DE112015005593B4 - Leistungsmodul - Google Patents

Leistungsmodul Download PDF

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Publication number
DE112015005593B4
DE112015005593B4 DE112015005593.2T DE112015005593T DE112015005593B4 DE 112015005593 B4 DE112015005593 B4 DE 112015005593B4 DE 112015005593 T DE112015005593 T DE 112015005593T DE 112015005593 B4 DE112015005593 B4 DE 112015005593B4
Authority
DE
Germany
Prior art keywords
edge
semiconductor chip
solder
semiconductor chips
fillets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112015005593.2T
Other languages
German (de)
English (en)
Other versions
DE112015005593T5 (de
Inventor
Shiro Yamashita
Yusuke Takagi
Takahiro Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of DE112015005593T5 publication Critical patent/DE112015005593T5/de
Application granted granted Critical
Publication of DE112015005593B4 publication Critical patent/DE112015005593B4/de
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112015005593.2T 2015-02-06 2015-12-10 Leistungsmodul Active DE112015005593B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-022257 2015-02-06
JP2015022257A JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール
PCT/JP2015/084685 WO2016125390A1 (ja) 2015-02-06 2015-12-10 パワーモジュール

Publications (2)

Publication Number Publication Date
DE112015005593T5 DE112015005593T5 (de) 2017-09-28
DE112015005593B4 true DE112015005593B4 (de) 2025-03-06

Family

ID=56563747

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112015005593.2T Active DE112015005593B4 (de) 2015-02-06 2015-12-10 Leistungsmodul

Country Status (5)

Country Link
US (1) US9960147B2 (https=)
JP (1) JP6276721B2 (https=)
CN (1) CN107112319B (https=)
DE (1) DE112015005593B4 (https=)
WO (1) WO2016125390A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020240866A1 (ja) * 2019-05-31 2020-12-03 Ｊｘ金属株式会社 半導体デバイス
CN112151565B (zh) * 2019-06-27 2023-01-24 成都辰显光电有限公司 微发光二极管显示面板的制造方法
CN111524883B (zh) 2020-04-29 2022-09-20 业成科技（成都）有限公司 膜内电子组件及其制备方法
JP7356402B2 (ja) 2020-05-18 2023-10-04 日立Astemo株式会社 パワーモジュール

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935803A (en) 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
DE19750073A1 (de) 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
US20010010323A1 (en) 1999-06-30 2001-08-02 Dautartas Mindaugas F. System and method for forming stable solder bonds
JP2003100983A (ja) 2001-09-21 2003-04-04 Kyocera Corp セラミック回路基板
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP2005244166A (ja) 2004-01-30 2005-09-08 Denso Corp 半導体装置
DE102006058695A1 (de) 2006-12-13 2008-06-26 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelötetem Anschlusselement
DE102011086687A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter
US20130307130A1 (en) 2011-06-09 2013-11-21 Mitsubishi Electric Corporation Semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
JP5446863B2 (ja) 2007-08-23 2014-03-19 株式会社大真空 電子部品用パッケージ及び電子部品用パッケージのベース
JP2013069825A (ja) * 2011-09-22 2013-04-18 Hitachi Automotive Systems Ltd 両面冷却型半導体パワーモジュール
JP6150375B2 (ja) * 2012-12-06 2017-06-21 ルネサスエレクトロニクス株式会社 半導体装置
JP6112077B2 (ja) * 2014-07-03 2017-04-12 トヨタ自動車株式会社 半導体装置
TWI595810B (zh) * 2015-05-22 2017-08-11 欣興電子股份有限公司 封裝結構及其製作方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935803A (en) 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
DE19750073A1 (de) 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
US20010010323A1 (en) 1999-06-30 2001-08-02 Dautartas Mindaugas F. System and method for forming stable solder bonds
JP2003100983A (ja) 2001-09-21 2003-04-04 Kyocera Corp セラミック回路基板
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP2005244166A (ja) 2004-01-30 2005-09-08 Denso Corp 半導体装置
DE102006058695A1 (de) 2006-12-13 2008-06-26 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelötetem Anschlusselement
US20130307130A1 (en) 2011-06-09 2013-11-21 Mitsubishi Electric Corporation Semiconductor device
DE102011086687A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter

Also Published As

Publication number Publication date
WO2016125390A1 (ja) 2016-08-11
JP6276721B2 (ja) 2018-02-07
US20180005986A1 (en) 2018-01-04
JP2016146398A (ja) 2016-08-12
CN107112319A (zh) 2017-08-29
CN107112319B (zh) 2019-07-02
US9960147B2 (en) 2018-05-01
DE112015005593T5 (de) 2017-09-28

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R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: HITACHI ASTEMO, LTD., HITACHINAKA-SHI, JP

Free format text: FORMER OWNER: HITACHI AUTOMOTIVE SYSTEMS, LTD., HITACHINAKA-SHI, IBARAKI, JP

R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000

R018 Grant decision by examination section/examining division
R020 Patent grant now final