JP6252022B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6252022B2
JP6252022B2 JP2013162289A JP2013162289A JP6252022B2 JP 6252022 B2 JP6252022 B2 JP 6252022B2 JP 2013162289 A JP2013162289 A JP 2013162289A JP 2013162289 A JP2013162289 A JP 2013162289A JP 6252022 B2 JP6252022 B2 JP 6252022B2
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Japan
Prior art keywords
diffusion layer
contact holes
contact
type
pitch
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JP2013162289A
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English (en)
Japanese (ja)
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JP2015032733A (ja
JP2015032733A5 (enExample
Inventor
和伸 桑澤
和伸 桑澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013162289A priority Critical patent/JP6252022B2/ja
Priority to US14/449,806 priority patent/US9012991B2/en
Priority to CN201410380207.6A priority patent/CN104347719B/zh
Publication of JP2015032733A publication Critical patent/JP2015032733A/ja
Publication of JP2015032733A5 publication Critical patent/JP2015032733A5/ja
Application granted granted Critical
Publication of JP6252022B2 publication Critical patent/JP6252022B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65—Lateral DMOS [LDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149—Source or drain regions of field-effect devices
    • H10D62/151—Source or drain regions of field-effect devices of IGFETs 
    • H10D62/152—Source regions of DMOS transistors
    • H10D62/155—Shapes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393—Body regions of DMOS transistors or IGBTs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H10D62/116—Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2013162289A 2013-08-05 2013-08-05 半導体装置 Active JP6252022B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013162289A JP6252022B2 (ja) 2013-08-05 2013-08-05 半導体装置
US14/449,806 US9012991B2 (en) 2013-08-05 2014-08-01 Semiconductor device
CN201410380207.6A CN104347719B (zh) 2013-08-05 2014-08-04 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013162289A JP6252022B2 (ja) 2013-08-05 2013-08-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2015032733A JP2015032733A (ja) 2015-02-16
JP2015032733A5 JP2015032733A5 (enExample) 2016-05-19
JP6252022B2 true JP6252022B2 (ja) 2017-12-27

Family

ID=52426889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013162289A Active JP6252022B2 (ja) 2013-08-05 2013-08-05 半導体装置

Country Status (3)

Country Link
US (1) US9012991B2 (enExample)
JP (1) JP6252022B2 (enExample)
CN (1) CN104347719B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102450572B1 (ko) * 2015-10-13 2022-10-11 삼성전자주식회사 메모리 장치
US9449986B1 (en) * 2015-10-13 2016-09-20 Samsung Electronics Co., Ltd. 3-dimensional memory device having peripheral circuit devices having source/drain contacts with different spacings
EP3319127B1 (en) * 2016-11-07 2020-12-30 ams AG Field effect transistor device with separate source and body contacts and method of producing the device
JP6971877B2 (ja) * 2018-02-20 2021-11-24 ルネサスエレクトロニクス株式会社 半導体装置
JP6892889B2 (ja) * 2019-04-15 2021-06-23 合肥晶合集成電路股▲ふん▼有限公司 高耐圧半導体素子及びその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719642B2 (ja) 2000-03-01 2005-11-24 松下電器産業株式会社 半導体装置
JP2002064206A (ja) 2000-06-09 2002-02-28 Toshiba Corp 半導体装置及びその製造方法
JP3524850B2 (ja) 2000-08-03 2004-05-10 三洋電機株式会社 絶縁ゲート型電界効果半導体装置
TW594993B (en) 2001-02-16 2004-06-21 Sanyo Electric Co Semiconductor device and manufacturing process therefor
JP4454921B2 (ja) * 2002-09-27 2010-04-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR100514181B1 (ko) * 2003-09-03 2005-09-13 삼성에스디아이 주식회사 시리즈 박막트랜지스터, 그를 이용한 능동 매트릭스유기전계발광소자 및 상기 능동 매트릭스유기전계발광소자의 제조방법
KR100648276B1 (ko) * 2004-12-15 2006-11-23 삼성전자주식회사 역방향 다이오드가 구비된 수직형 디모스 소자
JP2006245548A (ja) * 2005-02-01 2006-09-14 Toshiba Corp 半導体装置
JP4840738B2 (ja) * 2005-03-15 2011-12-21 株式会社デンソー 半導体装置とその製造方法
US7535057B2 (en) * 2005-05-24 2009-05-19 Robert Kuo-Chang Yang DMOS transistor with a poly-filled deep trench for improved performance
JP4630207B2 (ja) * 2006-03-15 2011-02-09 シャープ株式会社 半導体装置
CN200969352Y (zh) * 2006-04-24 2007-10-31 Bcd半导体制造有限公司 横向dmos结构
JP2007053399A (ja) 2006-10-18 2007-03-01 Sanyo Electric Co Ltd 半導体装置
US7851889B2 (en) * 2007-04-30 2010-12-14 Freescale Semiconductor, Inc. MOSFET device including a source with alternating P-type and N-type regions
US7781834B2 (en) * 2007-07-03 2010-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Robust ESD LDMOS device
JP2009164417A (ja) 2008-01-08 2009-07-23 Panasonic Corp 半導体装置
JP2009231443A (ja) 2008-03-21 2009-10-08 Oki Semiconductor Co Ltd 高耐圧半導体デバイス、及び高耐圧半導体デバイスの製造方法
JP4587003B2 (ja) 2008-07-03 2010-11-24 セイコーエプソン株式会社 半導体装置
US8482065B2 (en) * 2008-11-25 2013-07-09 Newport Fab, Llc MOS transistor with a reduced on-resistance and area product
JP5150675B2 (ja) * 2010-03-25 2013-02-20 株式会社東芝 半導体装置
JP5455801B2 (ja) * 2010-06-10 2014-03-26 株式会社東芝 半導体装置
JP5700649B2 (ja) * 2011-01-24 2015-04-15 旭化成エレクトロニクス株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
US9012991B2 (en) 2015-04-21
CN104347719A (zh) 2015-02-11
JP2015032733A (ja) 2015-02-16
US20150035056A1 (en) 2015-02-05
CN104347719B (zh) 2018-09-28

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