachi Automotive Systems Ltd 両面冷却型半導体パワーモジュール
DE102011086687A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter
JP6150375B2 (ja) * 2012-12-06 2017-06-21 ルネサスエレクトロニクス株式会社 半導体装置
JP6112077B2 (ja) * 2014-07-03 2017-04-12 トヨタ自動車株式会社 半導体装置
TWI595810B (zh) * 2015-05-22 2017-08-11 欣興電子股份有限公司 封裝結構及其製作方法

Also Published As

Publication number Publication date
WO2016125390A1 (ja) 2016-08-11
US20180005986A1 (en) 2018-01-04
JP2016146398A (ja) 2016-08-12
CN107112319A (zh) 2017-08-29
CN107112319B (zh) 2019-07-02
DE112015005593B4 (de) 2025-03-06
US9960147B2 (en) 2018-05-01
DE112015005593T5 (de) 2017-09-28

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