JP6834673B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
- Publication number
- JP6834673B2 JP6834673B2 JP2017061590A JP2017061590A JP6834673B2 JP 6834673 B2 JP6834673 B2 JP 6834673B2 JP 2017061590 A JP2017061590 A JP 2017061590A JP 2017061590 A JP2017061590 A JP 2017061590A JP 6834673 B2 JP6834673 B2 JP 6834673B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat radiating
- semiconductor
- signal
- radiating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 131
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000005476 soldering Methods 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
12:半導体素子
12a:第1主電極
12b:第2主電極
12c:信号パッド
12d:半導体基板
14:封止樹脂
16:第1放熱板
18:第2放熱板
20:信号用端子
22:位置決めガイド
30:リードフレーム
40:主端子
40a:主端子の一つである中間端子
40b:主端子の一つである正極端子
40c:主端子の一つである負極端子
Claims (1)
- 信号パッドを有する半導体素子と、
前記半導体素子を封止する封止樹脂と、
前記封止樹脂によって保持されているとともに、前記半導体素子を挟んで互いに対向する一対の放熱板と、
前記信号パッドに電気的に接続されているとともに、前記封止樹脂の外部まで一体で延びる信号用端子と、
前記一対の放熱板の一方に設けられており、前記信号用端子を保持するとともに前記半導体素子に当接する絶縁性の位置決めガイドと、を備え、
前記信号用端子が、前記信号パッドに接触している、又は、はんだ付けされている、
半導体モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017061590A JP6834673B2 (ja) | 2017-03-27 | 2017-03-27 | 半導体モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017061590A JP6834673B2 (ja) | 2017-03-27 | 2017-03-27 | 半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018164050A JP2018164050A (ja) | 2018-10-18 |
JP6834673B2 true JP6834673B2 (ja) | 2021-02-24 |
Family
ID=63861173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017061590A Active JP6834673B2 (ja) | 2017-03-27 | 2017-03-27 | 半導体モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6834673B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024157458A1 (ja) * | 2023-01-27 | 2024-08-02 | 日立Astemo株式会社 | 半導体装置、電力変換装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040080028A1 (en) * | 2002-09-05 | 2004-04-29 | Kabushiki Kaisha Toshiba | Semiconductor device with semiconductor chip mounted in package |
JP2005150596A (ja) * | 2003-11-19 | 2005-06-09 | Nissan Motor Co Ltd | 半導体装置及びその製造方法 |
JP2007059860A (ja) * | 2004-11-30 | 2007-03-08 | Toshiba Corp | 半導体パッケージ及び半導体モジュール |
JP4449724B2 (ja) * | 2004-12-08 | 2010-04-14 | 株式会社デンソー | 半導体モジュール |
JP5201085B2 (ja) * | 2009-06-10 | 2013-06-05 | 日産自動車株式会社 | 半導体装置 |
JP5054755B2 (ja) * | 2009-12-28 | 2012-10-24 | 株式会社日立製作所 | 半導体装置 |
WO2013005474A1 (ja) * | 2011-07-04 | 2013-01-10 | 本田技研工業株式会社 | 半導体装置 |
JP2013065620A (ja) * | 2011-09-15 | 2013-04-11 | Sumitomo Electric Ind Ltd | 配線シート付き電極端子、配線構造体、半導体装置、およびその半導体装置の製造方法 |
JP2013084809A (ja) * | 2011-10-11 | 2013-05-09 | Sumitomo Electric Ind Ltd | 配線シート付き配線体、半導体装置、およびその半導体装置の製造方法 |
WO2015045648A1 (ja) * | 2013-09-30 | 2015-04-02 | 富士電機株式会社 | 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール |
-
2017
- 2017-03-27 JP JP2017061590A patent/JP6834673B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018164050A (ja) | 2018-10-18 |
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