JP6255187B2 - シリコン酸化膜をエッチングする方法 - Google Patents

シリコン酸化膜をエッチングする方法 Download PDF

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Publication number
JP6255187B2
JP6255187B2 JP2013170218A JP2013170218A JP6255187B2 JP 6255187 B2 JP6255187 B2 JP 6255187B2 JP 2013170218 A JP2013170218 A JP 2013170218A JP 2013170218 A JP2013170218 A JP 2013170218A JP 6255187 B2 JP6255187 B2 JP 6255187B2
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Japan
Prior art keywords
film
etching
silicon oxide
oxide film
mask
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Expired - Fee Related
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JP2013170218A
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English (en)
Japanese (ja)
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JP2015041624A (ja
JP2015041624A5 (https=
Inventor
小笠原　正宏
正宏 小笠原
理史 浦川
理史 浦川
欣延 早川
欣延 早川
久保田　和宏
和宏 久保田
光 渡邉
光 渡邉
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Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2013170218A priority Critical patent/JP6255187B2/ja
Priority to US14/462,658 priority patent/US9257301B2/en
Priority to KR1020140107884A priority patent/KR102175860B1/ko
Publication of JP2015041624A publication Critical patent/JP2015041624A/ja
Publication of JP2015041624A5 publication Critical patent/JP2015041624A5/ja
Application granted granted Critical
Publication of JP6255187B2 publication Critical patent/JP6255187B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
    • H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
    • H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
    • H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
    • H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
    • H10P50/268—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas of silicon-containing layers

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  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
JP2013170218A 2013-08-20 2013-08-20 シリコン酸化膜をエッチングする方法 Expired - Fee Related JP6255187B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013170218A JP6255187B2 (ja) 2013-08-20 2013-08-20 シリコン酸化膜をエッチングする方法
US14/462,658 US9257301B2 (en) 2013-08-20 2014-08-19 Method of etching silicon oxide film
KR1020140107884A KR102175860B1 (ko) 2013-08-20 2014-08-19 실리콘 산화막을 에칭하는 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013170218A JP6255187B2 (ja) 2013-08-20 2013-08-20 シリコン酸化膜をエッチングする方法

Publications (3)

Publication Number Publication Date
JP2015041624A JP2015041624A (ja) 2015-03-02
JP2015041624A5 JP2015041624A5 (https=) 2016-07-07
JP6255187B2 true JP6255187B2 (ja) 2017-12-27

Family

ID=52480741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013170218A Expired - Fee Related JP6255187B2 (ja) 2013-08-20 2013-08-20 シリコン酸化膜をエッチングする方法

Country Status (3)

Country Link
US (1) US9257301B2 (https=)
JP (1) JP6255187B2 (https=)
KR (1) KR102175860B1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6449674B2 (ja) * 2015-02-23 2019-01-09 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP2016157793A (ja) * 2015-02-24 2016-09-01 東京エレクトロン株式会社 エッチング方法
KR20160116915A (ko) * 2015-03-31 2016-10-10 삼성전자주식회사 반도체 소자 제조 방법
JP6604738B2 (ja) 2015-04-10 2019-11-13 東京エレクトロン株式会社 プラズマエッチング方法、パターン形成方法及びクリーニング方法
US9865471B2 (en) * 2015-04-30 2018-01-09 Tokyo Electron Limited Etching method and etching apparatus
JP6494424B2 (ja) * 2015-05-29 2019-04-03 東京エレクトロン株式会社 エッチング方法
US10586710B2 (en) * 2017-09-01 2020-03-10 Tokyo Electron Limited Etching method
JP7190940B2 (ja) 2019-03-01 2022-12-16 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP7402715B2 (ja) * 2020-03-06 2023-12-21 東京エレクトロン株式会社 ウエハを処理する方法
KR102880180B1 (ko) 2020-07-07 2025-11-03 도쿄엘렉트론가부시키가이샤 엣지 링 및 에칭 장치
WO2023238235A1 (ja) * 2022-06-07 2023-12-14 株式会社日立ハイテク プラズマ処理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960000375B1 (ko) * 1991-01-22 1996-01-05 가부시끼가이샤 도시바 반도체장치의 제조방법
US5314576A (en) * 1992-06-09 1994-05-24 Sony Corporation Dry etching method using (SN)x protective layer
JPH06237136A (ja) * 1993-02-09 1994-08-23 Murata Mfg Co Ltd 電子部品素子の製造方法
JP2984539B2 (ja) * 1994-04-19 1999-11-29 日本電気株式会社 酸化シリコン膜のドライエッチング方法
JP3524763B2 (ja) * 1998-05-12 2004-05-10 株式会社日立製作所 エッチング方法
JP3742243B2 (ja) * 1999-03-16 2006-02-01 株式会社東芝 ドライエッチング方法および半導体装置の製造方法
JP2001015479A (ja) * 1999-06-29 2001-01-19 Toshiba Corp 半導体装置の製造方法
TWI276153B (en) * 2001-11-12 2007-03-11 Hynix Semiconductor Inc Method for fabricating semiconductor device
US7977390B2 (en) 2002-10-11 2011-07-12 Lam Research Corporation Method for plasma etching performance enhancement
TWI250558B (en) * 2003-10-23 2006-03-01 Hynix Semiconductor Inc Method for fabricating semiconductor device with fine patterns
KR100704470B1 (ko) * 2004-07-29 2007-04-10 주식회사 하이닉스반도체 비결정성 탄소막을 희생 하드마스크로 이용하는반도체소자 제조 방법
KR100699865B1 (ko) * 2005-09-28 2007-03-28 삼성전자주식회사 화학기계적 연마를 이용한 자기 정렬 콘택 패드 형성 방법
JP5461759B2 (ja) 2006-03-22 2014-04-02 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法及び記憶媒体
JP2009267432A (ja) * 2009-06-29 2009-11-12 Elpida Memory Inc 半導体集積回路装置の製造方法
JP5568340B2 (ja) * 2010-03-12 2014-08-06 東京エレクトロン株式会社 プラズマエッチング方法及びプラズマエッチング装置

Also Published As

Publication number Publication date
KR102175860B1 (ko) 2020-11-06
KR20150021475A (ko) 2015-03-02
US9257301B2 (en) 2016-02-09
US20150056808A1 (en) 2015-02-26
JP2015041624A (ja) 2015-03-02

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