CN107112319B - 功率模块 - Google Patents

功率模块 Download PDF

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Publication number
CN107112319B
CN107112319B CN201580071664.XA CN201580071664A CN107112319B CN 107112319 B CN107112319 B CN 107112319B CN 201580071664 A CN201580071664 A CN 201580071664A CN 107112319 B CN107112319 B CN 107112319B
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CN
China
Prior art keywords
semiconductor chip
solder
sides
power module
fillets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580071664.XA
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English (en)
Chinese (zh)
Other versions
CN107112319A (zh
Inventor
山下志郎
高木佑辅
志村隆弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of CN107112319A publication Critical patent/CN107112319A/zh
Application granted granted Critical
Publication of CN107112319B publication Critical patent/CN107112319B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201580071664.XA 2015-02-06 2015-12-10 功率模块 Active CN107112319B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-022257 2015-02-06
JP2015022257A JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール
PCT/JP2015/084685 WO2016125390A1 (ja) 2015-02-06 2015-12-10 パワーモジュール

Publications (2)

Publication Number Publication Date
CN107112319A CN107112319A (zh) 2017-08-29
CN107112319B true CN107112319B (zh) 2019-07-02

Family

ID=56563747

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580071664.XA Active CN107112319B (zh) 2015-02-06 2015-12-10 功率模块

Country Status (5)

Country Link
US (1) US9960147B2 (https=)
JP (1) JP6276721B2 (https=)
CN (1) CN107112319B (https=)
DE (1) DE112015005593B4 (https=)
WO (1) WO2016125390A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020240866A1 (ja) * 2019-05-31 2020-12-03 Ｊｘ金属株式会社 半導体デバイス
CN112151565B (zh) * 2019-06-27 2023-01-24 成都辰显光电有限公司 微发光二极管显示面板的制造方法
CN111524883B (zh) 2020-04-29 2022-09-20 业成科技（成都）有限公司 膜内电子组件及其制备方法
JP7356402B2 (ja) 2020-05-18 2023-10-04 日立Astemo株式会社 パワーモジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
CN101790787A (zh) * 2007-08-23 2010-07-28 株式会社大真空 电子部件用封装、电子部件用封装的基底、以及电子部件用封装与电路基板的接合结构
JP2013069825A (ja) * 2011-09-22 2013-04-18 Hitachi Automotive Systems Ltd 両面冷却型半導体パワーモジュール
CN103855137A (zh) * 2012-12-06 2014-06-11 瑞萨电子株式会社 半导体器件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935803A (en) 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
DE19750073A1 (de) 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
US6427901B2 (en) 1999-06-30 2002-08-06 Lucent Technologies Inc. System and method for forming stable solder bonds
JP2003100983A (ja) 2001-09-21 2003-04-04 Kyocera Corp セラミック回路基板
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP4302607B2 (ja) 2004-01-30 2009-07-29 株式会社デンソー 半導体装置
DE102006058695B4 (de) 2006-12-13 2009-06-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelötetem Anschlusselement
EP2720263A4 (en) 2011-06-09 2015-04-22 Mitsubishi Electric Corp SEMICONDUCTOR COMPONENT
DE102011086687A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter
JP6112077B2 (ja) * 2014-07-03 2017-04-12 トヨタ自動車株式会社 半導体装置
TWI595810B (zh) * 2015-05-22 2017-08-11 欣興電子股份有限公司 封裝結構及其製作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
CN101790787A (zh) * 2007-08-23 2010-07-28 株式会社大真空 电子部件用封装、电子部件用封装的基底、以及电子部件用封装与电路基板的接合结构
JP2013069825A (ja) * 2011-09-22 2013-04-18 Hitachi Automotive Systems Ltd 両面冷却型半導体パワーモジュール
CN103855137A (zh) * 2012-12-06 2014-06-11 瑞萨电子株式会社 半导体器件

Also Published As

Publication number Publication date
WO2016125390A1 (ja) 2016-08-11
JP6276721B2 (ja) 2018-02-07
US20180005986A1 (en) 2018-01-04
JP2016146398A (ja) 2016-08-12
CN107112319A (zh) 2017-08-29
DE112015005593B4 (de) 2025-03-06
US9960147B2 (en) 2018-05-01
DE112015005593T5 (de) 2017-09-28

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Address after: Ibaraki

Patentee after: Hitachi astemo Co.,Ltd.

Address before: Ibaraki

Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd.